Shielded low-profile electronic component assembly

• US 5,153,379 A
• Filed: 10/09/1990
• Issued: 10/06/1992
• Est. Priority Date: 10/09/1990
• Status: Expired due to Fees

• Current Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Roshitsh, Todd W., Guzuk, Andrzej T., Bernardoni, Lonnie L., Engstrom, Scott M.
• Primary Examiner(s): WALSH, STEPHEN G
• Assistant Examiner(s): Ledynh, Bot L.
• Application Number:
  US07/594,448
• Time in Patent Office: 728 Days
• Field of Search: 174/35 R, 174/35 MS, 174/52.2, 174/52.4, 361/424, 357/72, 357/74
• US Class Current: 174/363
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/585 comprising conductive layers or plates or strips or rods or rings H01L23/60, H01L23/62, H01L23/64, H01L23/66 take precedence
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/16152 Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding

Abstract

A shielded low-profile electronic component assembly 100 providing shielding for electronic components is disclosed which includes a substrate 124, and shield 102. In a first embodiment the shield 102 is chamfered at each shield corner 110 and is attached to the substrate 124 at ground pad patterns 114, which are found at each corner of the substrate 124 on surface 128. A ground paddle 120 is also located in substrate 124 which lies substantially underneath the electronic component 112, and is utilized in maximizing shielding. In an alternate embodiment a substrate 124 is overmolded with encapsulation material 302 after the electronic component 112 is affixed to the substrate 124, with each of the encapsulation material corners 306 being chamfered exposing ground pads 114. The metallized shield 310 is then placed over the overmolded encapsulant and attached to the substrate 124 at ground pad patterns 114. The overmolded encapsulant 302 adding protection to the electronic component 112. In a third embodiment the metallized shield is slightly smaller in area than the substrate 124 and is attached at each of the four ground pads 114, with the shield edges 204 resting on substrate 124.

Claims

1. An electronic component assembly, comprising:

an electronic component having a plurality of terminals;

an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern;

the electronic component affixed to the one major surface of said electronic component carrier. the electronic component being encapsulated with encapsulant material substantially covering the electronic component; and

a metallized shield attached to the ground pad pattern and substantially covering the electronic component.

2. An electronic component assembly according to claim 1, further comprising:

a grounded die paddle on the major surface for receiving the electronic component, with the die paddle located substantially underneath the electronic component.

3. An electronic component assembly according to claim 1, wherein the metallized shield includes a recessed area overlying the electronic component allowing the recessed area to be closer to the electronic component.

4. An electronic component assembly, comprising:

an electronic component having a plurality of terminals;

an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern;

the electronic component affixed to the one major surface of said electronic component carrier; and

a metallized shield attached to the ground pad pattern and substantially covering the electronic component;

the metallized shield including a recessed area overlying the electronic component allowing the recessed area to be closer to the electronic component.

5. An electronic component assembly according to claim 4, wherein the metallized shield includes at least one pin, and the substrate includes at least one aperture for receiving the pin.

6. An electronic component assembly according to claim 4, wherein the metallized shield has an aperture, and the electronic component is encapsulated with encapsulation material substantially covering the electronic component.

7. An electronic component assembly, as defined in claim 6, wherein the overmolded encapsulant material has at least three corners, and is chamfered on the at least three corners exposing the one major surface area which has the electronic component affixed to it at the at least three corners, the encapsulant material also having a recess area substantially around the peripheral edge sides of the substrate, and the metallized shield having a metallized shield overhang which rests on the recess area of the encapsulant material.

8. An electronic component assembly according to claim 7, further comprising:

a grounded die paddle on the major surface for receiving the electronic component, with the die paddle located substantially underneath the electronic component.

9. An electronic component assembly, comprising:

an electronic component having a plurality of terminals;

an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern;

the electronic component affixed to the one major surface of the electronic component carrier;

an encapsulant material overmolded over the electronic component and substantially covering the one major surface area where the electronic component is affixed to, and having a portion of the at least one ground pad pattern not overmolded with encapsulant; and

a metallized shield attached to the at least one ground pad pattern and substantially covering the overmolded encapsulant material.

10. An electronic component assembly, comprising:

an electronic component having a plurality of terminals;

an electronic component carrier including a substrate having a major surface having peripheral edge sides and a conductive pattern on the major surface for receiving the electronic component, and at least one ground pad pattern located on the major surface;

the electronic component affixed to the major surface of said electronic component carrier; and

a metallized shield attached to the ground pad pattern and substantially covering the electronic component, the metallized shield formed from a single piece of metal and having a shield land area which rests on the major surface of the substarte upon the metallized shield being attatched to the substrate, the metallized shield further having a shield overhang which substantially overhangs the substrate peripherial edge sides.

11. An electronic component assembly according to claim 10, wherein the metallized shield corners are chamfered and are attached to the ground pad patterns.

12. An electronic component assembly according to claim 10, wherein the major surface includes grounded substrate regions substantially along the sides of the substrate, and the metallized shield land area is attached to the grounded substrate regions.

13. An electronic component assembly according to claim 10, wherein the height of the assembly is less than 0.060 inches.

14. An electronic component assembly as defined in claim 10, wherein the electronic component is encapsulated with encapsulation material substantially covering the electronic component.