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Process for producing a printed circuit board with a syndiotactic polystyrene support

  • US 5,127,158 A
  • Filed: 08/30/1990
  • Issued: 07/07/1992
  • Est. Priority Date: 09/06/1989
  • Status: Expired due to Fees
First Claim
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1. A process for producing a printed circuit board comprising the following steps conducted sequentially:

  • (1) a step of dispersing in at least one medium selected from the of water and an organic solvent, the following components;

    (A) 95 to 20% by weight of a styrene polymer having a high degree of syndiotactic structure,(B) 5 to 80% by weight of a fibrous filler having a fiber length of 1 to 50 mm, and(C) 0.1 to 30 parts by weight of at least one of a binder and a binding fiber in proportion to 100 parts by weight of a total amount of said components (A) and (B), to make a slurry having a dispersed solids concentration of 0.5 to 100 g/l,(2) a sedimentation step of said dispersed solids in said slurry,(3) a step of removing at least one of said mediums of water and said organic solvent from said slurry by filtration and drying to form a residue, and molding said residue into a molded article(4) a step of melting with heating and pressure forming, said molded article, and(5) a step of providing a metal layer on said molded article to form said printed circuit board.

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