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Method for automatic semiconductor wafer inspection

  • US 5,129,009 A
  • Filed: 06/04/1990
  • Issued: 07/07/1992
  • Est. Priority Date: 06/04/1990
  • Status: Expired due to Term
First Claim
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1. A method of inspecting a semiconductor integrated circuit (IC) comprising:

  • obtaining an image of the IC;

    performing direction edge enhancement of the image to form a direction edge shape;

    skeletonizing the direction edge shape;

    testing the skeletonized direction edge shape for correlation to a predetermined shape which has been previously stored;

    identifying an anomalous shape which cannot be correlated to the stored predetermined direction edge shape and classifying the anomalous shape wherein the step of classifying the anomalous shape further comprises;

    obtaining a plurality of images of the anomaly under varied lighting angles and lighting colors;

    building a feature matrix using the plurality of images; and

    comparing the feature matrix to an expert data base having feature data associated with defect classification data.

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