×

Apparatus and method of inspecting solder printing

  • US 5,134,665 A
  • Filed: 02/14/1991
  • Issued: 07/28/1992
  • Est. Priority Date: 03/08/1990
  • Status: Expired due to Fees
First Claim
Patent Images

1. A solder printing inspection apparatus comprising:

  • a body;

    means for moving the body in at least a first direction and a second direction perpendicular to the first direction, whereby the body can move over the land pattern of a printed circuit board;

    a displacement sensor rotatably attached to said body having a direction of scanning, and providing signals indicative of the distance between the sensor and the printed circuit board;

    a rotary mechanism for rotating said displacement sensor about an axis substantially perpendicular to said printed circuit board so that the direction of scanning is orthogonal to the direction of movement of said body;

    a first means for processing the signals from said displacement sensor so as to obtain the film thickness and the printing pattern of the solder on said land pattern;

    an ITV area sensor attached to said body and providing signals indicative of the printing pattern on the land pattern; and

    a second means for processing the signals from said ITV area sensor so as to detect print deviation of The solder on said land pattern.

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×