Apparatus and method for positioning an integrated circuit chip within a multichip module
First Claim
1. A method for attaching an integrated circuit chip to an upper surface of a substrate having a fiducial mark thereon, said attaching method utilizing a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a chip alignment stage for holding and aligning a chip relative to XY table motion, said second rotational adjustment stage comprising a substrate alignment stage, said attaching method further utilizing a chip pickup for removing said chip from said chip alignment stage and for placing said chip on said substrate and a memory means containing desired positional offset information for said chip relative to said substrate fiducial mark, said method comprising the steps of:
- (a) placing a substrate on said substrate alignment stage, said substrate having an adhesively coated upper surface;
(b) aligning said substrate relative to XY table motion;
(c) locating and saving in said memory means the position of the fiducial mark on said substrate;
(d) placing a chip on said chip alignment stage;
(e) aligning said chip relative to XY table motion, said chip aligning being accomplished with reference to a characteristic feature of said chip;
(f) energizing said chip pickup to lift said chip from said die alignment stage;
(g) positioning said substrate under said chip by moving said XY table;
(h) recalling from said memory means the stored offset for said chip relative to said fiducial mark on said substrate;
(i) lowering said chip to a desired location on the upper surface of said substrate based on said recalled, chip offset location, and allowing a portion of the weight of said chip pickup to be applied to said chip;
(j) holding said chip pickup against said chip for a period of time to allow said chip to adhesively attach to said substrate; and
(k) releasing said chip from said chip pickup.
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Accused Products
Abstract
A multichip integrated circuit package comprises a substrate having a flat upper surface to which is affixed one or more integrated circuit chips having interconnection pads. A polymer encapsulant completely surrounds the integrated circuit chips. The encapsulant is provided with a plurality of via openings therein to accommodate a layer of interconnection metallization. The metallization serves to connect various chips and chip pads with the interconnection pads disposed on the chips. In specific embodiments, the module is constructed to be repairable, have high I/O capability with optimal heat removal, have optimized speed, be capable of incorporating an assortment of components of various thicknesses and function, and be hermetically sealed with a high I/O count. Specific processing methods for each of the various module features are described herein, along with additional structural enhancements.
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Citations
26 Claims
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1. A method for attaching an integrated circuit chip to an upper surface of a substrate having a fiducial mark thereon, said attaching method utilizing a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a chip alignment stage for holding and aligning a chip relative to XY table motion, said second rotational adjustment stage comprising a substrate alignment stage, said attaching method further utilizing a chip pickup for removing said chip from said chip alignment stage and for placing said chip on said substrate and a memory means containing desired positional offset information for said chip relative to said substrate fiducial mark, said method comprising the steps of:
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(a) placing a substrate on said substrate alignment stage, said substrate having an adhesively coated upper surface; (b) aligning said substrate relative to XY table motion; (c) locating and saving in said memory means the position of the fiducial mark on said substrate; (d) placing a chip on said chip alignment stage; (e) aligning said chip relative to XY table motion, said chip aligning being accomplished with reference to a characteristic feature of said chip; (f) energizing said chip pickup to lift said chip from said die alignment stage; (g) positioning said substrate under said chip by moving said XY table; (h) recalling from said memory means the stored offset for said chip relative to said fiducial mark on said substrate; (i) lowering said chip to a desired location on the upper surface of said substrate based on said recalled, chip offset location, and allowing a portion of the weight of said chip pickup to be applied to said chip; (j) holding said chip pickup against said chip for a period of time to allow said chip to adhesively attach to said substrate; and (k) releasing said chip from said chip pickup. - View Dependent Claims (2, 3)
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4. A method for attaching a first and second integrated circuit chips to an upper surface of a substrate having a reference feature thereon, said attaching method utilizing a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a chip alignment stage and said second rotational adjustment stage comprising a substrate alignment stage, said attaching method further utilizing a chip pickup and memory storage means having at least a prestored desired location information for said second chip relative to a reference feature of said first chip, said method comprising the steps of:
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(a) placing the substrate on said substrate alignment stage, said substrate having an adhesively coated upper surface; (b) aligning said substrate relative to XY table motion; (c) locating and saving in said memory means the position of the substrate reference feature; (d) placing the first chip on said chip alignment stage; (e) aligning said first chip relative to XY table motion, said first chip aligning being accomplished with reference to at least one reference feature of said first chip; (f) energizing said chip pickup to lift said first chip from said chip alignment stage; (g) positioning said substrate under said first chip by moving said XY table; (h) recalling from said memory means the stored offset for said first chip relative to said substrate reference feature; (i) lowering said first chip to the desired location on the upper surface of said substrate based on said recalled, first chip offset location, and allowing a portion of the weight of said chip pickup to be applied to said first chip; (j) releasing said first chip from said chip pickup; (k) placing the second chip on said chip alignment stage; (l) aligning said second chip relative to XY table motion, said second chip aligning being accomplished with reference to at least one characteristic feature of said second chip; (m) energizing said chip pickup to lift said second chip from said chip alignment stage; (n) positioning said substrate under said second chip by moving said XY table; (o) recalling from said memory means the prestored desired location information for said second chip relative to a reference feature of said first chip; (p) lowering said second chip to the desired location on the upper surface of said substrate based on said recalled, second chip offset location, and allowing a portion of the weight of said chip pickup to be applied to said second chip; and (q) releasing said second chip from said pickup. - View Dependent Claims (5, 6)
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7. A method for accurately positioning a plurality of die on a substrate without reference to a substrate fudicial mark, said substrate having a first physical reference feature and a first one of said plurality of die having a second physical reference feature, said method comprising the steps of:
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(a) positioning said first one of said die relative to said first physical feature of said substrate; and (b) subsequent said step (a), positioning the remaining die of said plurality of die on said substrate relative to said second physical reference feature of said first die positioned on said substrate, wherein only said first die is positioned on said substrate relative to said substrate first physical reference feature while the reaming chips are placed on said substrate relative to said first die'"'"'s second physical reference feature. - View Dependent Claims (8, 9)
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10. Apparatus for accurately positioning a plurality of die on a substrate without reference to a substrate fiducial mark, said apparatus comprising:
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first means for positioning a first one of said die relative to a physical feature of said substrate, said first die having a first physical feature to facilitate the subsequent positioning of said plurality of die on said substrate; and second means operatively associated with and responsive to said first means for accurately positioning the remaining die of said plurality of die on said substrate relative to the physical feature on an upper surface of the first die positioned on said substrate by said first means, wherein said chips are each accurately positioned relative to one another within the tolerances of said second positioning means'"'"' capability to recognize said first die'"'"'s first physical feature. - View Dependent Claims (11, 12, 13, 14)
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15. Apparatus for accurately positioning a die relative to a substrate having a fiducial mark thereon, said apparatus comprising:
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a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a die alignment stage for holding and aligning a die relative to XY table motion based on a physical feature of the die, said second rotational adjustment stage comprising a substrate alignment stage, said substrate alignment stage including means for holding said substrate having said fiducial mark thereon; locating means operatively associated with said high accuracy XY table for locating the fiducial mark on said substrate; a die pickup operatively associated with said high accuracy XY table for removing said die from said die alignment stage and for placing said die on said substrate; and control processing means coupled to said first and second rotational adjustment stages of said XY table, said locating means and said die pickup, for controlling the respective alignment of said substrate and said die, and transfer of said die to the desired location on said substrate relative to said located fiducial mark using said die pickup. - View Dependent Claims (16, 17, 18, 19, 20)
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21. Apparatus for accurately positioning a die having a first physical feature relative to a substrate having a second physical feature, said apparatus comprising:
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a high accuracy XY table, said table having a first rotational adjustment stage and a second rotational adjustment stage, said first rotational adjustment stage comprising a die alignment stage for holding and aligning the die relative to XY table motion based on said first physical feature of the die, said second rotational adjustment stage comprising a substrate alignment stage, said substrate alignment stage including means for holding said substrate; locating means operatively associated with said high accuracy XY table for locating said second physical feature on said substrate; a die pickup operatively associated with said high accuracy XY table for removing said die from said die alignment stage and for placing said die on said substrate; and control processing means coupled to said first and second rotational adjustment stages of said XY table, said locating means and said die pickup, for controlling the respective alignment of said substrate and said die, and transfer of said die to the desired location on said substrate relative to said located substrate second physical feature. - View Dependent Claims (22, 23, 24, 25, 26)
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Specification