Micromechanical tilt sensor

• US 5,148,604 A
• Filed: 05/17/1991
• Issued: 09/22/1992
• Est. Priority Date: 05/22/1990
• Status: Expired due to Fees

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Bantien, Frank
• Primary Examiner(s): HAROIAN, HARRY
• Application Number:
  US07/701,781
• Time in Patent Office: 494 Days
• Field of Search: 33/366, 33/391
• US Class Current: 33/366.12
• CPC Class Codes: G01C 9/06 Electric or photoelectric indication or reading means
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up
• CPC Class Codes: G01P 2015/0834 the mass constituting a pendulum having the pivot axis disposed symmetrically between the longitudinal ends, the center of mass being shifted away from the plane of the pendulum which includes the pivot axis
• CPC Class Codes: G01P 2015/086 using a torsional suspension spring

Abstract

A sensor for measurement of tilt or inclination angle features a sensor element made from a monocrystalline silicon wafer, from which is etched at least one movable silicon mass. The silicon mass is freed from the surrounding wafer by an etch groove which completely penetrates the silicon wafer, and is connected to the silicon wafer by two bars lying in a common axis, so that, upon flexing or torsioning of the bars, the silicon mass is movable or rotatable about the axis of the bars. The sensor element is connected with an upper and/or a lower cover. On at least one of the covers, adjacent the silicon mass, at least two electrodes are placed. The silicon mass and the two electrodes form a pair of capacitances, and the movement or excursion of the silicon mass is detected by evaluation of the difference between the capacitances.

Claims

1. Sensor for tilt measurement, having a sensor element made from a monocrystalline silicon wafer (10), a movable silicon mass (16) etched out of said wafer (10), and means for evaluation of the displacement of said silicon mass,

characterized in that

said silicon mass (16) is defined by a surrounding etch groove (13) which completely penetrates silicon wafer (10), said mass (16) being connected to said silicon wafer (10) by two torsion bars aligned along a single axis,

said silicon mass (16) is movable by a rotation about the bar axis by twisting of said torsion bars (14, 15),

said sensor element is connected to at least one of an upper cover (11) and a lower cover (12),

on at least one of said covers (11, 12) at least two electrodes (19,20) are provided in the area of the silicon mass (16), and

said silicon mass (16) and two electrodes (19,20) form capacitances whose difference in values is used for evaluation of the movement of the silicon mass.

2. Sensor according to claim 1,

characterized in that

at least one of the upper cover (11) and the lower cover (12) is formed with a recess (17, 18) adjacent the silicon mass (16).

3. Sensor according to claim 1,

characterized in that

at least one of the movable silicon mass (16) and the rods (14, 15) are reduced in thickness, thereby defining respective spaces from the rods and the silicon masses to their upper cover (11) and to their lower cover (12).

4. Sensor according to claim 1,

characterized in that

at least two electrodes (19, 20) are formed from a metallic layer placed on at least one of said upper cover (11) and said lower cover (12).

5. Sensor according to claim 1,

characterized in that

said lower cover (12) and said upper cover (11) are of a material selected from the group consisting of silicon and glass.

6. Sensor according to claim 1,

characterized in that

said silicon wafer (10) is connected by anodic bonding to at least one of a lower cover (11) and an upper cover (12).

7. Sensor according to claim 1,

characterized in that

said silicon wafer (10) has a crystal orientation selected from the group consisting of

(100) orientation and (110) orientation.

8. Sensor according to claim 1,

characterized in that

said silicon wafer (10) is formed of, an n- or p-doped substrate (9) and a differently doped epitaxial etch-stop layer (8), thereby defining a doping transition between said substrate and said etch-stop layer (8).

9. Sensor according to claim 8

characterized in that

the silicon wafer has (100) crystal orientation and

the bar axis is oriented in one of the (100) directions in the wafer surface.

10. Sensor according to claim 8,

characterized in that

said doping transition is a pn-transition and that the silicon mass (16) is in electrical contact with the wafer surface due to at least one of:

a doping of said substrate (9) adjacent the silicon mass (16);

a doping of the epitaxial layer (8) adjacent the silicon mass (16); and

a doping of the epitaxial layer (8) adjacent the bars (14,15).

11. Sensor according to claim 8,

characterized in that

the substrate (9) is etched way in the area of the bars (14, 15).

12. Sensor according to claim 1,

further comprising

at least one further sensor whose bar axis is perpendicular to the bar axis of the first sensor.

13. Sensor according to claim 1,

further comprising

at least one further sensor of the same kind, whose excursion direction is perpendicular to the excursion direction of the first sensor, so that the bar axes of said first and said further sensor are oriented parallel.

15. Method of making a sensor element for a sensor according to claim 8,

comprising the steps of

removing said epitaxial layer (8) in an etch-groove region using an isotropic etching process, preferably a trenching process;

etching through the silicon wafer (10) in said etch-groove region in a subsequent electro-chemical, anisotropic etching process from the front side of the wafer; and

under-etching the bars (14,

     15) electrochemically, using the epitaxial layer (8) as an etch-stop.

16. Method according to claim 15, wherein

said epitaxial layer (8) is passivated using a passivating layer, in which an etch mask is created by photolithographic means, and the structure of said etch mask is provided with corner compensation for the convex corners of the sensor structure of the sensor element.

14. Method of making a sensor element for a sensor,

comprising the steps of

performing anisotropic wet chemical etching from the back side of a silicon wafer (10) to free and define a silicon mass (16) from a substrate layer (9),

using the epitaxial layer (8) as an etch-stop for the back side etching, and

performing isotropic or anisotropic etching from the front side of the silicon wafer (10) to free and define the silicon mass (16) and the bars (14, 15).

17. Method according to claim 14, comprising the steps of

providing a p-substrate (9) with a first p-doping (7) in a region from which a movable silicon mass (16) will be defined,

forming an n-epitaxial layer (8) on said substrate (9);

providing a portion of said layer (8) with a second -doping (6) in a region from which the movable mass (16) and supporting bars (14,

     15) are to be defined, so that the first p-doping (7) and the second p-doping (6) interdigitate.