Automatic high speed optical inspection system

• US 5,131,755 A
• Filed: 10/31/1989
• Issued: 07/21/1992
• Est. Priority Date: 02/19/1988
• Status: Expired due to Term

• Current Assignee: KLA Instruments, Corporation
• Original Assignee: KLA Instruments, Corporation
• Inventors: Harvey, David J., Fein, Michael E., Bell, William, Chadwick, Curt H., Greene, John D., Jann, P. C., Sholes, Robert R., Tucker, Francis D. III
• Primary Examiner(s): TURNER, SAMUEL A
• Application Number:
  US07/429,859
• Time in Patent Office: 994 Days
• Field of Search: 356/237, 356/386, 356/387, 356/394, 356/398, 356/446, 356/448, 358/101, 358/106, 358/107, 396/398
• US Class Current: 356/394
• CPC Class Codes: G01N 2021/8907 Cylindrical optics
• CPC Class Codes: G01N 2021/8908 Strip illuminator, e.g. light tube
• CPC Class Codes: G01N 2021/95615 with stored comparision signal
• CPC Class Codes: G01N 2021/95638 for PCB's
• CPC Class Codes: G01N 21/8806 Specially adapted optical and illumination features
• CPC Class Codes: G01N 21/956 Inspecting patterns on the surface of objects contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G01N 2201/06126 Large diffuse sources
• CPC Class Codes: G01R 31/309 of printed or hybrid circuits or circuit substrates
• CPC Class Codes: G01R 31/311 of integrated circuits G01R31/31728 takes precedence

Abstract

In each configuration, at least one TDI sensor is used to image substrate portions of interest, with those portions illuminated with substantially uniform illumination. In one configuration, a substrate is compared to prestored expected characteristic features. In a second configuration, first and second patterns in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other. This is accomplished by illuminating the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. This inspection technique is useful for doing die-to-die inspections. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for temporary memory. In this configuration, the two patterns are simultaneously imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored to determine which patterns are bad when the inspection of all patterns is completed.

Claims

1. Inspection apparatus for inspecting surface features of a substrate comprising:

memory means for storing the desired features of the surface of the substrate from the CAD system that were used to produce the substrate;

illumination means for substantially uniformly illuminating a region of the surface of the substrate to be inspected;

TDI sensor means for imaging the region of the substrate illuminated by the illumination means; and

comparison means responsive to the memory and sensor means for comparing the imaged region of the substrate with the stored desired features of the substrate.

2. A method for inspecting surface features of a substrate, said method comprising the steps of:

a. storing the characteristics of the substrate from the CAD system that were used to produce the substrate into memory;

b. illuminating for substantially uniformly illuminating a region of the surface of the substrate to be inspected;

c. imaging the region of the substrate illuminated with a TDI sensor; and

d. comparing the imaged region of the substrate with the stored desired features of the substrate.

3. A method for inspecting surface features of a substrate, said method comprising the steps of:

a. illuminating by means of substantially uniform illumination at least a first die in a region of the surface of the substrate to be inspected;

b. imaging a first die in the illuminated region of the substrate illuminated in step a. with a TDI sensor;

c. storing the imaged die of step b.;

d. illuminating by means of substantially uniform illumination at least a second die in a region of the surface of the substrate to be inspected;

e. imaging a second die in the illuminated region of the substrate illuminated in step d. with a TDI sensor; and

f. comparing the imaged second die of step e. with the image of the first die stored in step c.

4. A method as in claim 3 wherein said first and second dies are intended to be identical.

5. A method as in claim 4 wherein said first and second dies are on the same substrate.

6. A method as in claim 4 wherein said first and second dies are on different substrates.

7. A method as in claim 3 further including the steps of:

g. storing the result of the comparison of step f. together with the locations of the first and second dies; and

h. repeating steps a. through g. sequentially for each pair of dies with the second die in the previous pair becoming the first die and another die becoming the second die.

8. Inspection apparatus for inspecting surface features of a substrate comprising:

illumination means for substantially uniform illumination of a first and second die in a region of the surface of at least one substrate to be inspected;

TDI sensor means for sequentially imaging said first and second dies;

memory means for storing the imaged first die as that die is imaged by said TDI sensor means; and

comparison means responsive to the memory and TDI sensor means for comparing the imaged second die with the image of the first die stored in the memory means.

9. Inspection apparatus as in claim 8 wherein said first and second dies that are intended to be identical.

10. Inspection apparatus as in claim 9 wherein said first and second dies are on the same substrate.

11. Inspection apparatus as in claim 9 wherein said first and second dies are on different substrates.

12. Inspection apparatus as in claim 8 wherein said memory means also stores the result of the comparison together with the locations of the first and second dies.