Polyurethane reactive adhesive compounds containing finely dispersed polymers

• US 5,143,987 A
• Filed: 09/05/1990
• Issued: 09/01/1992
• Est. Priority Date: 09/09/1989
• Status: Expired due to Fees

• Current Assignee: Bayer AG
• Original Assignee: Bayer AG
• Inventors: Hess, Heinrich, Kopp, Richard, Hansel, Eduard, Grogler, Gerhard, Arend, Gunter
• Primary Examiner(s): Kight, III, John
• Assistant Examiner(s): TRUONG, DUC
• Application Number:
  US07/577,979
• Time in Patent Office: 727 Days
• Field of Search: 525/458, 525/124, 525/452, 525/453, 525/455, 525/457, 521/137, 521/125, 521/126, 156/307.3, 528/44, 528/272, 528/68, 428/262, 428/425, 428/426
• US Class Current: 525/458
• CPC Class Codes: C08G 18/40 High-molecular-weight compounds C08G18/2805 takes precedence
• CPC Class Codes: C08G 18/409 Dispersions of polymers of C08G in organic compounds having active hydrogen
• CPC Class Codes: C08G 18/707 the liquid medium being a compound containing active hydrogen not comprising water
• CPC Class Codes: C08G 18/8038 with compounds of C08G18/3225
• CPC Class Codes: C08L 2666/02 Organic macromolecular compounds, natural resins, waxes or and bituminous materials
• CPC Class Codes: C09J 175/04 Polyurethanes

Abstract

The present invention is directed to a polyurethane reactive adhesive compound comprising:

A) one or more polyisocyanates having an inactivated particle surface,

B) at least one isocyanate reactive compound having a molecular weight MG_w greater than 400, and

C) finely dispersed polymer particles, wherein the polymer is solid at temperatures below 70° C. and has a molecular weight MG_w of at least 3000.

Claims

1. A polyurethane reactive adhesive compound comprising:

A) one or more polyisocyanates having an inactivated particle surface,

B) at least one isocyanate reactive compound having a molecular weight MG_w greater than 400, and

C) finely dispersed polymer particles, wherein the polymer is solid at temperatures below 70°

C. and has a molecular weight MG_w of at least 3000, and selected from the group consisting of a linear hydroxypolyurethane, a copolyamide, a copolymer of α

-olefins, a polyvinyl alcohol, a polyvinyl formal, a polyvinyl acetal, a substantially linear polyester, a copolymer of acrylonitrile, butadiene and styrene having a polybutadiene content of 0.1 50% by weight, a (co)polymer of polyvinyl chloride, polyethylene, a copolymer of styrene and acrylonitrile.

2. The adhesive compound of claim 1 wherein said polymer particles have average particle diameters of from 100 to 500 μ

m.

3. The adhesive compound of claim 1 wherein at least 99% by weight of said polymer particles have an average particle diameter of at least 0.25 μ

m.

4. The adhesive compound of claim 1 wherein said polymer is a substantially linear hydroxypolyurethanes produced by reacting i) linear-polyethers and/or polyesters and/or polyether esters with ii) aromatic polyisocyanates.

5. The adhesive compound of claim 1 wherein said polymer is a copolyamide based on caprolactam and/or lauryl lactam or on caprolactam and dimeric fatty acids.

6. The adhesive compound of claim 1 wherein said polymer is selected from the group consisting of copolymers of α

-olefines, polyvinyl formals, acrylonitrile/butadiene/styrene copolymers and substantially linear polyesters.

7. The adhesive compound of claim 1 wherein said polyisocyanate A) is a solid, finely divided polyisocyanates having a melting point above 80°

C. in which from 0.1 to 25 equivalents % of the isocyanate groups are inactivated.

8. The adhesive compound of claim 1 wherein the isocyanate reactive compounds B) contained therein are polyols and/or polyamines.

9. The adhesive compound of claim 1 further containing one or more chain lengthening agents having a molecular weight below 400.

10. In a process for bonding substrates with a polyurethane reactive adhesive by applying said adhesive to one or both of the substrates to be bonded, bringing the thus coated substrates together, and curing said reactive adhesive mixture, the improvement wherein said adhesive is the adhesive compound of claim 1.