Reflow and wave soldering techniques for bottom side components
First Claim
1. A method of soldering a surface-mount component to a printed circuit board having a first and a second side, comprising the substantially sequential steps of:
- (a) screening a solder paste on a pad for a surface-mount component on said first side of said board;
(b) applying an adhesive to a surface-mount component receiving site on the first side of the board;
(c) placing a surface-mount component on said first side so as to contact said solder paste and said adhesive;
(d) reflowing the solder and curing the applied adhesive, whereby said surface-mount component becomes electrically connected and mechanically affixed to said printed circuit board;
(e) inverting the board;
(f) disposing a through-hole component on said second side through a hole in said printed circuit board; and
(g) mass soldering said first side of said circuit board by contacting said first side with a molten solder pool to join at least said through-hole component to said printed circuit board.
3 Assignments
0 Petitions
Accused Products
Abstract
A soldering method is provided which includes applying a solder paste onto a pad for a surface-mount component on a bottom side of a printed circuit board, applying an adhesive to a surface-mount component receiving site on the bottom side of the board, placing a surface-mount component on the bottom side so as to contact the solder paste and adhesive, and reflowing the solder while curing the applied adhesive to affix the surface-mount component to the bottom side of the board. This method also includes disposing a through-hole component on the top side of the board and mass soldering the bottom side of the printed circuit board to join the through-hole component to the board.
78 Citations
20 Claims
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1. A method of soldering a surface-mount component to a printed circuit board having a first and a second side, comprising the substantially sequential steps of:
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(a) screening a solder paste on a pad for a surface-mount component on said first side of said board; (b) applying an adhesive to a surface-mount component receiving site on the first side of the board; (c) placing a surface-mount component on said first side so as to contact said solder paste and said adhesive; (d) reflowing the solder and curing the applied adhesive, whereby said surface-mount component becomes electrically connected and mechanically affixed to said printed circuit board; (e) inverting the board; (f) disposing a through-hole component on said second side through a hole in said printed circuit board; and (g) mass soldering said first side of said circuit board by contacting said first side with a molten solder pool to join at least said through-hole component to said printed circuit board. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of soldering a printed circuit board having a top and bottom side, wherein a surface-mount component is adhered to the bottom side of said circuit board by an adhesive and a solder and said bottom side is wave soldered to join a through-hole component to said top side of said printed circuit board, wherein said method further comprises:
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applying a solder paste to a pad for a surface-mount component and a heat-curable adhesive to a surface-mount component receiving site on said bottom side of said circuit board so as to contact said surface-mount component when said surface-mount component is placed; and heating said printed circuit board to substantially simultaneously; cure said adhesive, and reflow said solder, whereby said surface-mount component becomes electrically and mechanically attached to said printed circuit board. - View Dependent Claims (12, 13, 14)
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15. A method of soldering a leaded-through-hole component and a surface-mount component to oppositely facing top and bottom sides of a printed circuit board respectively, comprising:
applying a solder paste, an adhesive, and a surface-mount component to a surface-mount receiving site on said bottom side of said printed circuit board;
curing said adhesive and reflowing said solder to effect adherence of said surface-mount component to said bottom side;
inverting said board;
inserting said leaded-through-hole component through a plurality of holes in said printed circuit board; and
wave soldering said leaded-through-hole component to said printed circuit board.- View Dependent Claims (16, 17, 18, 19, 20)
Specification