Integrated circuit package with molded cell

• US 5,124,782 A
• Filed: 11/21/1990
• Issued: 06/23/1992
• Est. Priority Date: 01/26/1990
• Status: Expired due to Term

• Current Assignee: SGS Thomson Microelectronics Inc (STMicroelectronics NV)
• Original Assignee: SGS Thomson Microelectronics Inc (STMicroelectronics NV)
• Inventors: Hundt, Michael J.
• Primary Examiner(s): James, Andrew J.
• Assistant Examiner(s): WHITEHEAD JR, CARL W
• Application Number:
  US07/617,500
• Time in Patent Office: 580 Days
• Field of Search: 357/70, 357/72, 357/74, 357/80, 357/75, 368/83, 368/204, 368/276, 368/84, 361/392
• US Class Current: 257/724
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/49593 Battery in combination with a leadframe
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01014 Silicon [Si]
• CPC Class Codes: H01L 2924/01055 Cesium [Cs]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/20753 larger or equal to 30 microns less than 40 microns

Abstract

An integrated circuit package encapsulates a volatile memory chip and a backup battery for preserving data in the event of loss of main power supply. The package includes a lead frame assembly encapsulated within a body of non-conductive material, with the memory chip being mounted onto a base plate on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires are completely encapsulated within the molded package body.

Claims

1. An electronic circuit package comprising, in combination:

a molded body of insulating material;

a finger lead assembly encapsulated within said molded body of insulating material, said finger lead assembly including a coplanar array of conductive finger leads having internal end portions bordering an interconnect region within said molded body and having external pin portions projecting out of said molded body;

a base support plate disposed within the interconnect region;

said finger lead assembly including first and second conductive finger leads forming a positive interconnect lead and a negative interconnect lead, respectively, the positive and negative interconnect leads having internal end portions bordering the interconnect region and having distal end portions, respectively;

a battery having a positive axial lead and a negative axial lead encapsulated within said molded body of insulating material, the positive axial lead being electrically connected to the distal end portion of the positive interconnect lead and the negative axial lead being electrically connected to the distal end portion of the negative interconnect lead;

an integrated circuit device mounted on the base support plate and encapsulated within said molded body of insulating material, said integrated circuit device including positive and negative interconnect nodes and a plurality of input/output nodes;

multiple wire conductors connecting the integrated circuit device input/output nodes to the internal end portions of said conductive finger leads and connecting the positive and negative power nodes to the positive and negative interconnect leads, respectively; and

said integrated circuit device being mounted on said base support plate on one side of the finger lead assembly, and said battery overlying said base support plate on the opposite side of the finger lead assembly.

2. An electronic circuit package as defined in claim 1, wherein:

said base support plate is integrally formed with one of said interconnect leads.

3. An electronic circuit package as defined in claim 1, wherein said battery is characterized by an internal resistance which increase non-linearly in response to short circuit current flow.

4. An electronic circuit package as defined in claim 3, wherein said battery is rechargeable.

5. An electronic circuit package as defined in claim 1, wherein the finger lead assembly has a longitudinal axis, and said positive and negative interconnect leads extending in alignment with the longitudinal axis.

6. An electronic circuit package as defined in claim 5, said battery overlying the base support plate with its positive and negative axial leads extending substantially in parallel alignment with the longitudinal axis.

7. An electronic circuit package as defined in claim 1, said integrated circuit device being fabricated on a semiconductor chip, said chip being mounted on an electrically connected to said base support plate.

8. An electronic circuit package comprising, in combination:

a lead frame assembly including an array of conductive finger leads, one of said conductive finger leads defining a first polarity interconnect lead having a base support plate disposed within an interconnect region and one of said conductive finger leads defining an opposite polarity interconnect lead;

a backup battery having positive and negative axial power leads electrically connected to the interconnect leads, respectively;

an integrated circuit device mounted on said base support plate, said integrated circuit device having multiple input/output nodes and multiple wire conductors electrically connecting the input/output nodes to the conductive finger leads;

said integrated circuit device being mounted on the base support plate on one side of the finger lead assembly, and said battery overlying said base support plate on the opposite side of the finger lead assembly; and

,

a molded body of insulating material encapsulating said lead frame assembly, said integrated circuit device, and said backup battery.