Three-dimensional circuit modules

• US 5,130,894 A
• Filed: 11/26/1990
• Issued: 07/14/1992
• Est. Priority Date: 11/26/1990
• Status: Expired due to Term

• Current Assignee: American Telephone & Telegraph Company (AT&T, Inc.)
• Original Assignee: AT&T, Inc.
• Inventors: Miller, Wayne H.
• Primary Examiner(s): Picard, Leo
• Assistant Examiner(s): WHANG, YOUNG
• Application Number:
  US07/617,704
• Time in Patent Office: 596 Days
• Field of Search: 361/393, 361/396, 361/400, 361/409, 361/403, 361/410, 361/412, 361/414, 361/416, 439/66, 439/65, 439/44, 439/86, 439/91, 439/591
• US Class Current: 361/735
• CPC Class Codes: H01L 2225/06527 Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06572 Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06589 Thermal management, e.g. cooling
• CPC Class Codes: H01L 23/5385 Assembly of a plurality of insulating substrates
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01R 12/7076 for connection between PCB and component, e.g. display
• CPC Class Codes: H05K 1/144 Stacked arrangements of planar printed circuit boards
• CPC Class Codes: H05K 7/00 Constructional details common to different types of electric apparatus casings, cabinets, drawers H05K5/00
• CPC Class Codes: H05K 7/023 Stackable modules

Abstract

Disclosed is a three-dimensional circuit structure particularly useful in semiconductor memories. The circuit structure consists of a stack of modules mounted on a mother board with connectors between adjacent modules in the stack. The connectors mate with staggered and through terminals on the modules; the staggered terminals being used for circuits routed to destinations on specific modules and the through terminals for circuits routed to destinations on more than one module.

Claims

1. A three-dimensional circuit structure which comprises:

a plurality of circuit modules mounted in a stack, each circuit module being a substantially planar circuit board having conductors and a plurality of terminals thereon, each terminal having a first connecting area on one side of the circuit module connected to a second connecting area on the other side of the circuit module, at least some of the terminals being staggered terminals having the first connecting area opposite the second connecting area of a different staggered terminal, at least one of the staggered terminals on each module being connected by one of the conductors to first utilizing means mounted on the module and

means for connecting opposing ones of the first and second connecting areas on adjacent circuit modules in the stack when said connecting means is placed between said adjacent modules.

2. The circuit structure of claim 1 in which at least one of the terminals on each circuit module is a through terminal having its first connecting area opposite the second connecting area of the same through terminal and at least one of the through terminals on each module is connected by one of the conductors to the first utilizing means mounted on the module.

3. The circuit structure of claim 1 or claim 2 in which at least one of the circuit modules has means for connecting at least one of the staggered terminals and/or the through terminals to second utilizing means.

4. The circuit structure in accordance with claim 3 in which each of the first utilizing means comprises a semiconductor memory and the second utilizing means comprises means for reading, writing and powering the semiconductor memories.

5. A circuit module for use in a stack of similar modules in conjunction with connecting means placed between the modules in said stack, which comprises

a substantially planar circuit board having conductors and a plurality of terminals thereon, each terminal having a first connecting area on one side of the circuit module connected to a second connecting area on the other side of the circuit module, at least one set of the terminals being staggered terminals, each staggered terminal having its first connecting area opposite the second connecting area of a different staggered terminal, at least one of the staggered terminals on each module being connected by one of the conductors to first utilizing means mounted on the module, whereby the first connecting areas on one of the circuit modules will be connected to opposing second connecting areas on an adjacent circuit module when assembled with the connecting means in the stack.

6. The circuit module of claim 5 in which at least one of the terminals is a through terminal having its first connecting area opposite the second connecting area of the same through terminal and at least one of the through terminals is connected by one of the conductors to the first utilizing means mounted on the module.

7. The circuit module of claim 6 in which the first utilizing means comprises a semiconductor memory.

8. The circuit module of claim 6 which also comprises means for connecting at least one of the staggered terminals and/or through terminals to second utilizing means.

9. The circuit module of claim 8 in which the first utilizing means comprises a semiconductor memory and the second utilizing means comprises means for reading, writing and powering semiconductor memories.