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Semiconductor assembly utilizing elastomeric single axis conductive interconnect

  • US 5,140,405 A
  • Filed: 03/29/1991
  • Issued: 08/18/1992
  • Est. Priority Date: 08/30/1990
  • Status: Expired due to Term
First Claim
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1. A semiconductor assembly comprising:

  • a die having substantially planar first and second engagement surfaces, a defined thickness therebetween, and having external edges which define a die external shape, the first engagement surface including one or more conductive pads;

    a base having an opening formed therein, the base opening having peripheral edges which define an opening shape which is complementary to the die external shape, the opening being sized to receive and engage the die, the die being so received within the base opening with the opening edges engaging the die edges to spatially fix the die in a selected orientation in a plane parallel to the die first planar engagement surface;

    an interconnecting plate having at least one substantially planar engagement surface facing the first planar engagement surface of the die received within the base opening, the plate planar engagement surface having one or more conductive pads and conductive traces formed thereon, at least one conductive pad of the plate planar engagement surface being spatially aligned with one conductive pad on the first engagement surface of the die received within the base opening;

    a sheet of anisotropically conductive elastomeric material that is electrically conductive in a direction across its thickness, the sheet being interposed between the base and interconnecting plate between the first engagement surface of the die and engagement surface of the interconnecting plate; and

    clamping means engaging the base and interconnecting plate for urging the die and plate toward one another in spatial registration to conductively engage the at least one conductive pad of the die with the at least one conductive pad of the interconnecting plate through the sheet of anisotropically conductive elastomeric material.

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