Method for forming traces on side edges of printed circuit boards and devices formed thereby

• US 5,140,745 A
• Filed: 07/23/1990
• Issued: 08/25/1992
• Est. Priority Date: 07/23/1990
• Status: Expired due to Fees

• Current Assignee: Joseph A. Mckenzie Jr
• Original Assignee: Joseph A. Mckenzie Jr
• Inventors: McKenzie, Joseph A. Jr.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US07/556,080
• Time in Patent Office: 764 Days
• Field of Search: 29/852, 29/846, 29/830, 29/426.1, 29/412, 29/413, 361/403, 361/404, 361/406, 361/424, 361/395, 174/263, 174/266, 427/97, 427/98, 264/61
• US Class Current: 29/852
• CPC Class Codes: H01L 21/486 Via connections through the substrate with or without pins
• CPC Class Codes: H01L 2924/15313 being a land array, e.g. LGA
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/09181 Notches in edge pads
• CPC Class Codes: H05K 2201/10984 Component carrying a connection agent, e.g. solder, adhesive
• CPC Class Codes: H05K 2203/045 Solder-filled plated through-hole [PTH] during processing wherein the solder is removed from the PTH after processing
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers
• CPC Class Codes: H05K 3/403 Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof H05K3/4092 takes precedence
• CPC Class Codes: H05K 3/42 Plated through-holes or plated via connections
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49789 Obtaining plural product pieces from unitary workpiece
• CPC Class Codes: Y10T 29/4979 Breaking through weakened portion

Abstract

During the manufacture of a printed circuit board, holes are drilled not only in accordance with a particular circuit board pattern, but also along the lines which will define edges of the board at the positions where traces are to appear. All of the holes are then plated through. The holes along the edges of the board are completely filled with solder. The board is then cut along the previously defined edge lines to cut the solder filled holes in half. This creates a trace and a solder reservoir along the edge of the board.

Claims

1. A method of forming traces on a peripheral side edge of a printed circuit board comprising:

providing a printed circuit board having at least one connector pattern defined thereon;

forming a plurality of trace bores about a periphery of said connector pattern;

plating through all holes on said printed circuit board;

after said step of plating, masking all holes on said printed board except said trace bores;

after said step of masking, filling said trace bores with solder; and

cutting said printed circuit board along a line defined by said trace bores so as to expose at least a portion of the solder in said trace bores, thereby defining a printed circuit board having a plurality of distinct traces along peripheral side edge thereof.

2. A printed circuit board formed by the method of claim 1.

3. A method as in claim 1, wherein said step of forming a plurality of trace bores comprises drilling a series of holes in said printed circuit board in surrounding relation to said connector pattern so that cutting said printed circuit board along said line defined by said trace bores defines a printed circuit board having a plurality of distinct traces along an outer peripheral side edge thereof.

4. A method as in claim 1, wherein said step of forming a plurality of trace bores comprises drilling a series of holes in said printed circuit board about an inner periphery of said connector pattern whereby said step of cutting said printed circuit board along a line defined by said trace bores defines a printed circuit board having a plurality of distinct traces along an inner peripheral side edge thereof.

5. A method as in claim 1, wherein said step of forming a plurality of trace bores and filling said trace bores comprises forming a first array of trace bores and filling said first array of trace bores with solder and then forming a second array of trace bores which are one of slightly outward, slightly inward, and along the same line as said first array of trace bores, and said step of cutting comprises cutting along a line defined by said first array of trace bores whereby grooves are defined between each of said traces along said peripheral side edge of said printed circuit board.

6. A printed circuit board formed by the method of claim 3.

7. A printed circuit board formed by the method of claim 4.

8. A printed circuit board having at least one connector pattern defined thereon and having a window defined therethrough so that said printed circuit board has an inner peripheral side edge and an outer peripheral side edge;

and a plurality of part cylindrical cut-outs defined along at least one of said inner and said outer peripheral side edges, each said part cylindrical cut-out having solder disposed therewithin.

9. A printed circuit board as in claim 8, wherein at least one of said at least one part cylindrical cut-outs has a longitudinal axis substantially perpendicular to a horizontal plane of said printed circuit board.

10. A printed circuit board as in claim 8, wherein said side edge is a peripheral side edge defined in surrounding relation to said at least one connector pattern so that said printed circuit board has a plurality of distinct traces defined along an outer peripheral side edge thereof.

11. A printed circuit board as in claim 8, wherein said side edge is defined about an inner periphery of said connector pattern so that said cut-outs having said solder therein define a plurality of distinct traces along an inner peripheral side edge of said printed circuit board.

12. A printed circuit board having at least one connector pattern defined thereon and having a side edge;

and at least one part cylindrical cut-out defined on said peripheral side edge, said at least one part cylindrical cut-out having solder disposed therewithin, said solder projecting beyond the respective side edge of the board.

13. A printed circuit board having at least one connector pattern defined thereon and having a side edge;

and at least two part cylindrical cut-outs defined on said peripheral side edge, each said part cylindrical cut-out having solder disposed therewithin, and a further part cylindrical cut-out defined between each adjacent pair of said at least two part cylindrical cut-outs.