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Integrated circuit package with molded cell

  • US 5,124,782 A
  • Filed: 11/21/1990
  • Issued: 06/23/1992
  • Est. Priority Date: 01/26/1990
  • Status: Expired due to Term
First Claim
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1. An electronic circuit package comprising, in combination:

  • a molded body of insulating material;

    a finger lead assembly encapsulated within said molded body of insulating material, said finger lead assembly including a coplanar array of conductive finger leads having internal end portions bordering an interconnect region within said molded body and having external pin portions projecting out of said molded body;

    a base support plate disposed within the interconnect region;

    said finger lead assembly including first and second conductive finger leads forming a positive interconnect lead and a negative interconnect lead, respectively, the positive and negative interconnect leads having internal end portions bordering the interconnect region and having distal end portions, respectively;

    a battery having a positive axial lead and a negative axial lead encapsulated within said molded body of insulating material, the positive axial lead being electrically connected to the distal end portion of the positive interconnect lead and the negative axial lead being electrically connected to the distal end portion of the negative interconnect lead;

    an integrated circuit device mounted on the base support plate and encapsulated within said molded body of insulating material, said integrated circuit device including positive and negative interconnect nodes and a plurality of input/output nodes;

    multiple wire conductors connecting the integrated circuit device input/output nodes to the internal end portions of said conductive finger leads and connecting the positive and negative power nodes to the positive and negative interconnect leads, respectively; and

    said integrated circuit device being mounted on said base support plate on one side of the finger lead assembly, and said battery overlying said base support plate on the opposite side of the finger lead assembly.

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