Field replaceable cryocooled computer logic unit
First Claim
1. A cryocooled logic unit used with an eternal cryogenic cold head comprising a thermally conductive enclosure portion disposed in thermal contact with said external cold head, a thermally insulating enclosure portion cooperating with said conductive portion to form an enclosure able to be removably mounted on said external cold head, and a semiconductor logic circuit mounted in said enclosure.
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Accused Products
Abstract
A cryocooled field-replaceable logic unit for use with a cryogenic cold head such as that of a cryocooler comprises a thermally conductive plate adapted to be disposed in thermal contact with the cold head, a thermally insulating enclosure portion cooperating with the conductive plate to form a sealed enclosure detachable from the cold head, and one or logic chips mounted in the enclosure in thermal contact with the conductive plate. Preferably the conductive plate is attached to the thermally insulating portion through a resilient mounting which forms a recess for receiving the cold head and which is tension-loaded when the logic unit is mounted on the cold head to urge the plate into intimate thermal contact with the cold head. In one embodiment the enclosure receives from an external source a supply of gaseous nitrogen which is liquified by contact with the conductive plate to form a pool of liquid nitrogen in which the logic chips are immersed. In another embodiment plural logic units are detachably mounted on passive cold heads immersed in a cryostat.
15 Citations
19 Claims
- 1. A cryocooled logic unit used with an eternal cryogenic cold head comprising a thermally conductive enclosure portion disposed in thermal contact with said external cold head, a thermally insulating enclosure portion cooperating with said conductive portion to form an enclosure able to be removably mounted on said external cold head, and a semiconductor logic circuit mounted in said enclosure.
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16. A cryocooled logic system comprising a plurality of cryogenic cold heads, a thermally conductive enclosure portion disposed in thermal contact with one of said cold heads, a thermally insulated enclosure portion cooperating with said conductive portion to form an enclosure, and a semiconductor logic circuit mounted in said enclosure, said enclosure adapted to be detachably mounted on said one of said cold heads with said conductive enclosure portion in thermal contact therewith.
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19. A cryocooling system comprising:
- a cryostat adapted to contain a pool of cryogenically chilled liquid;
a plurality of adjacently disposed cold heads having portions extending into said cryogenically cooled liquid; and
a plurality of detachably mounted logic unit enclosures, each of said logic unit enclosures having a plurality of logic circuits disposed near a thermally conductive portion, a respective said thermally conductive portion arranged to be in thermal contact with one of said cold heads when a respective said logic unit is mounted.
- a cryostat adapted to contain a pool of cryogenically chilled liquid;
Specification