Method of forming a thin film pattern with a trapezoidal cross section

• US 5,127,989 A
• Filed: 05/13/1991
• Issued: 07/07/1992
• Est. Priority Date: 05/18/1990
• Status: Expired due to Term

• Current Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Original Assignee: Kabushiki Kaisha Toshiba (Toshiba Corporation)
• Inventors: Otani, Yasuto, Tsuji, Hitoshi, Haraguchi, Hiroshi, Kumamaru, Kuniaki
• Primary Examiner(s): Powell, William A.
• Application Number:
  US07/699,327
• Time in Patent Office: 421 Days
• Field of Search: 156/643, 156/646, 156/657, 156/659.1, 156/661.1, 156/662, 430/313, 430/318
• US Class Current: 216/49
• CPC Class Codes: G03F 7/2022 Multi-step exposure, e.g. hybrid; backside exposure; blanket exposure, e.g. for image reversal; edge exposure, e.g. for edge bead removal; corrective exposure
• CPC Class Codes: G03F 7/38 Treatment before imagewise removal, e.g. prebaking G03F7/265 takes precedence
• CPC Class Codes: H01L 21/0274 Photolithographic processes
• CPC Class Codes: H01L 21/033 comprising inorganic layers
• CPC Class Codes: H01L 21/28114 characterised by the sectional shape, e.g. T, inverted-T
• CPC Class Codes: H01L 21/31144 using masks
• CPC Class Codes: H01L 21/32139 using masks
• CPC Class Codes: H01L 28/20 Resistors

Abstract

The present invention provides a method of forming a thin film pattern with a trapezoidal cross section. In this method, a resist pattern with an inverted-trapezoidal cross section is formed on a thin film. Using the resist pattern with the inverted-trapezoidal cross section as a mask, the thin film is dry-etched. A resist pattern is left with the resist pattern used as a mask. The resist pattern has a trapezoidal cross section.

Claims

1. A method of forming a thin film pattern, comprising the steps of:

forming a thin film on a major surface of a substrate;

forming a resist pattern, which has an inverted-trapezoidal cross section, on the thin film; and

dry-etching the thin film selectively, with the resist pattern having the inverted-trapezoidal cross section employed as a mask, thereby forming a thin film pattern.

2. The method according to claim 1, wherein the dry etching is isotropic etching.

3. The method according to claim 2, wherein the isotropic etching is RIE.

4. The method according to claim 3, wherein the RIE is performed with use of a parallel-plate reactor capable of independently controlling the temperature of an upper electrode and the temperature of a lower electrode.

5. The method according to claim 1, wherein the resist pattern having an inverted-trapezoidal cross section is obtained by the steps of:

forming a resist film on the thin film;

exposing the resist film selectively, and forming a photo-sensitized region in the resist film, the photo-sensitized region being soluble in a developing liquid;

subjecting the resist film having the photo-sensitized region to heat treatment, thereby producing a substance in the photo-sensitized region, which substance is soluble in the developing liquid;

exposing the total surface of the resist film and forming another photo-sensitized region, which is soluble in the developing liquid, in those regions of the resist film which are other than the photo-sensitized region; and

removing said other photo-sensitized region by use of the developing liquid.

6. The method according to claim 5, wherein the resist film formed on the thin film is a novolak-based positive resist;

and

the step of subjecting the resist film having the photo-sensitized region to heat treatment, thereby producing a substance in the photo-sensitized region, which substance is soluble in the developing liquid, is carried out in an ammonia atmosphere.

7. The method according to claim 5, wherein the resist film is an image reverse resist.

8. The method according to claim 1, wherein the resist film formed on the thin film contains a dye.

9. The method according to claim 8, wherein said dye is an azo dye.

10. The method according to claim 1, wherein the cross-sectional shape of the thin film pattern is determined by controlling the cross-sectional shape of the resist pattern.

11. The method according to claim 10, wherein the cross-sectional shape of the resist pattern is determined by controlling the quantity of exposure light in the step of exposing the resist film selectively, and forming a photo-sensitized region in the resist film, which photo-sensitized region is soluble in a developing liquid.

12. The method according to claim 10, wherein the cross-sectional shape of the resist pattern is determined by adding a dye to the resist film and controlling the quantity of the added dye.

13. The method according to claim 1, wherein the cross-sectional shape of the thin film pattern is determined such that the dry etching is performed by RIE, the RIE is carried out by use of a parallel-plate reactor capable of independently controlling the temperature of an upper electrode and the temperature of a lower electrode, and a temperature difference, which is caused between the upper electrode and lower electrode, is controlled.