Electrical circuit device with different types of conductor paths

• US 5,117,300 A
• Filed: 03/29/1990
• Issued: 05/26/1992
• Est. Priority Date: 04/05/1989
• Status: Expired due to Fees

• Current Assignee: Licentia Patent-Verwaltungs-GmbH (AB Electrolux)
• Original Assignee: Licentia Patent-Verwaltungs-GmbH (AB Electrolux)
• Inventors: Wiemer, Wolfram
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): Ho, Tan
• Application Number:
  US07/501,042
• Time in Patent Office: 789 Days
• Field of Search: 350/336, 350/332, 350/331 R, 350/339 R, 350/334
• US Class Current: 349/150
• CPC Class Codes: G02F 1/13452 Conductors connecting driver circuitry and terminals of panels
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/09 Use of materials for the conductive, e.g. metallic pattern
• CPC Class Codes: H05K 2201/0326 Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/0391 Using different types of conductors
• CPC Class Codes: H05K 3/20 by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/323 by applying an anisotropic conductive adhesive layer over an array of pads
• CPC Class Codes: H05K 3/361 Assembling flexible printed circuits with other printed circuits
• CPC Class Codes: H05K 3/386 by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

An electrical device including a glass substrate, an intrgrated circuit chip, an electrical device and electrical conductor paths applied to the surface of the glass substrate and connected to electrical terminals of the integrated circuit chip and the electrical device. The conductor paths are divided into supply conductor paths for supplying voltage to the integrated circuit chip and actuation conductor paths for actuating the electronic device. The actuation conductor paths are composed of layers of indium tin oxide deposited on the glass surface and the supply conductor paths are composed of metal films glued on the glass surface.

Claims

1. An electrical circuit device, including:

a glass substrate having a surface;

an integrated circuit chip with electrical terminals;

an electrical device with electrical terminals and disposed on the same surface of the glass substrate as the integrated circuit chip; and

electrical conductor paths applied to the surface of the glass substrate and connected to the electrical terminals of the integrated circuit chip and the electrical device, wherein said conductor paths include supply conductor paths connected to the terminals of the integrated circuit chip for supplying voltage to the integrated circuit chip and actuation conductor paths connected between the terminals of the integrated circuit chip and the electrical device for actuating the electrical device, and said actuation conductor paths comprise layers of indium tin oxide deposited on the surface of the glass substrate and said supply conductor paths comprise metal films glued on the surface of the glass substrate.

2. An electrical circuit device as defined in claim 1, further comprising an anisotropic conductive adhesive electrically connecting the electrical terminals of the integrated circuit chip to said actuation conductor paths.

3. An electrical circuit device, as defined in claim 2, wherein said anisotropic conductive adhesive comprises a hot-melting adhesive.

4. An electrical circuit device as defined in claim 1, further comprising an anisotropic conductive adhesive electrically connecting the electrical terminals of the integrated circuit chip to said supply conductor paths.

5. An electrical circuit device as defined in claim 4, wherein said anisotropic conductive adhesive comprises a hot-melting adhesive.

6. An electrical circuit device as defined in claim 1, further comprising an anisotropic adhesive for electrically connecting the electrical terminals of the integrated circuit chip to said actuating conductor paths, and wherein the electrical connection between said supply conductor paths and electrical terminals of the integrated circuit chip comprises a solder connection.

7. An electrical circuit device as defined in claim 1, further comprising a plastic sheet including conductor paths and disposed on the glass substrate, wherein the integrated circuit chip is pre-mounted on said plastic sheet and the conductor paths of said plastic sheet are electrically connected to said actuation and supply conductor paths on the surface of the glass substrate.

8. An electrical circuit device as defined in claim 1, wherein said electrical device comprises a liquid crystal cell and further including a glass cover cooperating with said glass substrate enclosing said liquid crystal cell to form a liquid crystal display device.

9. An electrical circuit device as defined in claim 1, wherein said supply conductor paths comprise metal foil paths glued onto the glass surface.

10. A circuit arrangement as defined in claim 1, and further comprising a plastic sheet, wherein said supply conductor paths comprise metallization paths applied to said plastic sheet, and said plastic sheet carrying the metallization paths is glued to the glass surface.