Wave soldering in a protective atmosphere enclosure over a solder pot

• US 5,121,875 A
• Filed: 10/03/1991
• Issued: 06/16/1992
• Est. Priority Date: 02/22/1991
• Status: Expired due to Fees

• Current Assignee: Praxair Technology Incorporated (Linde Plc)
• Original Assignee: Union Carbide Industrial Gases Technology Corporation
• Inventors: Nowotarski, Mark S., Hagerty, Lawrence J., Diamantopoulous, David A.
• Primary Examiner(s): Heinrich, Samuel M.
• Application Number:
  US07/770,468
• Time in Patent Office: 257 Days
• Field of Search: 228/207, 228/223, 228/232, 228/219, 228/260, 228/37, 228/42
• US Class Current: 228/219
• CPC Class Codes: B23K 1/085 Wave soldering
• CPC Class Codes: B23K 35/38 Selection of media, e.g. special atmospheres for surrounding the working area
• CPC Class Codes: H05K 2203/086 Using an inert gas
• CPC Class Codes: H05K 3/3468 Applying molten solder
• CPC Class Codes: H05K 3/3489 Composition of fluxes; Methods of application thereof; Other methods of activating the contact surfaces

Abstract

A short hood for enclosing and providing a protective atmosphere over not more than the solder pot of a machine for wave soldering printed circuit boards. Other operative areas of the machine are exposed to air. The entrance and exit openings to the hood for the circuit boards are covered by electrically conductive curtains of thin material cut into vertical strips. The process employs a thin layer of no-clean flux and allows up to 5% oxygen content in the protective atmosphere.

Claims

1. A method for wave soldering metal comprising surfaces on a printed circuit board, said method comprising:

(a) applying no-clean flux to the board in air;

(b) preheating the board in air;

(c) attaching the board to a solder wave in a protective atmosphere;

(d) detaching the board from the solder wave in a controlled atmosphere;

2. The invention as in claim 1 wherein the flux is applied to provide a layer of flux not more than 4 microns thick after evaporation of solvents from the flux.

3. The invention as in claim 1 wherein the flux comprises a di-basic acid in solvent.

4. The invention as in claim 1 wherein the flux comprises adipic acid in a solvent.

5. The invention as in claim 1 wherein the flux compises adipic acid in ethyl alcohol or isopropyl alcohol.

6. The invention as in claim 1 wherein the board is preheated to a temperature in the range from 70°

C. to the melting point of the solder used.

7. The invention as in claim 1 wherein the atmosphere for attaching to and detaching from the solder wave comprises a non-oxidizing gas and not more than 5% oxygen by volume.

8. The invention as in claim 1 wherein the atmosphere for attaching to and detaching from the solder wave comprises a non-oxidizing gas and not more than 100 ppm oxygen by volume.

9. The invention as in claim 1 wherein the atmosphere for attaching to and detaching from the solder wave comprises a non-oxidizing gas and not more than 10 ppm oxygen by volume.

10. The invention as in claim 1 wherein said atmosphere for attaching to the solder wave comprises a non-oxidizing gas and not more than 5% oxygen and said atmosphere for detaching from the solder wave comprises a non-oxidizing gas and from 5 to 10% oxygen.

11. The invention as in claim 1 wherein said atmosphere for attaching to the solder wave comprises a non-oxidizing gas and not more than 100 ppm oxygen and said atmosphere for detaching from the solder wave comprises a non-oxidizing gas and from 5 to 10% oxygen.

12. The invention as in claim 1 wherein said atmosphere for attaching to the solder wave comprises a non-oxidizing gas and not more than 10 ppm oxygen and said atmosphere for detaching from the solder wave comprises a non-oxidizing gas and from 5 to 10% oxygen.

13. The invention as in claim 1 wherein the protective atmosphere for attaching to the solder includes a mono-carboxylic acid.

14. The invention as in claim 1 wherein the protective atmosphere for attaching to the solder includes formic acid.

15. The invention as in claim 1 wherein the atmosphere maintained above the board has a lower density than the atmosphere maintained below the board.

16. The invention as in claim 1 wherein said atmospheres are provided by supplying nitrogen gas containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 4,000 and 40,000.

17. The invention as in claim 1 wherein said atmospheres are provided by supplying carbon dioxide or argon gas or mixtures thereof containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 2,000 and 20,000.

18. The invention as in claim 1 wherein said steps for attaching to and detaching from a solder wave are performed by admitting the board through an inlet into a hood enclosing not more than a solder pot containing the solder wave attaching the board to and detaching the board from the solder wave within said hood;

egressing the board through an exit in said hood.

19. The invention as in claim 1 wherein said atmospheres are supplied by a first gas distributor below the board in the region of attachment of the board to the solder wave, a second gas distributor above the board in the region above the solder wave, and a third gas distributor below the board in the region of detachment of the board from the solder wave.

20. The invention as in claim 19 wherein gas is supplied to emanate in a laminar flow from at least one of said distributors.

21. The invention as in claim 18 wherein said atmospheres are provided by supplying nitrogen gas containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 5 and 50 times the curtained and uncurtained areas (in square centimeters) of both the hood entrance and exit and any other uncurtained openings including leakage openings in said hood.

22. The invention as in claim 18 wherein said atmospheres are provided by supplying carbon dioxide or argon gas or mixtures thereof containing not more than one-half the maximum oxygen concentration desired in said atmospheres at a flow rate (in normal cubic centimeters per second) of between 2.5 and 25 times the curtained and uncurtained areas (in square centimeters) of both the hood entrance and exit and any other uncurtained openings including leakage openings in said hood.

23. The invention as in claim 18 wherein said atmospheres are provided by supplying nitrogen gas at a flow rate (in normal cubic centimeters per second) of 2,000 plus between 40 and 60 times the uncurtained area (in square centimeters) in said hood times the -0.1 power of the difference between the oxygen concentration (in ppm by volume) desired in said atmospheres and the oxygen concentration (in ppm by volume) in the supplied nitrogen gas.

24. The invention as in claim 18 wherein said atmospheres are provided by supplying carbon dioxide or argon gas or mixtures thereof at a flow rate (in normal cubic centimeters per second) of 1,000 plus between 20 and 30 times the uncurtained area (in square centimeters) in said hood times the -0.1 power of the difference between the oxygen concentration (in ppm by volume) desired in said atmospheres and the oxygen concentration (in ppm by volume) in the supplied nitrogen gas.