Method for making a semiconductor package with the distance between a lead frame die pad and heat spreader determined by the thickness of an intermediary insulating sheet

• US 5,139,973 A
• Filed: 12/17/1990
• Issued: 08/18/1992
• Est. Priority Date: 12/17/1990
• Status: Expired due to Term

• Current Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Original Assignee: Allegro Microsystems Incorporated (Sanken Electric Company Limited)
• Inventors: Feinstein, Leonard G., Kasem, Yehya M., Nagy, Bela G.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US07/628,513
• Time in Patent Office: 610 Days
• Field of Search: 437/206, 437/207, 437/211, 437/212, 437/214, 437/220, 437/902, 357/80, 357/81, 357/70
• US Class Current: 29/827
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/16 Fillings or auxiliary members in containers or encapsulations, e.g. centering rings H01L23/42, H01L23/552 take precedence
• CPC Class Codes: H01L 23/4334 Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: Y10T 29/49121 Beam lead frame or beam lead device

Abstract

A lead frame and die sub-assembly is first manufactured by a conventional method including bonding a die to the die attach pad of a lead frame and connecting wires between the die and the lead frame fingers. The sub-assembly is stacked first adjacent a dielectric plastic sheet that is in turn stacked against a metal heat spreader block. The dielectric sheet has a centrally located hole registered with the die attach pad. A dollop of an uncured resin is dispensed in the gap between the die attach pad and block. This assembly is compressed between two hot platens whereby the lead fingers, dielectric sheet and the block are bonded together and the resin dollop is flattened to a controlled thickness, namely the thickness of the dielectric sheet. The thickness of the dielectric sheet controls the flattened thickness of the cured resin dollop. After the platens are withdrawn, the local portion of the lead frame having been bonded in the stack is then put into a mold and the stack assembly encapsulated in a thermosetting resin to produce the semiconductor package.

Claims

1. A method for making a semiconductor device package comprising in the following order:

a) bonding a back face of a semiconductor device die to a front oriented side of the die attach pad of a patterned sheet metal lead frame;

b) connecting, via wires, the terminals on the front face of said die to the front oriented side of distal end portions of the lead fingers of said lead frame, the back sides of said distal finger end portions and the back side of said die attach pad lying in one plane to form a lead frame die sub-assembly;

c) forming a stack comprising (1) said lead frame die sub-assembly;

(2) a uniformly thick electrically insulating sheet of a fully cured polymeric material having a central opening of greater dimensions than those of said die attach pad, said sheet abutting the back oriented side of said lead frame with said central opening registered with said die attach pad; and

(3) a heat spreader comprised of a metal block, said distal finger end portions being separated from said heat spreader block in said stack by an intervening portion of said insulating sheet, the space between said die attach pad and said heat spreader block being determined by the thickness of said insulating sheet; and

d) bonding said dielectric sheet to the front side of said heat spreader and to the back sides of said distal finger end portions.

2. The method of claim 1 wherein said insulating sheet has an adhesive coating on both major surfaces thereof.

3. The method of claim 2 wherein said adhesive coating is heat-curable adhesive coating.

4. The method of claim 3 wherein said adhesive coating is a partially cured polymer.

5. The method of claim 3 wherein said adhesive coating is a B-stage epoxy.

6. The method of claim 2 additionally comprising, simultaneously with said bonding, compressing said stack between two platens that together form a central cavity encompassing without contacting said die and wires.

7. The method of claim 6 wherein said platens are held at an elevated temperature of about 175°

C. to at least partially cure said adhesive coating simultaneously with said compressing.

8. The method of claim 6 additionally comprising, prior to said forming a stack, dispensing a dollop of an uncured plastic adhesive material to either the back oriented side of said die attach pad or to the predetermined front surface area of said heat spreader that will lie adjacent said die attach pad in said stack, the thickness of said dispensed dollop being greater than the space between said die attach pad and said heat spreader, so that during said compressing said dollop is flattened to conform with said space and may be cured for attaching said die attach pad to said heat spreader block.

9. The method of claim 8 additionally comprising heating said partially cured dollop to less than 200°

C. to fully cure said dollop and to provide a controlled thermal-conductor path between said die attach pad and said heat spreader.

10. The method of claim 1 wherein the temperatures to which said insulating sheet is exposed in said method, during and after said forming a stack, are less than 200°

C.

11. The method of claim 8 wherein said plastic adhesive material is an electrically insulating dielectric material.

12. The method of claim 8 wherein said plastic adhesive material is loaded with electrically conductive particles to render said dollop electrically conductive.