Pressure transmitter assembly having sensor isolation mounting
First Claim
1. An apparatus for sensing pressure, comprising:
- a) Header means, having at least one input port for containing a substance under pressure;
b) substrate means, having a wafer-like shape with a relatively large surface area in comparison to its thickness, the substrate means further including at least one internal passage to couple the substance under pressure; and
c) means for sensing pressure mounted onto the surface of said substrate means over an exit port of said internal passage coupling the substance under pressure, the substrate means being bonded to a surface of said header means at predetermined locations of said substrate means, said predetermined locations being at extreme locations from a location in which said means for sensing pressure is mounted, thereby providing isolation for said means for sensing pressure from unwanted stresses induced in said substrate means, the input of the internal passage of the substrate means lining up to receive the substance under pressure from at least one input port of the header means.
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Abstract
The apparatus for sensing pressure comprises a header, having at least one input port for receiving a substance under pressure. A substrate, having a wafer-like shape with a relatively large surface area in comparision to its thickness, includes at least one internal passage to couple the substance under pressure. A pressure sensing element is mounted onto the surface of the substrate over an exit port of the internal passage coupling the substance under pressure. The substrate is bonded to a surface of the header at extreme locations from a location in which the pressure sensing element is mounted. Thus isolation is provided for the pressure sensing element from unwanted stresses induced in the substrate.
20 Citations
8 Claims
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1. An apparatus for sensing pressure, comprising:
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a) Header means, having at least one input port for containing a substance under pressure; b) substrate means, having a wafer-like shape with a relatively large surface area in comparison to its thickness, the substrate means further including at least one internal passage to couple the substance under pressure; and c) means for sensing pressure mounted onto the surface of said substrate means over an exit port of said internal passage coupling the substance under pressure, the substrate means being bonded to a surface of said header means at predetermined locations of said substrate means, said predetermined locations being at extreme locations from a location in which said means for sensing pressure is mounted, thereby providing isolation for said means for sensing pressure from unwanted stresses induced in said substrate means, the input of the internal passage of the substrate means lining up to receive the substance under pressure from at least one input port of the header means. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. An apparatus for sensing pressure, comprising:
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a) header means, having at least one input port for containing a substance under pressure; b) substrate means, having a wafer-like shape with a relatively large surface area in comparison to its thickness, the substrate means further including at least one internal passage to couple the substance under pressure; and c) means for sensing pressure mounted onto the surface of said substrate means over an exit port of said internal passage coupling the substance under pressure, the substrate means having at least one cut-out, the cut-out forming a peninsula-like portion of said substrate means, and wherein at least one internal passage is included in the peninsula-like portion of the substrate means, the input to the internal passage of the substrate means lining up with the input port of the header means, and further wherein the input to the internal passage being at an extremity of the peninsula-like portion of the substrate means, the means for sensing pressure being mounted on a portion of the substrate means away from the peninsula-like portion of the substrate means, the substrate means being bonded to the header means in an area around the input port of the header means at the extremity of the peninsula-like portion of the substrate means.
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Specification