Method of ball bonding to non-wire bonded electrodes of semiconductor devices

• US 5,124,277 A
• Filed: 01/09/1991
• Issued: 06/23/1992
• Est. Priority Date: 01/10/1990
• Status: Expired due to Fees

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Tsumura, Kiyoaki
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US07/639,237
• Time in Patent Office: 531 Days
• Field of Search: 437/209, 437/9, 437/183, 228/179, 228/904, 228/4, 228/5
• US Class Current: 438/617
• CPC Class Codes: B23K 20/007 Ball bonding
• CPC Class Codes: H01L 2224/02166 Collar structures
• CPC Class Codes: H01L 2224/023 Redistribution layers [RDL] for bonding areas
• CPC Class Codes: H01L 2224/04042 Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/05624 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/4516 Iron (Fe) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48799 Principal constituent of the connecting portion of the wire connector being Copper (Cu)
• CPC Class Codes: H01L 2224/48824 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/49175 Parallel arrangements
• CPC Class Codes: H01L 2224/78301 Capillary
• CPC Class Codes: H01L 2224/85045 using a corona discharge, e.g. electronic flame off [EFO]
• CPC Class Codes: H01L 2224/85181 : connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
• CPC Class Codes: H01L 2224/85205 : Ultrasonic bonding
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/78 : Apparatus for connecting with wire connectors
• CPC Class Codes: H01L 24/85 : using a wire connector wire bonding in general B23K20/004
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0001 : Technical content checked by a classifier
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/00015 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed as prior art
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/20107 : Temperature range 250 C=<T<300 C, 523.15K =<T< 573.15K
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: Y10S 228/904 : Wire bonding

Abstract

In an internal wire bonding section of a semiconductor device, electrodes pads (e.g., Al pads) which are not connected to leads are ball-bonded with metallic balls (e.g., Au balls) to improve moisture resistance and to thereby reduce the rate of corrosion of internal portions of the semiconductor device. The operation of the semiconductor device manufacturing apparatus for ball bonding conforms to the conventional wire bonding operation, so that the existing process can be used without significantly improving the apparatus or significantly changing the semiconductor manufacturing method.

Claims

1. A method of manufacturing a semiconductor device including a plurality of electrode pads provided on a major surface of a silicon substrate die-bonded to a die pad comprising:

(a) forming a metallic ball on an end of a thin wire passing through a capillary tip by applying a high voltage between said thin wire end and a torch rod to cause an electric discharge;

(b) press-bonding the metallic ball to one of the electrode pads not to be connected by a wire to an inner lead by clamping the thin wire with a clamper disposed on the opposite side of the capillary tip from the substrate by moving the capillary tip and the clamper toward the silicon substrate so that the metallic ball is moved to a selected electrode pad not connected to an inner lead and by applying a force and ultrasonic vibration from the capillary tip to attach the metallic ball to the electrode pad;

(c) releasing clamping of the thin wire by the clamper and moving the clamper in a reciprocating linear direction; and

(d) moving the thin wire away from the metallic ball while clamping the thin wire with the clamper to break the thin wire connected to the metallic ball, leaving a portion of the thin wire attached to the metallic ball having a length no greater than 100 microns.