Crash protection enclosure for solid state memory devices

• US 5,123,538 A
• Filed: 04/26/1991
• Issued: 06/23/1992
• Est. Priority Date: 04/26/1991
• Status: Expired due to Fees

• Current Assignee: Alliedsignal Inc.
• Original Assignee: Sundstrand Corporation (Raytheon Technologies Corporation d/b/a RTX)
• Inventors: Groenewegen, Johannes B.
• Primary Examiner(s): Foster, Jimmy G.
• Application Number:
  US07/691,934
• Time in Patent Office: 424 Days
• Field of Search: 174/52.2, 206/305, 206/328, 206/334, 206/521, 206/811, 220/415, 220/453, 220/468, 244/1 R, 455/96, 455/98
• US Class Current: 206/521
• CPC Class Codes: C23F 13/10 Electrodes characterised by the structure C23F13/16 takes precedence
• CPC Class Codes: H05K 5/021 specially adapted for data recorders, e.g. for flight recorders
• CPC Class Codes: H05K 5/0213 Venting apertures; Constructional details thereof
• CPC Class Codes: H05K 9/0064 Earth or grounding circuit

Abstract

A crash survivable protective enclosure for flight data recorders, cockpit voice recorders and memory devices employing a solid state memory element includes a conformal coating of air excluding plastic material around the memory element. An inner shell of metal having a low position on the periodic table in comparison to tin and copper associated with the memory element is provided to enclose the memory element and the conformal coating. Heat insulating fillers are provided around the inner metal shell which serves as a sacrificial anode when the enclosure is exposed to salt water. An outer metal shell formed of high strength material is provided around the insulating filler for resisting physical forces applied from an exterior of the protective enclosure during a crash.

Claims

1. A crash survivable protective enclosure for flight data recorders, cockpit voice recorders and memory devices employing a solid state memory element, comprising:

conformal coating means of air excluding plastic material surrounding said memory element;

inner shell means made of metal capable of acting as a sacrificial anode with respect to any tin and copper associated with said memory element when said enclosure is exposed to salt water;

first filler means around said inner shell comprising a wax-type material having a high latent heat of fusion to act as a heat sink for absorbing a high quantity of heat during a phase transition at an elevated temperature;

second filler means around said inner shell comprising a thermal insulation; and

outer shell means formed of high strength metal for resisting physical forces applied externally to said protective enclosure.

2. The protective enclosure of claim 1, wherein:

said inner shell means is formed with a vent opening and includes plug means normally closing said vent opening until said enclosure is subjected to relatively high external pressure.

3. The protective enclosure of claim 1, wherein:

said second filler means comprises a stable solid material capable of withstanding high temperatures.

4. The protective enclosure of claim 3, wherein:

said second filler means comprises a high efficiency thermal insulating material.

5. The protective enclosure of claim 4, wherein:

said second filler means surrounds said first filler means.

6. The protective enclosure of claim 1, wherein:

said inner shell means is formed of aluminum, aluminum alloy, zinc, zinc alloys or zinc plated sheet steel.

7. The protective enclosure of claim 1, wherein:

said conformal coating means is formed of acrylic resin, polyurethane resin, silicone rubber (RTV) or other silicone based compounds.

8. The protective enclosure of claim 1, wherein:

said first filler means comprises amide-type synthetic organic wax.

9. The protective enclosure of claim 1, wherein:

said first filler means comprises pentaerythritol.

10. The protective enclosure of claim 1, wherein:

said outer shell means comprises titanium alloys or stainless steel alloys.

11. A protective enclosure for electronic memory devices, comprising:

conformal coating means of plastic resin surrounding a memory device for excluding air from the vicinity thereof;

protective metal shell means enclosing said memory device and surrounding said coating means around an outer surface of said coating means, said shell means formed of metal capable of serving as a sacrificial anode with respect to any tin and copper associated with said memory element when said enclosure is subject to contact with a liquid electrolyte.

12. The enclosure of claim 11, wherein:

said metal shell means comprises a hollow vessel enclosing said memory device and coating means thereon with substantially all of the air removed from the interior of said vessel.

13. The enclosure of claim 11, wherein:

said metal shell means includes an inner surface for serving as a sacrificial anode when salt water penetrates the interior of said shell means upon immersion of said enclosure to a substantial depth in salt water.

14. The enclosure of claim 11, including:

heat insulating means around said metal shell means for limiting the temperature thereof when said enclosure is exposed to heat and high temperatures.

15. The enclosure of claim 14, wherein:

said heat insulation means includes an enclosing medium around said metal shell means having a high heat of fusion for acting as a heat sink.

16. The enclosure of claim 15, wherein:

said heat insulation means also includes a medium having a low heat conductivity to minimize heat transfer between said memory device and the exterior of said enclosure.

17. The enclosure of claim 16, including:

outer shell means around said heat insulation means for protecting said memory device against forces applied from the exterior.

18. The enclosure of claim 17, wherein:

a space is formed between said metal shell means and said outer shell means and said space is substantially filled with said heat insulation means.

19. The protective enclosure of claim 11, wherein:

said shell means includes a surface of aluminum.

20. The protective enclosure of claim 11, wherein:

said shell means includes a surface of zinc.

21. The protective enclosure of claim 11, wherein:

said shell means includes a surface of zinc and aluminum alloys.

22. The protective enclosure of claim 11, wherein:

said shell means comprises zinc plated sheet steel.

23. A protective enclosure for electronic memory devices, comprising:

conformal coating means of plastic resin surrounding a memory device for excluding air from the vicinity thereof;

protective metal shell means enclosing said memory device and surrounding said coating means around an outer surface of said coating means, said shell means formed of metal capable of serving as a sacrificial anode with respect to any tin and copper associated with said memory element when said enclosure is subject to contact with a liquid electrolyte;

said metal shell means is formed with a vent opening, and including

plug means of elastomeric material normally closing said vent opening against the ingress of substances entering exterior of said shell means.