Chip carrier for a microwave semiconductor component
First Claim
Patent Images
1. A semiconductor component assembly, comprising:
- a semiconductor chip having at least first and second source contacts, a gate contact, and a drain contact;
a chip carrier assembly having the semiconductor chip located at a contacting region thereof, a first external source terminal, a second external source terminal, an external gate terminal, and an external drain terminal extending into the contacting region, and a protective sealing surrounding the contacting region and portions of the first and second source terminals, gate terminal, and drain terminal in the contacting region;
respective contact means connecting the first and second source contacts and gate and drain contacts of the semiconductor chip to the respective first and second external source terminals, external gate terminal, and external drain terminal;
the first source terminal and gate terminal extending outwardly from the contacting region at a first side thereof and a drain terminal and second source terminal extending outwardly from the contacting region at an opposite second side thereof;
the first source terminal and the drain terminal lying at a first side of a geometric line and the gate terminal and the second source terminal lysing at an opposite side of said geometric line;
the first external source terminal and second external source terminal being connected via a web-like cross member passing through the contacting region and wherein said semiconductor chip is fastened on the cross member; and
the cross member and opposite side edges thereof proceeding substantially obliquely to said geometric line.
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Abstract
A chip carrier for a microwave semiconductor component with four external electrical contacts has a favorable operating and application behavior, even when a plastic housing is used. Two external source terminals are connected with each other as one pieve via a cross member. The cross member basically proceeds obliquely to a transverse axis or to a longitudinal axis of the chip carrier.
7 Citations
21 Claims
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1. A semiconductor component assembly, comprising:
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a semiconductor chip having at least first and second source contacts, a gate contact, and a drain contact; a chip carrier assembly having the semiconductor chip located at a contacting region thereof, a first external source terminal, a second external source terminal, an external gate terminal, and an external drain terminal extending into the contacting region, and a protective sealing surrounding the contacting region and portions of the first and second source terminals, gate terminal, and drain terminal in the contacting region; respective contact means connecting the first and second source contacts and gate and drain contacts of the semiconductor chip to the respective first and second external source terminals, external gate terminal, and external drain terminal; the first source terminal and gate terminal extending outwardly from the contacting region at a first side thereof and a drain terminal and second source terminal extending outwardly from the contacting region at an opposite second side thereof; the first source terminal and the drain terminal lying at a first side of a geometric line and the gate terminal and the second source terminal lysing at an opposite side of said geometric line; the first external source terminal and second external source terminal being connected via a web-like cross member passing through the contacting region and wherein said semiconductor chip is fastened on the cross member; and the cross member and opposite side edges thereof proceeding substantially obliquely to said geometric line. - View Dependent Claims (2, 3, 4)
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5. A chip carrier assembly for a microwave semiconductor chip, comprising:
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at least four external electrical contacts comprising first and second external source terminals, an external gate terminal, and an external drain terminal; the first source terminal and the gate terminal being arranged on a first side of the chip carrier, and the second source terminal and the drain terminal being arranged on an opposite second side of the chip carrier; in a plan view of the chip carrier the terminals being arranged such that a geometric line can be arranged between the first external source terminal and gate terminal at the first side of the chip carrier and such that said geometric line also proceeds between the second source terminal and the drain terminal at the second opposite side of the chip carrier, the first source terminal and the second source terminal being located on different sides of said geometric line; the first source terminal being connected with the second source terminal as one piece via a cross member, and a region being provided on said cross member at which a semiconductor chip can be fastened; and said cross member and substantially parallel and opposite side edges thereof proceeding substantially obliquely to said geometric line, and wherein said gate terminal has a border which is also oblique to said geometric line and substantially parallel to the cross member side edge which is directly adjacent to said border. - View Dependent Claims (6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A microwave semiconductor component assembly, comprising:
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a semiconductor chip having at least first and second source contacts, a gate contact, and a drain contact; a chip carrier assembly having the semiconductor chip located at a contacting region thereof, a first external source terminal, a second external source terminal, an external gate terminal, and an external drain terminal extending into the contacting region, and a protective sealing surrounding the contacting region and portions of the first and second source terminals, gate terminal, and drain terminal in the contacting region; respective contact means connecting the first and second source contacts and gate and drain contacts of the semiconductor chip to the respective first and second external source terminals, external gate terminal, and external drain terminals, the first source terminal and gate terminal extending outwardly from the contacting region at a first side thereof and a drain terminal and second source terminal extending outwardly from the contacting region at an opposite second side thereof; the first source terminal and the drain terminal lying at a first side of a geometric line and the gate terminal and the second source terminal lysing at an opposite side of said geometric line; the first external source terminal and second external source terminal being connected as one piece via a cross member passing through the contacting region and wherein said semiconductor chip is fastened on the cross member; the cross member and opposite side edges thereof proceeding substantially obliquely to said geometric line; and the oblique sides of the cross member and placements of the drain terminal and gate terminal at respective spacings which are relatively close to the respective oblique sides of the semiconductor chip being selected to permit operation of the assembly above 12 GHz.
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Specification