Method for depositing free metal containing latex

• US 5,135,780 A
• Filed: 09/06/1990
• Issued: 08/04/1992
• Est. Priority Date: 09/06/1990
• Status: Expired due to Fees

• Current Assignee: CNC Development, Inc.
• Original Assignee: Union Oil Company of California (Chevron Corp.)
• Inventors: Kissel, Charles L.
• Primary Examiner(s): LUSIGNAN, MICHAEL R
• Application Number:
  US07/579,153
• Time in Patent Office: 698 Days
• Field of Search: 427/443.1, 427/305, 427/438, 427/404, 427/405, 427/407.1, 427/407.2, 427/408, 427/409, 427/411, 427/412.1
• US Class Current: 427/404
• CPC Class Codes: B05D 5/12 to obtain a coating with specific electrical properties
• CPC Class Codes: C23C 18/52 using reducing agents for coating with metallic material not provided for in a single one of groups C23C18/32 - C23C18/50
• CPC Class Codes: H01B 1/22 the conductive material comprising metals or alloys

Abstract

Free metals are electrolessly deposited in the presence of a latex of a polymer. Sols or gels containing metal-containing ions are mixed with a latex and the resulting sol/latex subsequently contacted with a reducing agent. The presence of the reducing agent with the latex at appropriate deposition conditions converts the metallic ions to free metal. The free metal is deposited in the form of a surface coating composition onto substrates for such purposes as decoration of substrates and electrically conductive coatings.

Claims

1. A method comprising the step of electrolessly depositing one or more free metals onto a substrate and concurrently coating a polymer of a latex onto said substrate, said latex containing above about 1 weight percent of said polymer and above about 0.001 weight percent of salt containing metallic cations.

19. The method defined in claim 1 wherein said free metal comprises copper and said substrate comprises mild steel.

20. The method defined in claim 1 wherein said free metal comprises a continuous layer of silver.

21. The method defined in claim 1 wherein said free metal comprises copper in the form of unattached particulates.

23. The method defined in claim 1 wherein said substrate comprises a component of objects selected from the group consisting of mirrors, windows, doors, microwave susceptor food packaging, tapes, cabinets, automobiles, plumbing fixtures, holographic laminates, sacrificial metallic corrosion inhibitors, laminated materials having barrier properties, and magnetic information recording devices.

24. The method defined in claim 1 wherein said polymer results from emulsion polymerization.

2. A method for producing a free metal in a latex, said method comprising:

(1) admixing a sol or gel composition comprising above about 0.001 weight percent of salt components having metal-containing ions with a latex of a polymer or a monomer precursor of a latex of a polymer to form a sol/latex composition, said sol/latex composition containing above about 1 weight percent of said polymer,

(2) contacting said sol/latex composition obtained from step (1) with a reducing agent to form a sol/latex/reducing agent composition, and

(3) depositing concurrently from said sol/latex/reducing agent composition both said polymer and a free metal reduced from said metal-containing ions onto a substrate.

3. The method defined in claim 2 wherein step (3) comprises drying said sol/latex/reducing agent composition to reduce at least a portion of said metal-containing ions of said salt to the free metal form.

4. The method defined in claim 2 wherein step (3) comprises heating said sol/latex/reducing agent composition to an elevated temperature.

5. The method defined in claim 2 wherein said sol/latex/reducing agent composition is coated onto the substrate and said free metal is homogeneously distributed in said latex in the form of unattached free metal particulates.

6. The method defined in claim 2 wherein said sol/latex/reducing agent composition is coated onto said substrate and said free metal comprises a continuous metallic layer on said substrate.

7. The method defined in claim 6 wherein a continuous layer of said polymer is coated concurrently with said continuous metallic layer and said polymer layer covers said metallic layer.

8. The method defined in claim 2 wherein said reducing agent is uniformly mixed with said sol/latex composition to form a stable, noncoagulated latex.

9. The method defined in claim 2 wherein said reducing agent comprises said substrate, and steps (2) and (3) are concurrent.

10. The method defined in claim 9 wherein said substrate comprises a second free metal having a reduction potential which is greater than that of said free metal derived from said metal-containing ions.

11. The method defined in claim 2 wherein said reducing agent is selected from the group consisting of hydrazine, formaldehyde, hydrazine salts, formaldehyde-bisulfite adduct, ferrous salts, ammonia, ethanolamines, ethylene diamine, diethylene triamine, sodium borohydride, sodium borate monobasic, urea, thiourea, sodium hypophosphite, and paraformaldehyde.

12. The method defined in claim 2 wherein said metal-containing ions are selected from the group consisting of silver, gold, copper, chromium, manganese, cobalt, tin, nickel, antimony, bismuth, ruthenium, rhodium, and platinum.

13. The method defined in claim 2 wherein said metal-containing ions comprise metallic cations selected from the group consisting of silver, copper, chromium and nickel.

14. The method defined in claim 2 wherein said reducing agent is selected from the group consisting of formaldehyde, ammonia, urea and paraformaldehyde.

15. The method defined in claim 2 wherein said latex contains a polymer selected from the group consisting of vinyl polymers, acrylic polymers, vinyl-acrylic copolymers, vinyl chloride acrylic copolymers, vinylidene chloride polymers, styrene-butadiene copolymers, styrene-acrylate copolymers and vinyl acetate-ethylene copolymers.

16. The method defined in claim 2 wherein step (3) comprises changing the pH of said sol/latex/reducing agent composition prior to or concurrently with said depositing of said free metal.

17. The method defined in claim 2 wherein said sol/latex is prepared by charge addition of said sol or gel composition and said monomer precursor of said latex.

18. The method defined in claim 2 wherein said sol/latex is prepared by delay addition of said sol or gel composition and said latex.

25. The method defined in claim 2 wherein said polymer results from emulsion polymerization.

22. A process for decorating a substrate with a coating containing a polymer and a free metal, said free metal and said polymer deposited concurrently onto said substrate from a surface coating composition comprising a noncoagulated latex containing (1) a latex of a polymer wherein said polymer comprises above about 1 weight percent of said latex, (2) a sol or gel composition containing salt components, said salt components comprising above about 0.001 weight percent of metal-containing ions, and (3) a reducing agent for said metal-containing ions.

26. A method comprising the step of electrolessly depositing one or more free metals onto a substrate and coating concurrently a polymer of a latex resulting from emulsion polymerization onto said substrate, said method comprising:

(1) admixing a sol or gel composition comprising salt components containing above about 0.001 weight percent of a salt having metal-containing ions with a latex of a polymer resulting from emulsion polymerization or a monomer precursor of a latex of a polymer resulting from emulsion polymerization to form a sol/latex composition, said sol/latex composition containing above about 1 weight percent of said polymer,

(2) contacting said sol/latex composition obtained from step (1) with a reducing agent to form a sol/latex/reducing agent composition, and

(3) depositing concurrently both said polymer and a free metal onto a substrate, said polymer and said free metal reduced from said metal-containing ions both obtained from said sol/latex/reducing agent composition.

27. The method defined in claim 26 wherein said sol or gel composition further comprises a nonaqueous solvent and has a pH less than about 4.

28. The method defined in claim 26 wherein said metal-containing ions are selected from the group consisting of silver, gold, copper, chromium, manganese, cobalt, tin, nickel, antimony, bismuth, ruthenium, rhodium, and platinum.

29. The method defined in claim 26 wherein reducing agent is selected from the group consisting of hydrazine, formaldehyde, hydrazine salts, formaldehyde-bisulfite adduct, ferrous salts, ammonia, ethanolamines, ethylene diamine, diethylene triamine, sodium borohydride, sodium borate monobasic, urea, thiourea, sodium hypophosphite, and paraformaldehyde.

30. The method defined in claim 26 wherein said metal-containing ions comprise metallic cations selected from the group consisting of silver, copper, chromium and nickel.

31. The method defined in claim 26 wherein said reducing agent is selected from the group consisting of formaldehyde, ammonia, urea and paraformaldehyde.

32. The method defined in claim 26 wherein said latex contains a polymer selected from the group consisting of vinyl polymers, acrylic polymers, vinyl-acrylic copolymers, vinyl chloride acrylic copolymers, vinylidene chloride polymers, styrene-butadiene copolymers, styrene-acrylate copolymers and vinyl acetate-ethylene copolymers.

33. The method defined in claim 26 wherein step (3) comprises drying said sol/latex/reducing agent composition to reduce at least a portion of said metal-containing ions of said salt to the free metal form.

34. The method defined in claim 26 wherein step (3) comprises heating said sol/latex/reducing agent composition to an elevated temperature.

35. The method defined in claim 26 wherein said sol/latex/reducing agent composition is coated onto the substrate and said free metal is homogeneously distributed in said latex in the form of unattached free metal particulates.

36. The method defined in claim 26 wherein said sol/latex/reducing agent composition is coated onto said substrate and said free metal comprises a continuous metallic layer on said substrate.

37. The method defined in claim 36 wherein a a continuous layer of said polymer is coated concurrently with said continuous metallic layer and said polymer layer covers said metallic layer.

38. The method defined in claim 26 wherein said reducing agent is uniformly mixed with said sol/latex composition to form a stable, noncoagulated latex.

39. The method defined in claim 26 wherein said reducing agent comprises said substrate, and steps (2) and (3) are concurrent.

40. The method defined in claim 39 wherein said substrate comprises a second free metal having a reduction potential which is greater than that of said free metal derived from said metal-containing ions.