Method of making resin molded semiconductor device

• US 5,139,969 A
• Filed: 07/01/1991
• Issued: 08/18/1992
• Est. Priority Date: 05/30/1990
• Status: Expired due to Term

• Current Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Original Assignee: Mitsubishi Denki Kabushiki Kaisha (Mitsubishi Electric Corporation)
• Inventors: Mori, Ryuichiro
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US07/725,895
• Time in Patent Office: 414 Days
• Field of Search: 357/72, 357/68, 357/70, 437/183, 437/203, 437/207, 437/211, 437/214
• US Class Current: 438/123
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A resin molded semiconductor device includes external electrodes provided on and connected to the electrodes of a semiconductor element. The semiconductor device is produced by coating the electrodes of the semiconductor element with a coating resin encapsulating the semiconductor element in a sealing resin in a mold and then dissolving the coating resin. Then, a metal is disposed in the holes formed in the sealing resin to provide external electrodes. Since the external electrodes are provided on the electrodes of the semiconductor element, the packaging area has the same dimensions as the resin package, and the packaging area of the semiconductor device can be reduced.

Claims

1. A method of producing a resin molded semiconductor device comprising:

applying a coating resin to the electrodes of a semiconductor element;

placing said semiconductor element on a die pad of a lead frame;

encapsulating said semiconductor element and lead frame in a sealing resin in a mold with said mold contacting the coated resin;

selectively dissolving said coating resin to form holes in said sealing resin extending to said electrodes; and

disposing metal in said holes to form external electrodes.

2. A method according to claim 1 including forming said external electrodes by plating.

3. A method according to claim 1 wherein said coating resin is a vinyl resin.

4. A method according to claim 1 wherein said coating resin is an acrylic resin.

5. A method according to claim 1 including selectively dissolving said coating resin with acetone.