Miniaturized monolithic multi-layer capacitor and apparatus and method for making same

• US 5,125,138 A
• Filed: 01/04/1991
• Issued: 06/30/1992
• Est. Priority Date: 12/19/1983
• Status: Expired due to Term

• Current Assignee: Spectrum Control Incorporated (API Technologies Corporation)
• Original Assignee: Spectrum Control Incorporated (API Technologies Corporation)
• Inventors: Yializis, Angelo, Shaw, David G., Strycker, Donald S., Ham, Mooyoung
• Primary Examiner(s): Gorski, Joseph M.
• Application Number:
  US07/636,029
• Time in Patent Office: 543 Days
• Field of Search: 29/25.42, 118/730, 361/313, 361/323, 361/330, 361/328, 361/273, 430/283, 427/81, 427/54.1
• US Class Current: 29/25.42
• CPC Class Codes: B05D 1/60 Deposition of organic layers from vapour phase vapour phase deposition in general C23C14/00, C23C16/00
• CPC Class Codes: B05D 3/068 using ionising radiations (gamma, X, electrons)
• CPC Class Codes: B05D 7/24 for applying particular liquids or other fluent materials
• CPC Class Codes: B05D 7/56 Three layers or more
• CPC Class Codes: H01G 13/00 Apparatus specially adapted for manufacturing capacitors; Processes specially adapted for manufacturing capacitors not provided for in groups H01G4/00 - H01G11/00
• CPC Class Codes: H01G 4/306 made by thin film techniques
• CPC Class Codes: Y10T 29/435 Solid dielectric type

Abstract

A monolithic multi-layer capacitor having a central capacitively active area and two electrode joining section separated from the active area by sloped sections has dielectric layers about 1 micron thick in the active area which taper gradually to zero thickness in the sloped sections. Electrode layers in the active area have a thickness in the range from 200 to 500 Angstroms and sufficient thickness throughout the sloped sections for adequate current carrying capacity. Various acrylates are used for the dielectric layers, the number of layers ranging from a few to many thousands.

Apparatus and methods for the fabrication of such capacitors on a high speed, production scale basis employ techniques for the flash evaporation of highly reactive monomers of acrylate dielectric materials. The vapor is controllably directed to a deposition surface for condensation and subsequent curing by a field enhanced gas discharge electron beam source. The control of the dielectric vapor is accomplished by adjacent gas streams of an inert gas directed to areas of the deposition surface where deposition of the electrode material is unwanted. Monomers of the dielectric material are ultrasonically atomized in preparation for flash evaporation.

Claims

1. A high speed process for making a capacitor within a vacuum environment, the process comprising the steps of vapor depositing successive conductive layers, wherein alternate conductive layers are offset relative to intervening conductive layers to thereby define a central capacitance region of the capacitor, flash vaporizing a radiation-curable and cross-linkable material comprising a polyfunctional acrylic monomer and, vapor depositing a liquid coating of the flash-vaporized monomer on each of the conductive layers on a surface moving at a rate of from 150 feet per minute to 600 feet per minute, and thereafter subjecting the monomer coating to a radiation source capable of rapidly curing a polyfunctional acrylic monomer coating about 1 micron thick, thereby curing and crosslinking the monomer, thereby forming a cross-linked polymer dielectric layer on each such conductive layer, so that in the central capacitance region the conductive layers are spaced and separated from each other by such a polymer dielectric layer, controlling the vapor deposition of the monomer so that the polymer dielectric layers slope toward cut-off lines spaced substantially from two separated edges of the central capacitance region, thereby providing sloped regions of the dielectric layer, extending the deposition of conductive layers beyond the cut-off lines so that successive conductive layers electrically contact one another at spaced-apart terminal portions, wherein the spacing of the cut-off lines and terminal portions from the central capacitance region is sufficient so that an uppermost coating of dielectric material of a multi-layer capacitor has a horizontal dimension that permits the acceptance of a final conductive layer in the sloped regions.

2. The process of claim 1 in which the conductive layers and the polymer dielectric layers are deposited successively in long strips with edges of the strips being defined by the terminal portions, and including the step of cutting the strips into discreet capacitors.

3. The process of claim 2 including the step of connecting wire leads to the opposite terminal portions of the discreet capacitors.

4. The process of claim 1 wherein the radiation source is a gas discharge electron beam gun.

5. The process of claim 1 wherein the thickness of each of the conductive layers is such that the capacitor is self-healing.

6. The process of claim 1 wherein the thickness of each conductive layer is about the same as the thickness of each other conductive layer and is within the range of about 200 to about 500 angstroms.

7. The process of claim 1 wherein at least one hundred conductive layers, each having a polymer dielectric layer formed thereon, are vapor deposited.

8. The process of claim 1 wherein at least one thousand conductive layers, each having a polymer dielectric layer formed thereon, are vapor deposited.

9. A high speed process for making a capacitor within a vacuum environment, the process comprising the steps of vapor depositing successive layers of conductors separated by cross-linked polymer dielectric layers on a surface moving at a rate of from 150 feet per minute to 600 feet per minute, controlling the forming of the polymer dielectric layers by flash vaporizing a radiation-curable and cross-linkable material comprising a polyfunctional acrylic monomer and directing the vaporized monomer at a uniform rate toward a center region of such a conductor layer and condensing the flash-vaporized monomer, thereby forming a liquid monomer layer of uniform thickness on the center region of the conductor layer, defining edge barriers for the vaporized radiation curable and cross-linkable monomer spaced from the center region of the conductor layer so that the monomer is not deposited on the conductor layer past the edge barriers, and restricting vaporized monomer flow from the center region to the edge barriers to thereby form tapered surfaces of the monomer layer which extend from the center region to the edge barriers, curing the successive liquid monomer layers by subjecting said layers to a radiation source capable of rapidly curing a polyfunctional acrylic monomer layer about 1 micron thick.

10. The process of claim 9 in which the edge barriers are defined by flowing walls of inert gas, and the step of restricting the flow of vaporized monomer from the center region to the edge barriers includes balancing the flow rate of the vaporized monomer and the flow rate of the inert gas.

11. A high speed process for continuously producing a monolithic multi-layer capacitor on a moving substrate within a vacuum environment, the process comprising the steps of moving the substrate at a rate of from 150 feet per minute to 600 feet per minute, vapor depositing a layer of electrode material on one portion of the moving substrate within a predefined electrode forming zone in a vacuum environment, simultaneously flash vaporizing a radiation-curable and cross-linkable material comprising a polyfunctional acrylic monomer and vapor depositing a liquid coating of the flash-vaporized monomer on a layer of electrode material previously deposited on another portion of the moving substrate, and thereafter subjecting the monomer coating to a radiation source capable of rapidly curing a polyfunctional acrylic monomer coating about 1 micron thick, thereby curing the monomer, thereby forming a cross-linked polymer dielectric layer, wherein both the monomer deposition, curing and crosslinking take place within a predefined dielectric forming zone in a vacuum environment, the dielectric polymer layer being bonded to the electrode material, and repeatedly passing the substrate through the electrode-forming and the dielectric-forming zones in sequence to produce alternate electrode layers and polymer dielectric layers one on top of the other.

12. The process of claim 11 including the step of controlling rates of forming the electrode layers and the dielectric coatings so as to predetermine a thickness for the alternate layers and coatings of electrode and dielectric.

13. A high speed process for producing a capacitor within a vacuum environment on a moving substrate surface, the process comprising the steps of:

(a) moving the substrate at a rate of from 150 feet per minute to 600 feet per minute;

(b) by vapor deposition, forming a layer of electrode material of a selected thickness on a layer of dielectric previously formed on the moving substrate;

(c) flash vaporizing a radiation-curable and cross-linkable material comprising a polyfunctional acrylic monomer;

(d) vapor depositing a liquid coating of the flash-vaporized monomer of a given thickness on the electrode layer on the moving substrate;

(e) curing the monomer by means of a radiation source capable of rapidly curing a polyfunctional acrylic monomer layer at least 1 micron thick, thereby forming a cross-linked polymer dielectric layer on the electrode layer;

(f) forming another layer of electrode material of a selected thickness on the polymer dielectric layer; and

(g) repeating steps (c), (d), (e) and (f) a selected number of times to thereby produce alternate electrode layers and polymer dielectric layers of selected thickness on the substrate.

14. The process of claim 13 in which the radiation source is a gas discharge electron beam gun.

15. The process of claim 13 wherein the thickness of each of the layers of electrode material is such that the capacitor is self-healing.

16. The process of claim 13 wherein the thickness of each of the layers of electrode material is within the range of about 200 to 500 angstroms.

17. The process of claim 13 wherein steps (b), (c), (d) and (e) are repeated at least one hundred times.

18. The process of claim 13 wherein steps (b), (c), (d) and (e) are repeated at least one thousand times.

19. A high speed process for making capacitors within a vacuum environment, the process comprising the steps of:

(a) vapor depositing successive conductive layers onto a surface moving at a rate of from 150 feet per minute to 600 feet per minute, said layers comprised of interleaved strips of conductive material, wherein strips which comprise alternate conductive layers are laterally offset from strips which comprise intervening layers, a central capacitance region being defined by the interleaved portions of the strips;

(b) flash vaporizing a radiation-curable and cross-linkable material comprising a polyfunctional acrylic monomer;

(c) vapor depositing on and between each of the conductive strips a thin liquid coating of the flash-vaporized polyfunctional acrylic monomer; and

(d) subjecting the monomer coating to a radiation source capable of rapidly curing a polyfunctional acrylic monomer layer about 1 micron thick, thereby curing the monomer, thereby forming a cross-linked polymer dielectric layer so that in the central capacitance region the interleaved strips are uniformly spaced from one another by the polymer layers.

20. The process of claim 19 wherein the radiation source is a gas discharge electron beam gun.

21. The process of claim 19 wherein the thickness of each of the strips of conductive material is such that the capacitors will be self-healing.

22. The process of claim 19 wherein the thickness of each of the strips of conductive material is within the range of about 200 to 500 angstroms.

23. The process of claim 19 wherein at least one hundred conductive layers are vapor deposited.

24. The process of claim 19 wherein at least one thousand conductive layers are vapor deposited.

25. The process of claim 19 comprising the additional step of subdividing the layers and their associated dielectric coatings into discreet capacitors.

26. A high-speed process for forming a multi-layered capacitor comprising a plurality of dielectric and metal layers, deposited according to the following steps:

(a) providing a vacuum chamber containing;

i) a movable surface, ii) a vapor outlet of a vaporizer mounted adjacent to an upstream portion of the surface, iii) a radiation curing means mounted adjacent to a downstream portion of the surface, iv) means for maintaining the surface at a temperature below that of the vaporizer, and v) means for depositing conductive metal layers;

(b) evacuating gas from the vacuum chamber until the pressure within the chamber is less than about 1×

10^-4 Torr;

(c) metering a quantity of a cross-linkable and radiation curable material comprising a polyfunctional acrylic monomer into an inlet portion of the vaporizer;

(d) flash vaporizing the monomer within the vaporizer;

(e) moving the surface relative to the vapor outlet and the curing means at a rate of from 150 feet per minute to 600 feet per minute;

(f) dispensing vaporized monomer from the vapor outlet and condensing the vaporized monomer onto the moving surface, thereby forming a liquid monomer coating on the surface;

(g) activating the radiation curing means whereby the monomer comprising the liquid monomer coating is cured, thereby forming a cross-linked polymer dielectric layer on the moving surface, the radiation curing means capable of rapidly curing a polyfunctional acrylic monomer layer about 1 micron thick;

(h) vapor depositing a conductive layer of metal onto the polymer layer on the moving surface;

(i) condensing vaporized monomer dispensed from the vapor outlet onto the conductive metal layer provided in step (h), thereby forming a liquid monomer coating on the conductive metal layer; and

(j) repeating steps (g) through (i) a selected number of times.

27. The process of claim 26 wherein the radiation curing means is an electron beam gun.

28. The process of claim 26 wherein the thickness of each of the conductive metal layers is such that the capacitor is self-healing.

29. The process of claim 26 wherein the thickness of each of the conductive metal layers is within the range of about 200 to about 500 angstroms.

30. The process of claim 26 wherein steps (g) through (i) are repeated at least about 100 times.

31. The process of claim 26 wherein steps (g) through (i) are repeated at least about 1000 times.