Process for producing a printed circuit board with a syndiotactic polystyrene support

• US 5,127,158 A
• Filed: 08/30/1990
• Issued: 07/07/1992
• Est. Priority Date: 09/06/1989
• Status: Expired due to Fees

• Current Assignee: Idemitsu Kosan Company Limited
• Original Assignee: Idemitsu Kosan Company Limited
• Inventors: Nakano, Akikazu
• Primary Examiner(s): AFTERGUT, KAREN K
• Application Number:
  US07/575,295
• Time in Patent Office: 677 Days
• Field of Search: 264/86, 264/87, 264/101, 264/517, 264/571, 264/518, 264/DIG. 78, 264/128, 264/112, 264/122, 264/126, 264/113, 264/129, 264/319, 264/259, 264/330, 264/332, 162/145, 162/146, 162/169, 427/96, 427/99, 427/98, 156/150, 156/233, 156/245, 156/307.7, 428/901, 29/848, 29/849
• US Class Current: 29/849
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/0373 containing additives, e.g. fillers H05K1/036 takes precedence
• CPC Class Codes: H05K 2201/0129 Thermoplastic polymer, e.g. auto-adhesive layer; Shaping of thermoplastic polymer
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0212 Resin particles
• CPC Class Codes: H05K 2201/0239 Coupling agent for particles
• CPC Class Codes: H05K 2201/0248 Needles or elongated particles; Elongated cluster of chemically bonded particles
• CPC Class Codes: H05K 2201/0251 Non-conductive microfibers
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 3/022 Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
• CPC Class Codes: Y10T 29/4916 Simultaneous circuit manufacturing

Abstract

A process for producing a printed circuit board includes steps, sequentially conducted of dispersing in water or organic solvent:

(A) 95 to 20% by weight of a styrene polymer having a syndiotactic structure, (B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and (C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of the total amount of the components (A) and (B), to make a slurry having a concentration of 0.5 to 100 g/l; separating the solids from the slurry and drying and molding them. Thereafter the solids are either subjected to melting with heating and pressure forming into the molded article, or they are impregnated with a thermoplastic resin which is then cured. Finally, a metal layer is provided on the molded article.

Claims

1. A process for producing a printed circuit board comprising the following steps conducted sequentially:

(1) a step of dispersing in at least one medium selected from the of water and an organic solvent, the following components;

(A) 95 to 20% by weight of a styrene polymer having a high degree of syndiotactic structure,

(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and

(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of a total amount of said components (A) and (B), to make a slurry having a dispersed solids concentration of 0.5 to 100 g/l,

(2) a sedimentation step of said dispersed solids in said slurry,

(3) a step of removing at least one of said mediums of water and said organic solvent from said slurry by filtration and drying to form a residue, and molding said residue into a molded article

(4) a step of melting with heating and pressure forming, said molded article, and

(5) a step of providing a metal layer on said molded article to form said printed circuit board.

2. The process according to claim 1, wherein said styrene polymer having a syndiotactic structure is a racemic pentad having 30% or more syndiotacticity.

3. The process according to claim 1, wherein in said dispersion and slurry forming step (1) at least one of a sizing agent and a dispersing agent are added to said medium.

4. The process according to claim 1, wherein in said dispersion and slurry forming step (1) at least one of a sizing agent and a dispersing agent are added to said medium and said components (B), (A) and (C) are added in this sequence.

5. The process according to claim 1, wherein in said sedimentation step, an agglomerating agent is added to said slurry.

6. A process for producing a printed circuit board comprising the following steps conducted sequentially:

(1) a step of dispersing in at least one group consisting of water and an organic solvent, the following components;

(A) 95 to 20% by weight of a styrene polymer having a high degree of syndiotactic structure,

(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and

(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of a total amount of said components (A) and (B), to make a slurry having a dispersed solids concentration of 0.5 to 100 g/l,

(2) a sedimentation step of said dispersed solids in said slurry,

(3) a step of removing at least one of said mediums of water and said organic solvent from said slurry by filtration and drying to form a residue and molding said residue,

(4) a step of impregnating said molded residue with a thermosetting resin and thereafter curing said resin to form a molded article, and

(5) a step of providing a metal layer on said molded article to form said printed circuit board.

7. The process according to claim 6, wherein an amount of said thermosetting resin impregnated into said molded residue is in a proportion of 0.1 to 50 parts by weight to 100 parts by weight of said total amount of said components (A) and (B).