Semiconductor device having a particular conductive lead structure
First Claim
1. A semiconductor device comprising:
- a semiconductor chip having a semiconductor element therein, said chip having a first thickness;
a die pad having said semiconductor chip mounted thereon, said die pad having a second thickness;
a conductive lead located adjacent to said die pad and having a first and second portion, said first portion having a third thickness greater than the sum of said first and second thicknesses;
a conductor electrically interconnecting said semiconductor element and said conductive lead; and
a sealing material sealing said semiconductor chip, die pad, conductor and conductive lead second portion, a portion of said sealing material overlying said semiconductor chip, said sealing material portion having a fourth thickness which is dependent on said third thickness of said conductive lead.
2 Assignments
0 Petitions
Accused Products
Abstract
A thin semiconductor device comprises a die pad (52) having a first thickness, a semiconductor chip (51) mounted on the die pad (52), a plurality of conductive leads (54) each having at least a portion having a second thickness greater than the first thickness, and conductors (53) interconnecting the semiconductor chip (51) and the leads (54). The semiconductor device is sealed in a resin molding having the second thickness with portions of the leads (54) exposed. In sealing the semiconductor device in the resin molding by molding, the semiconductor device is held between the upper and lower dies of a molding die defining a cavity having a thickness equal to the second thickness to prevent the melted resin (55) from flowing and forming a thin film over the surfaces of the leads to be exposed. In modification, an extended portion having the second thickness of each lead (54) is extended toward the adjacent lead (54) and is bent, and insulating reinforcing members are held by the extended portions of the leads to prevent the separation of the leads from the resin molding and to improve the mechanical strength of the semiconductor device.
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Citations
14 Claims
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1. A semiconductor device comprising:
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a semiconductor chip having a semiconductor element therein, said chip having a first thickness; a die pad having said semiconductor chip mounted thereon, said die pad having a second thickness; a conductive lead located adjacent to said die pad and having a first and second portion, said first portion having a third thickness greater than the sum of said first and second thicknesses; a conductor electrically interconnecting said semiconductor element and said conductive lead; and a sealing material sealing said semiconductor chip, die pad, conductor and conductive lead second portion, a portion of said sealing material overlying said semiconductor chip, said sealing material portion having a fourth thickness which is dependent on said third thickness of said conductive lead. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A semiconductor device comprising:
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a semiconductor chip having a semiconductor element therein, said chip having a first thickness; a die pad having said semiconductor chip mounted thereon, said die pad having a second thickness; a conductive lead located adjacent to said die pad and having a first portion and a second portion, the first portion having a third thickness greater than the sum of the first and second thicknesses; a conductor electrically interconnecting the semiconductor element and said conductive lead; and a molded insulator encapsulating said semiconductor chip, die pad, conductor and conductive lead second portion, said molded insulator having a fourth thickness overlying said semiconductor chip, said fourth thickness a function of said third thickness of said conductive lead. - View Dependent Claims (9, 10, 11, 12, 13, 14)
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Specification