Automatic package inspection method
First Claim
1. A method for automatically inspecting a semiconductor package, wherein the semiconductor package has a number of edge features, the method comprising:
- obtaining an image of the package;
performing a direction edge enhancement to determine a plurality of package direction edges;
wherein the direction edge features in the image and identifying a direction for each edge feature;
building a list of point locations of the package direction edges; and
comparing the point locations against a predetermined list of acceptable point locations.
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Abstract
A real time automatic visual semiconductor package inspection method is provided wherein a direction edge enhancement is performed on an image of the package. The direction edge enhanced image is dilated and correlated to a stored direction edge shape to identify all shapes of interest in a package under inspection. Also, anomalous shapes and uncorrelated direction edge shapes are identified and dilated. The dilated direction edge shape is analyzed using relatively simple mathematic techniques such as counting the number of shapes of a particular type, transforming shapes of interest to identify points of interest, and measuring relative position between the points of interest to determine acceptability of the semiconductor package. Also, size and location of anomalous shapes are calculated to determine acceptability of the package.
51 Citations
13 Claims
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1. A method for automatically inspecting a semiconductor package, wherein the semiconductor package has a number of edge features, the method comprising:
- obtaining an image of the package;
performing a direction edge enhancement to determine a plurality of package direction edges;
wherein the direction edge features in the image and identifying a direction for each edge feature;
building a list of point locations of the package direction edges; and
comparing the point locations against a predetermined list of acceptable point locations. - View Dependent Claims (2, 3, 4)
- obtaining an image of the package;
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5. A method for automatically inspecting a semiconductor package, wherein the semiconductor package has a plurality of edge features, the method comprising:
- obtaining an image of a sample package and leads which extend from the sample package;
determining a direction edge shape for the sample package, wherein the step of determining the direction edge shape for the sample package further comprises identifying edge features in the image of the sample package and identifying a direction for each edge feature;
determining a direction edge shape for leads which extend from the sample package, wherein the step of determining the direction edge shape for the leads of the sample package further comprises identifying edge features in the image of the leads which extend from the sample package and identifying a direction for each edge feature;
storing the direction edge shape for the sample package and leads;
obtaining an image of a package under inspection;
determining a direction edge shape for the package under inspection, wherein the step of determining the direction edge shape for the package under inspection further comprises identifying edge features in the image of the package under inspection and identifying a direction for each edge feature;
comparing the direction edge shape of the package under inspection to the stored direction edge shape of the sample package;
determining a direction edge shape of the leads of the package under inspection, wherein the step of determining the direction edge shape for the leads of the package under inspection further comprises identifying edge features in the image of the leads which extend from the package under inspection and identifying a direction for each edge feature; and
comparing the direction edge shape of the leads of the package under inspection to the direction edge shape of the sample leads and to the direction edge shape of the package under inspection. - View Dependent Claims (6, 7, 8)
- obtaining an image of a sample package and leads which extend from the sample package;
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9. A method of inspecting a semiconductor package, wherein the semiconductor package has a number of edge features, the method comprising:
- obtaining an image of the package;
performing direction edge enhancement to form a direction edge shape, wherein the step of performing a direction edge enhancement further comprises the steps of identifying edge features of the image of the package and identifying a direction for each edge feature;
dilating the direction edge shape; and
testing the dilated direction edge shape for correlation to a predetermined shape which has been previously stored. - View Dependent Claims (10, 11, 12, 13)
- obtaining an image of the package;
Specification