Schottky diode

• US 5,135,878 A
• Filed: 08/28/1990
• Issued: 08/04/1992
• Est. Priority Date: 08/28/1990
• Status: Expired due to Term

• Current Assignee: Solid State Devices, Inc.
• Original Assignee: Solid State Devices, Inc.
• Inventors: Bartur, Meir
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): TRINH, LOC
• Application Number:
  US07/573,957
• Time in Patent Office: 707 Days
• Field of Search: 437/39, 437/177, 437/178, 437/179, 437/188, 437/208, 437/906, 148/DIG. 140, 357/15
• US Class Current: 438/106
• CPC Class Codes: H01L 2224/32014 the layer connector being smaller than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 23/4827 Materials
• CPC Class Codes: H01L 24/01 Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
• CPC Class Codes: H01L 25/074 Stacked arrangements of non-apertured devices
• CPC Class Codes: H01L 29/47 Schottky barrier electrodes H01L29/435 takes precedence
• CPC Class Codes: H01L 29/66143 Schottky diodes
• CPC Class Codes: H01L 29/872 Schottky diodes
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01018 Argon [Ar]
• CPC Class Codes: H01L 2924/01024 Chromium [Cr]
• CPC Class Codes: H01L 2924/01029 Copper [Cu]
• CPC Class Codes: H01L 2924/01033 Arsenic [As]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01073 Tantalum [Ta]
• CPC Class Codes: H01L 2924/01074 Tungsten [W]
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/01082 Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/12032 : Schottky diode
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

A Schottky diode has a metal lead electrically connected to the Schottky contact layer wherein the metal lead is metallurgically bonded to the diode for increased reliability, the diode having a Ta--Si--N barrier layer.

Claims

1. A method for fabricating a leaded Schottky barrier diode, comprising the steps of:

forming a Schottky barrier diode having a diffusion barrier layer of tantalum-silicon-nitride;

forming a metallization layer disposed over the diffusion barrier layer;

placing a metal lead in proximity to the metallization layer; and

heating the area in proximity to the metallization layer and metal lead to a temperature such that the metal lead metallurgically bonds to the metallization layer.

2. A method for fabricating an axially leaded Schottky barrier diode, comprising the steps of:

forming a diffusion barrier layer of tantalum-silicon-nitride disposed over a first side of a silicon substrate;

forming a metallization layer disposed over the diffusion barrier layer;

placing a metal lead in proximity to the metallization layer; and

heating the area in proximity to the metallization layer and metal lead to a temperature such that the metal lea metallurgically bonds to the metallization layer.

3. The method of claim 2 wherein the metallization layer is heated to a temperature in excess of the melting point of the metallization layer.

4. The method of claim 2 wherein the heating temperature is in excess of 400 degrees C.

5. The method of claim 2 wherein the heating temperature is in excess of 600 degrees C.

6. The method of claim 2 wherein the metallization layer and the metal lead are formed of two different metals and the metallization layer and the metal lead are heated above the eutectic temperature of the two metals.

7. The method of claim 6 wherein the two different metals are silver and aluminum.

8. The method of claim 2 further comprising the steps of:

forming a second metallization layer disposed over a second side of the substrate;

placing a second metal lead in proximity to the second metallization layer; and

heating the area in proximity to the second metallization layer and metal lead to a temperature such that the second metal lead metallurgically bonds to the second metallization layer.

9. The method of claim 8 further comprising the step of forming a second barrier layer over the second side of the substrate prior to forming the second metallization layer wherein the second barrier layer is interposed between the second side of the substrate and the second metallization layer.

10. A method for fabricating an axially leaded Schottky barrier device, comprising the steps of:

(a) forming a diode by;

forming a diffusion barrier layer disposed over a first side of a silicon substrate;

forming a top metallization layer disposed over the diffusion barrier layer; and

forming a bottom metallization layer disposed over a bottom side of the substrate;

repeating step (a) to form a plurality of diodes;

stacking the diodes formed above in step (a) so that the bottom metallization of each diode having an underlying diode of the stack abuts the top metallization layer of the underlying diode;

heating the stack to a temperature such that abutting top and bottom metallization layers of adjacent diodes of the stack metallurgically bond together;

placing a top metal lead in proximity to the top metallization layer of the top diode of the stack;

placing a bottom metal lead in proximity to the bottom metallization layer of the bottom diode of the stack; and

heating the areas in proximity to the top and bottom leads to a temperature such that the top metal lead metallurgically bonds to the top metallization layer and the bottom metal lead metallurgically bonds to the bottom metallization layer of the top and bottom diodes, respectively.

11. The method of claim 10 further comprising the step of forming a second barrier layer over the second side of the substrate prior to forming the second metallization layer wherein the second barrier layer is interposed between the second side of the substrate and the second metallization layer.

12. The method of claim 10 wherein the metallization layers are heated to a temperature in excess of the melting point of the metallization layers.

13. The method of claim 10 wherein the heating temperature is in excess of 400 degrees C.

14. The method of claim 10 wherein the heating temperature is in excess of 600 degrees C.

15. The method of claim 10 wherein the top and bottom metallization layers are formed of two different metals and the top and bottom metallization layers are heated above the eutectic temperature of the two metals.

16. The method of claim 14 wherein the two different metals are silver and aluminum.

25. The method of claims 10 or 17 wherein the diffusion barrier layer comprises tantalum-silicon-nitride.

17. A method for fabricating an axially leaded Schottky barrier device, comprising the steps of:

(a) forming a diode by;

forming a diffusion barrier layer disposed over a first side of a silicon substrate;

forming a top metallization layer disposed over the diffusion barrier layer; and

forming a bottom metallization layer disposed over a bottom side of the substrate;

repeating step (a) to form a plurality of diodes;

stacking the diodes formed above in step (a) so that the bottom metallization of each diode having an underlying diode of the stack abuts the top metallization layer of the underlying diode;

placing a top metal lead in proximity to the top metallization layer of the top diode of the stack;

placing a bottom metal lead in proximity to the bottom metallization layer of the bottom diode of the stack; and

heating the stack to a temperature such that abutting top and bottom metallization layers of adjacent diodes of the stack metallurgically bond together and such that the top metal lead metallurgically bonds to the top metallization layer and the bottom metal lead metallurgically bonds to the bottom metallization layer of the top and bottom diodes, respectively.

18. The method of claim 17 further comprising the step of forming a second barrier layer over the second side of the substrate prior to forming the second metallization layer wherein the second barrier layer is interposed between the second side of the substrate and the second metallization layer.

19. The method of claim 17 wherein the metallization layers are heated to a temperature in excess of the melting point of the metallization layers.

20. The method of claim 17 wherein the heating temperature is in excess of 400 degrees C.

21. The method of claim 17 wherein the heating temperature is in excess of 600 degrees C.

22. The method of claim 17 wherein the top and bottom metallization layers are formed of two different metals and the top and bottom metallization layers are heated above the eutectic temperature of the two metals.

23. The method of claim 17 wherein the two different metals are silver and aluminum.

24. The method of claim 17 further comprising the step of placing a glass sleeve around the stack of diodes and the ends of the leads before the stack and the leads are heated;

wherein the metallurgically bonding heating step further includes simultaneous heating of the glass sleeve to hermetically seal the stack of diodes and the ends of the leads.