Micromachined silicon potentiometer responsive to pressure

• US 5,132,658 A
• Filed: 04/19/1990
• Issued: 07/21/1992
• Est. Priority Date: 04/19/1990
• Status: Expired due to Fees

• Current Assignee: Honeywell International Inc.
• Original Assignee: Sensym Inc.
• Inventors: Dauenhauer, Dennis A., Reimann, Hans
• Primary Examiner(s): Lateef, Marvin M.
• Application Number:
  US07/511,656
• Time in Patent Office: 824 Days
• Field of Search: 338/47, 338/78, 338/92, 338/99, 338/97, 338/105, 338/114, 338/120, 338/42, 73/719, 73/862.68, 200/5 A, 200/83 N
• US Class Current: 338/92
• CPC Class Codes: G01L 9/0057 of potentiometers
• CPC Class Codes: H01C 10/10 adjustable by mechanical pressure or force

Abstract

A silicon pressure chip operates in a two-wire resistive mode. A thin-film resistor located on a long silicon beam which is the thicker portion of a thin diaphragm is partially shorted out by a metallized deflection stop. The pressure response of the resistor is determined by the resistor layout.

Claims

1. A force sensor having an elastic beam and comprising:

a first surface and a second surface separated by a gap and each said surface being formed in a silicon substrate, the first surface capable of flexing in response to an external force, the second surface stationary relative to the first surface and acting as a deflection stop;

a resistor formed on one of the surfaces and having two terminals with a current path between the two terminals; and

an electrode on the other surface acting as a shunt for that portion of the resistor which comes into contact with said electrode, wherein one of the surfaces includes a central beam located on a diaphragm, said central beam being at least about four times thicker than adjacent portions of said diaphragm;

whereby when flexing of the first surface occurs, a resistance in the current path between said two terminals changes in response to said external force.

2. A silicon pressure sensor having an elastic beam and comprising:

a first silicon chip in which is formed a diaphragm capable of flexing in response to pressure changes;

a second silicon chip separated by a gap from said diaphragm and bonded to said first chip;

a resistor formed between two terminals on a surface of said first chip facing said gap wherein said diaphragm includes a beam portion clamped at both ends and located at a central portion of said diaphragm, and said beam portion being at least about four times thicker than a remainder of said diaphragm, said resistor being formed on a surface of said beam portion; and

a conductive electrode formed on a surface of the second chip facing said gap;

whereby, in response to pressure changes, the two surfaces make contact of a varying length and a resistance between said two terminals changes in response to pressure.

3. The device of claim 2, wherein said resistor is a meandering conductive line.

4. The device of claim 2, wherein said resistor is a thin metal film.

5. The device of claim 2, wherein said resistor is an area deposited resistive material.

6. The device of claim 2, wherein said resistor comprises a doped region formed in one of said semiconductor bodies.

7. The device of claim 2, wherein said gap is hermetically sealed and evacuated, and thereby the device is sensitive to pressure changes at zero external pressure.

8. The device of claim 2, wherein said resistor is a zig-zag line.

9. The device of claim 2, wherein the sensor has a length of about 3.5 mm and a width of about 2 mm.