Circuit board with cooling device

• US 5,142,441 A
• Filed: 02/23/1989
• Issued: 08/25/1992
• Est. Priority Date: 02/25/1988
• Status: Expired due to Fees

• Current Assignee: Alcatel NV (Nokia Corporation)
• Original Assignee: Alcatel NV (Nokia Corporation)
• Inventors: Thaidigsmann, Otto, Smernos, Stauros, Richter, Horst, Seibold, Gerhard, Florjancic, Matjaz
• Primary Examiner(s): Tolin, Gerald P.
• Application Number:
  US07/314,079
• Time in Patent Office: 1,279 Days
• Field of Search: 361/382-388, 361/412, 361/414, 165/185, 174/68.5, 174/15.1, 174/15.2, 174/16.1, 174/252, 174/259
• US Class Current: 361/689
• CPC Class Codes: H05K 1/0272 Adaptations for fluid transport, e.g. channels, holes
• CPC Class Codes: H05K 2201/064 Fluid cooling, e.g. by integral pipes

Abstract

A circuit board with a cooling device having channels through which a cooling agent flows, the circuit board being comprised of at least three united layers including an inner layer wherein the channels are formed.

Claims

1. A circuit board for electrical components comprising a nonconducting substrate having conductor paths on at least one outer surface thereof and wherein:

said substrate comprises two electrically nonconducting outer layers and an electrically nonconducting inner layer disposed between said outer layers and having channels through which a cooling agent may flow;

said inner and outer layers of said substrate are joined by an adhesive; and

said conductor paths are disposed on an outer surface of at least one of said outer layers.

2. A circuit board as defined in claim 1, wherein said adhesive comprises respective adhesive films.

3. A circuit board as defined in claim 2, wherein said adhesive films comprise a polymerized synthetic resin.

4. A circuit board as defined in claim 1, wherein said channels expose both said outer layers to the cooling agent which flows through said channels.

5. A circuit board as defined in claim 1, wherein said channels in said inner layer are closed by joining said two outer layers to said inner layer.

6. A circuit board as defined in claim 1, wherein said channels extend vertically completely through said inner layer.

7. A circuit board as defined in claim 1, wherein conductor paths are disposed on a respective outer surface of each of said outer layers.

8. A circuit board as defined in claim 1, wherein said channels extend to at least an associated outer surface of said inner layer.

9. A circuit board as claimed in claim 1 wherein said channels are constituted by slots provided in said inner layer.

10. A circuit board as claimed in claim 1 wherein said channels are constituted by recesses provided in said inner layer.