Interconnect package having means for waveguide transmission of RF signals
First Claim
1. An interconnect package for an integrated circuit chip having at least one chip contact pad on a first surface, comprising:
- a support member for supporting the chip;
an interconnect member disposed in opposing relation to the first surface of the chip for transmission of at least one of electrical currents or signals to and from the chip; and
means for waveguide transmission of signals to and from the chip, including;
an interconnect transmission line disposed on a surface of said interconnect member and electrically coupled to one of the at least one chip contact pad;
a package ground means on said support member wherein a chip ground plane on a second surface of the chip is substantially parallel to said package ground means and electrically coupled thereto; and
dielectric means disposed between said interconnect transmission line and said package ground plane.
1 Assignment
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Accused Products
Abstract
An interconnection package is provided for a circuitry component, such as an integrated circuit, comprising a support member for supporting the circuitry component and an interconnect member placed over the circuitry component. The interconnect member has interconnect transmission lines on at least one surface for transmitting currents and signals to and from the circuitry component. When the package is to contain a monolithic microwave integrated circuit (MMIC), millimeter waveguides are employed to transmit RF signals to and from the MMIC through the package. The MMIC is positioned in cavities in the support member and the interconnect member is placed over the MMIC. RF interconnect transmission lines on the interconnect member can be connected directly to RF contact pads on the MMIC or can be electromagnetically coupled. DC interconnect transmission lines are connected directly to DC contact pads on the integrated circuit. Use of the support member and the interconnect member provides a total of three levels on which to dispose interconnect transmission networks, including cross-overs, and peripheral circuit components.
212 Citations
46 Claims
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1. An interconnect package for an integrated circuit chip having at least one chip contact pad on a first surface, comprising:
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a support member for supporting the chip; an interconnect member disposed in opposing relation to the first surface of the chip for transmission of at least one of electrical currents or signals to and from the chip; and means for waveguide transmission of signals to and from the chip, including; an interconnect transmission line disposed on a surface of said interconnect member and electrically coupled to one of the at least one chip contact pad; a package ground means on said support member wherein a chip ground plane on a second surface of the chip is substantially parallel to said package ground means and electrically coupled thereto; and dielectric means disposed between said interconnect transmission line and said package ground plane. - View Dependent Claims (2, 3, 4, 11, 13, 14, 43, 44, 45, 46)
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5. An interconnect package for a monolithic microwave integrated circuit chip having an RF contact pad on a first surface, the interconnect package including:
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a support member for supporting the chip; an interconnect member disposed in opposing relation to the first surface of the chip for transmission of at least one of electrical currents or signals to and from the chip; a package ground means on said support member wherein a chip ground plane on a second surface of the chip is in substantial planar contact with said package ground means; an RF interconnect transmission line disposed on a surface of said interconnect member, said RF interconnect transmission line having a first end; dielectric layer disposed between said RF interconnect transmission line and said package ground means; and RF coupling means for coupling the RF contact pad with said first end of said RF interconnect transmission line; wherein said RF interconnect transmission line, said package ground means and said dielectric layer form a waveguide for transmission of RF signals to and from the chip. - View Dependent Claims (6, 7, 8, 9, 10, 12)
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15. An interconnect package for a monolithic microwave integrated circuit chip, comprising:
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a carrier having a recess in a first surface thereof to retain the chip; a package ground means disposed on a second surface of said carrier, whereby a chip ground plane on a first surface of the chip is in substantial planar contact with said package ground means; an interconnect substrate positioned proximate to and substantially parallel to said first surface of said carrier, said interconnect substrate having; an RF interconnect transmission line disposed on a surface of said interconnect substrate; and a DC interconnect transmission line disposed on a surface of said interconnect substrate; a dielectric layer disposed between said interconnect transmission lines and said package ground means; means for coupling an RF contact pad on the chip to said RF interconnect transmission line; and means for coupling a DC contact pad to the chip to said DC interconnect transmission line; whereby said RF interconnect transmission line, said package ground means and said dielectric layer form a waveguide for transmission of RF signals to and from the RF contact pad of the chip. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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30. An interconnect package for an integrated circuit chip having an internal waveguide for transmission of RF signals within the chip and connected to at least one chip contact pad on a first surface, comprising:
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a carrier having a recess formed in a first surface thereof for retaining the chip; means for waveguide transmission of RF signals to and from the chip, including; an interconnect substrate disposed proximate and substantially parallel to said carrier; an interconnect transmission line disposed on a surface of said substrate and having first and second ends; a conductive surface supported by said carrier in opposing relation to said interconnect transmission line; and dielectric means disposed between said interconnect transmission line and said conductive surface; and means for coupling the at least one chip contact pad on a chip to be retained in the recess to said first end of said interconnect transmission line for substantially continuous waveguide transmission of RF signals to and from the chip to be retained in the recess. - View Dependent Claims (31, 32, 33, 40, 41, 42)
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34. An interconnect package for an integrated circuit chip having at least one chip contact pad on a first surface, comprising:
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a carrier having a recess formed in a first surface thereof for retaining the chip; an interconnect substrate disposed proximate and substantially parallel to said carrier; an interconnect transmission line disposed on a surface of said substrate and having first and second ends; means for coupling the chip contact pad to said first end of said interconnect transmission line, wherein said interconnect transmission line is operable for transmission of electrical currents to and from the chip; and means for transmission of RF signals to and from the chip, comprising; a package ground means disposed on a second surface of said carrier wherein a chip ground plane on a second surface of the chip is in substantial planar contact with said package ground means; an RF interconnect transmission line disposed on a surface of said interconnect substrate, said RF interconnect transmission line having a first end; a dielectric layer disposed between said RF interconnect transmission line and said package ground means; and RF coupling means for coupling the contact pad with a first end of said RF interconnect transmission line; wherein said RF interconnect transmission line, said package ground means and said dielectric layer form a waveguide for transmission of RF signals. - View Dependent Claims (35, 36, 37, 38, 39)
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Specification