Stacked configuration for integrated circuit devices

• US 5,117,282 A
• Filed: 10/29/1990
• Issued: 05/26/1992
• Est. Priority Date: 10/29/1990
• Status: Expired due to Term

• Current Assignee: Intersil Corporation (Renesas Electronics Corporation)
• Original Assignee: Harris Corporation (L3Harris Technologies, Inc.)
• Inventors: Salatino, Matthew M.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): Nguyen, Viet Q.
• Application Number:
  US07/604,883
• Time in Patent Office: 575 Days
• Field of Search: 357/70, 357/81, 357/74, 357/72, 357/79, 357/78, 361/398
• US Class Current: 257/686
• CPC Class Codes: H01L 2924/1627 stacked type assemblies, e.g. stacked multi-cavities
• CPC Class Codes: H05K 1/0393 Flexible materials H05K1/038 takes precedence; specific organic compositions are classified in H05K1/0313 and subgroups
• CPC Class Codes: H05K 1/05 Insulated conductive substrates, e.g. insulated metal substrate
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
• CPC Class Codes: H05K 1/189 characterised by the use of a flexible or folded printed circuit H05K3/326 takes precedence
• CPC Class Codes: H05K 2201/042 Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
• CPC Class Codes: H05K 2201/052 Branched
• CPC Class Codes: H05K 2201/055 Folded back on itself
• CPC Class Codes: H05K 2201/09063 Holes or slots in insulating substrate not used for electrical connections
• CPC Class Codes: H05K 2201/10015 Non-printed capacitor
• CPC Class Codes: H05K 2201/10651 Component having two leads, e.g. resistor, capacitor
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 2201/2009 Reinforced areas, e.g. for a specific part of a flexible printed circuit
• CPC Class Codes: H05K 3/0058 Laminating printed circuit boards onto other substrates, e.g. metallic substrates H05K1/0281 takes precedence
• CPC Class Codes: H05K 3/3421 Leaded components
• CPC Class Codes: H05K 7/023 Stackable modules
• CPC Class Codes: H05K 7/20509 Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures

Abstract

A stacked packaging assembly for a plurality of integrated circuit devices employs a web of flexible interconnect material folded into a `layered` arrangement of parallel web fingers onto which a plurality of integrated circuit devices are surface-mounted. The leads of the integrated circuit devices are attached to interconnect links of the flexible interconnect web. A plurality of heat sink plates are interleaved with the folded web fingers of the stack, so as to engage the integrated circuit devices mounted on the web fingers. The heat sink plates are retained by thermally conductive spacer blocks along their edges. The spacer blocks are clamped together in a compact laminate structure, so as to form a rigid support which relieves mechanical stresses at the folds of the web fingers.

Claims

1. An integrated circuit packaging assembly comprising:

an interconnect substrate in the form of a flexible interconnect circuit web having plurality of finger portions, at least respective one of said finger portions having an aperture therethrough sized to accommodate an integrated circuit device, a respective integrated circuit device passing through and thereby being captured within the aperture of said at least a respective finger portion and having leads extending from a first surface of said respective integrated circuit device and being attached to interconnect links on an adjacent first surface of said at least respective one of said finger portions, and wherein said finger portions are folded together in the form of a stack; and

a plurality of heat sinks interleaved with the folded finger portions such that a respective heat sink engages and is in thermal contact with a second surface of a respective captured integrated circuit device adjacent to a second surface of a respective folded finger portion.

2. A device according to claim 1, wherein said heat sinks are secured together to form a support structure which relieves mechanical tresses at folds of said finger portions.

3. A device according to claim 2, wherein said heat sinks are secured together by spacer members to which said heat sinks are attached and wherein said spacer members are secured together as a stacked structure.

4. A device according to claim 3, wherein said finger portions and said heat sinks contain mutually engageable alignment elements and wherein an alignment element of a respective heat sink engages an alignment element of a respective finger portion.

5. A device according to claim 1, wherein said flexible interconnect circuit web has plurality of spaced apart finger portions arranged parallel to one another and folded such that said finger portions overlie one another as parallel flexible interconnect web finger portions spaced apart from one another by folds in said flexible interconnect web.

6. A device according to claim 1, wherein said flexible interconnect circuit web has a first web portion, from one side of which a first plurality of spaced apart finger portions extend parallel to one another, and from another side of which a second plurality of spaced apart finger portions extend parallel to one another and to said first plurality of finger portions, said second finger portions being longer than said first finger portions, said second finger portions being folded across said first web portion of said flexible interconnect web, such that said second finger portions are interleaved with said first finger portions along said one side of said flexible interconnect web, and said first and second finger portions being folded in the form of a stack of parallel flexible interconnect web fingers spaced apart from one another by folds therebetween.

7. A device according to claim 1, wherein said first and second pluralities of spaced apart finger portions include chip capacitor mounting regions for receiving chip capacitors, and wherein chip capacitors are surface mounted at the chip capacitor mounting regions thereof such that leads of said chip capacitors are connected to interconnect links of said finger portions.

8. A device according to claim 7, wherein those heat sinks that engage chip capacitors mounted at said chip capacitor mounting regions have corresponding chip capacitor openings for accommodating said mounted chip capacitors.