Coins coated with nickel, copper and nickel and process for making such coins

• US 5,151,167 A
• Filed: 12/04/1991
• Issued: 09/29/1992
• Est. Priority Date: 06/21/1990
• Status: Expired due to Term

• Current Assignee: Royal Canadian Mint (Government of Canada)
• Original Assignee: Royal Canadian Mint (Government of Canada)
• Inventors: Truong, Hieu C., Dilay, Maria
• Primary Examiner(s): Niebling, John
• Assistant Examiner(s): Leader, William T.
• Application Number:
  US07/801,636
• Time in Patent Office: 300 Days
• Field of Search: 205/102, 205/149, 205/181, 205/217, 205/222, 205/227, 205/228, 72/46
• US Class Current: 205/102
• CPC Class Codes: C25D 5/12 at least one layer being of nickel or chromium
• CPC Class Codes: C25D 5/50 by heat-treatment
• CPC Class Codes: C25D 5/605 Surface topography of the layers, e.g. rough, dendritic or nodular layers
• CPC Class Codes: C25D 5/611 Smooth layers
• CPC Class Codes: C25D 5/623 Porosity of the layers
• CPC Class Codes: C25D 5/627 Electroplating characterised by the visual appearance of the layers, e.g. colour, brightness or mat appearance

Abstract

This invention overcomes problems such as pinholes and blisters in making plated coin blanks and similar articles. A ferrous metal blank is electroplated with a strike of nickel, following which a coating of copper is applied at an initial low current density followed by full current density to minimize bridging. The low current density may be about 1/6 to 1/4 of the full current density. Preferably an outer layer of nickel is applied, also at an initial low current density, followed by full current density. Annealing before or after application of the final layer of nickel is advisable. This invention also relates to the resulting coin blank and coins.

Claims

1. A process for making a coin blank or like articles comprising:

a) cleaning a ferrous metal blank so that it will be essentially free of oxide;

b) electroplating said blank with a strike of nickel;

c) electroplating the strike of nickel with a coating of copper by first depositing a thin, initial film of copper at a low current density in a bath that is about 1/6 to 1/4 of the full current density and then depositing the remainder of the copper coating at a full current density in the same bath to minimize or avoid bridging of micropores in the ferrous metal blank.

2. A process as in claim 1, in which in cleaning the blank an acid pickle is used to remove oxides followed immediately by a buffer wash.

3. A process as in claim 1, in which the nickel used for the nickel strike is dull nickel.

4. A process as in claim 1, in which the copper is coated using a acid bath.

5. A process as in claim 1, in which the low current density at which the copper is coated is about 1.2 to 1.5 amps per square foot.

6. A process as in claim 1, in which the low current density at which the copper is coated is about 1.2 to 1.8 amps per square foot, and the full current density is about 6-7 amps per square foot.

7. A process as in claim 1, in which the nickel strike is about 0.8 to 1.2% of the final weight of the coin, and the coating of copper is about 4 to 7% of the final weight of the coin.

8. A process as in claim 1, in which following the application of the copper coating and prior to application of any outer nickel coating the coin blank is annealed at a temperature in the range 500°

C.-600°

C. in the presence of a reducing atmosphere.

9. A process for making a coin blank or like articles comprising:

a) cleaning a ferrous metal blank so that it will be essentially free of oxide;

b) electroplating said blank with a strike of nickel;

c) electroplating the strike of nickel with a coating of copper by first depositing a thin, initial film of copper at a low current density in a bath that is about 1/6 to 1/4 of the full current density and then depositing the remainder of the copper coating at a full current density in the same bath to minimize or avoid bridging of micropores in the ferrous metal blank.

d) electroplating the copper with an outer layer of nickel by first depositing a thin, initial film of nickel at a low current density that is about 1/6 to 1/4 of the full current density and then depositing the remainder of the nickel coating at a full current density to minimize or avoid bridging of micropores in the ferrous metal blank.

10. A process of making a coin as in claim 9 including the step of pressing the coated blank in a coining operation without the development of cracks or pores which would expose the ferrous metal.

11. A process as in claim 9, in which the low current density at which the outer layer of nickel is coated at about 0.5 to 0.7 amps per square foot.

12. A process as in claim 9, in which the low current density at which the outer layer of nickel is coated is about 0.5 to 0.7 amps per square foot, and the full current density at which the outer layer of nickel is coated is about 3-4 amps per square foot.

13. A process as in claim 9, in which the nickel strike is about 0.8 to 1.2% of the final weight of the coin, and the coating of copper is about 4 to 7% of the final weight of the coin, and the outer layer of nickel is about 1 to 11/2 of the final weight of the coin.

14. A process as in claim 9, in which following the outer nickel coating the coin blank is annealed at a temperature in the range 200°

C. to 400°

C. in the presence of a reducing atmosphere to promote the removal of entrapped hydrogen followed by annealing at a temperature of at least 530°

C. to remove stress, improve the grain structure of the copper and promote bonding between the copper and the nickel.