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Shielded low-profile electronic component assembly

  • US 5,153,379 A
  • Filed: 10/09/1990
  • Issued: 10/06/1992
  • Est. Priority Date: 10/09/1990
  • Status: Expired due to Fees
First Claim
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1. An electronic component assembly, comprising:

  • an electronic component having a plurality of terminals;

    an electronic component carrier including a substrate having two major surfaces and peripheral edge sides joining the major surfaces, and a conductive pattern on one of the major surfaces for receiving the electronic component, and at least one ground pad pattern on the same major surface as the conductive pattern;

    the electronic component affixed to the one major surface of said electronic component carrier. the electronic component being encapsulated with encapsulant material substantially covering the electronic component; and

    a metallized shield attached to the ground pad pattern and substantially covering the electronic component.

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