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Cryogenic cooling of circuit boards

  • US 5,142,443 A
  • Filed: 04/29/1991
  • Issued: 08/25/1992
  • Est. Priority Date: 04/29/1991
  • Status: Expired due to Fees
First Claim
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1. A cryogenic cooling mount for integrated circuits, comprising:

  • a chip support plate for supporting at least one integrated circuit chip;

    means for allowing electrical communication with the chip;

    a piston plate supporting said support plate, said piston plate being formed of a material allowing thermal conductivity through said piston plate;

    a cold head supporting, and in thermal communication with, said piston plate, said cold head being formed of a material allowing thermal conductivity through said cold head;

    cryogenic heat sink means in thermal communication with said cold head, at least a portion of said cold head forming operative structure of said heat sink means; and

    thermally insulating hood means surrounding said support plate, said piston plate and said cold head, said head means being coupled to said cold head.

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