Coating composition

• US 5,120,578 A
• Filed: 07/29/1991
• Issued: 06/09/1992
• Est. Priority Date: 05/31/1990
• Status: Expired due to Fees

• Current Assignee: Shipley Company, Inc.
• Original Assignee: Shipley Company, Inc.
• Inventors: Chen, Jensheng, Knudsen, Philip D.
• Primary Examiner(s): LUSIGNAN, MICHAEL R
• Application Number:
  US07/737,352
• Time in Patent Office: 316 Days
• Field of Search: 106/1.25, 106/1.26, 106/1.28, 427/304-306, 427/404, 427/443.1, 361/331
• US Class Current: 427/304
• CPC Class Codes: C23C 18/30 Activating or accelerating or sensitising with palladium or other noble metal
• CPC Class Codes: H05K 3/181 by electroless plating adhesives therefor H05K3/387
• CPC Class Codes: H05K 3/387 for electroless plating H05K3/4661 takes precedence

Abstract

The invention discloses a new electroless plating catalyst and a process of using the same for selective plating. The catalyst and process are especially adapted for formation of EMI shielding for electronic components. The electroless plating catalyst comprises particulates dispersed in a liquid film forming composition which particulates are coated with a hydrous oxide that is reduced to a catalytic metal in contact with an electroless plating solution.

Claims

1. A process for electroless deposition of metal on a substrate comprising coating the substrate with a composition comprising a polymer solution having particles homogeneously dispersed therein, said particles comprising an inert particulate carrier coated with a hydrous oxide of a metal insoluble in the polymer solution that is catalytic to electroless metal deposition when in a reduced form, said hydrous oxide having a metal content of from 0.5 to 50 grams per liter of coating composition, drying the coating and contacting said treated substrate with an electroless metal plating solution.

2. The process of claim 1 including a step of baking the substrate following application of the catalyst to remove solvent and bond the catalyst to the substrate.

3. The process of claim 1 where the solvent used in the liquid film forming coating composition is a solvent that solvates the substrate.

4. The process of claim 3 where said substrate is a housing for electronic equipment.

5. The process of claim 3 where a portion of the substrate is masked before coating with the electroless plating catalyst and the mask is removed prior to electroless metal deposition to achieve selective plating.

6. The process of claim 3 where the substrate is of an ABS resin.

7. The process of claim 3 where the substrate is of a polycarbonate resin.

8. An article of manufacture comprising a housing for an electronic component and a metal coating over at least a portion thereof in a thickness adequate to inhibit emission of electromagnetic wave energy, said metal coating being bonded to said housing through an intermediate layer, said intermediate layer being the product formed by applying a coating composition to said housing comprising a polymer solution having particles homogeneously dispersed therein, said particles comprising an inert particulate carrier coated with a hydrous oxide of a metal insoluble in the polymer solution that is catalytic to electroless metal deposition when in a reduced form, said hydrous oxide having a metal content of from 0.5 to 50 grams per liter of coating composition, drying the coating composition and reducing the hydrous oxide to metal.

9. The process of claim 8 where the housing is of polycarbonate.