Method and apparatus for endpoint detection in a semiconductor wafer etching system

• US 5,151,584 A
• Filed: 10/15/1991
• Issued: 09/29/1992
• Est. Priority Date: 07/20/1988
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Birang, Manoocher, Ebbing, Peter
• Primary Examiner(s): Nelms, David C.
• Application Number:
  US07/777,770
• Time in Patent Office: 350 Days
• Field of Search: 250/566, 250/201.4, 250/201.5, 250/201.7, 250/561, 250/560, 354/403
• US Class Current: 250/201.4
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24D 7/12 with apertures for inspecting the surface to be abraded
• CPC Class Codes: G01B 11/0683 measurement during deposition or removal of the layer
• CPC Class Codes: G03F 7/70358 Scanning exposure, i.e. relative movement of patterned beam and workpiece during imaging
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 22/26 Acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection, in-situ thickness measurement endpoint detection arrangements in CMP apparatus B24B37/013, in discharge apparatus H01J37/32

Abstract

A method for endpoint detection in a semiconductor wafer etching system characterized by the steps of: 1) scanning a semiconductor wafer with a narrowly focused laser beam; 2) analyzing a reflected portion of the beam to determine a preferred parking spot on a preferred flat area of the wafer; 3) parking the beam at the preferred spot; and 4) analyzing the reflected portion of the beam to determine when the preferred flat area has been etched through. The beam spot of the laser beam is smaller than the width of the preferred flat area to eliminate noise generated at the transition boundaries of the flat area. Preferably, the wafer is scanned several times along the same beam path to permit the comparison of several scans to determine the preferred parking spot. The apparatus includes a beam forming assembly; a scanning assembly which causes the laser beam to scan across the wafer; a detection assembly responsive to a portion of the laser beam which is reflected off of the wafer; and a controller which operates the laser and the scanning assembly and which is responsive to an output of the detection assembly. When output of the detection assembly indicates a cessation of the characteristic etching curve, the controller develops an endpoint detection signal which can automatically shut down the etching system.

Claims

1. A method for detecting an etch process endpoint when a layer of material has been etched away from the surface of a substrate, comprising the steps of:

parking a beam of radiant energy on a spot on said layer;

producing an actual etching signal waveform by detecting the amplitude of a signal produced by interference between said beam of radiant energy and a portion of said beam reflected off of said layer;

comparing successive values of said actual etching signal waveform over a period of time with a sinusoidal projected etching curve and detecting the endpoint of the etch process when the waveform of the actual etching signal flattens so as to diverge from the projected etching curve.