Composite liquid cooled plate for electronic equipment

• US 5,159,529 A
• Filed: 05/15/1991
• Issued: 10/27/1992
• Est. Priority Date: 05/15/1991
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Wells, Clifford B., Lovgren, Eric P., Rearick, Donald P.
• Primary Examiner(s): Thompson, Gregory D.
• Application Number:
  US07/700,728
• Time in Patent Office: 531 Days
• Field of Search: 165/80.3, 165/80.4, 165/185, 174/15.1, 357/81, 357/82, 361/382, 361/385, 361/386, 361/388
• US Class Current: 361/699
• CPC Class Codes: H05K 7/20254 Cold plates transferring heat from heat source to coolant
• CPC Class Codes: H05K 7/20636 within sub-racks for removing heat from electronic boards

Abstract

A composite liquid cooled plate is disclosed having a heat transfer plate, preferably made of copper, on one or both sides of a core, which is preferably plastic. The core has flow channels to direct water against the heat transfer plates underneath the "hot" areas of the heat transfer plates, thereby providing a very low thermal resistance. The assembly remains lightweight by restricting the use of copper or other conducting materials to only the areas requiring thermal conduction.

Claims

1. A coolant management system for cooling electrical components using a coolant, said system comprising:

(a) a first heat transfer plate, said first heat transfer plate having a high thermal conductivity, wherein said first heat transfer plate includes a mounting side for mounting electronic components and a flow channel side; and

(b) coolant management means for directing the coolant against said first heat transfer plate, said coolant management means having a lower thermal conductivity than said high thermal conductivity of said first heat transfer plate, said coolant management means being capable of being molded into a desired shape, wherein said first heat transfer plate is attached to said coolant management means so as to be in direct thermal connection with the coolant and to form a first coolant cavity, wherein said first heat transfer plate includes a projection extending from said flow channel side toward said coolant management means, said coolant management means comprising flow channels configured to cause coolant flow to be substantially increased at selected areas of said first heat transfer plate.

2. The coolant management system of claim 1 further comprising a second heat transfer plate, said second heat transfer plate having a high thermal conductivity, wherein said second heat transfer plate includes a mounting side for mounting electronic components and a flow channel side, wherein said second heat transfer plate is attached to said coolant management means so as to be in direct thermal connection with the coolant and to form a second coolant cavity.

3. The coolant management system of claim 2 wherein said coolant management means has means to permit communication between said first coolant cavity and said second coolant cavity.

4. The coolant management system of claim 2 wherein said second heat transfer plate includes a projection extending from said flow channel side toward said coolant management means.

5. The coolant management system of claim 2 wherein said coolant management means is an insert encapsulated between said first heat transfer plate and said second heat transfer plate.

6. The coolant management system of claim 2 wherein said coolant management means further comprises flow channels configured to cause coolant to contact only selected areas of said second heat transfer plate.

7. The coolant management system of claim 2 further comprising at least one hose connection fitting, said at least one hose connection fitting having an internal lumen for passing coolant to said coolant management means.

8. The coolant management system of claim 7 wherein said first heat transfer plate, said second heat transfer plate and said at least one hose connection fitting are metallurgically joined.

9. The coolant management system of claim 7 wherein said at least one hose connection fitting is integral with said coolant management means.

10. The coolant management system of claim 1 wherein said first heat transfer plate and said coolant management means are glued together to form said coolant management system.

11. A coolant management system for cooling electrical components using a coolant, said system comprising:

(a) a first heat transfer plate, said first heat transfer plate being made of a material having a high thermal conductivity, wherein said first heat transfer plate includes a mounting side for mounting electronic components and a flow channel side;

(b) a second heat transfer plate, said second heat transfer plate being made of a material having a high thermal conductivity, wherein said second heat transfer plate includes a mounting side for mounting electronic components and a flow channel side;

(c) coolant management means for directing the coolant against said first heat transfer plate and said second heat transfer plate, said coolant management means having a lower thermal conductivity than said high thermal conductivity of said first heat transfer plate and said high thermal conductivity of said second heat transfer plate, said coolant management means being formed from material capable of being molded into a desired shape, wherein said first heat transfer plate and said second heat transfer plate encapsulate said coolant management means so as to be in direct thermal connection with the coolant and to form at least one coolant cavity, wherein said first heat transfer plate includes a projection extending from said flow channel side toward said coolant management means, said coolant management means comprising flow channels configured to cause coolant flow to be substantially increased at selected areas of said first heat transfer plate.

12. The coolant management system of claim 11 wherein said first heat transfer plate and said second heat transfer plate are made of copper.

13. The coolant management system of claim 11 wherein said coolant management means further comprises flow channels configured to cause coolant to contact only selected areas of said second heat transfer plate.

14. The coolant management system of claim 11 wherein said second heat transfer plate includes a projection extending from said flow channel side toward said coolant management means.

15. The coolant management system of claim 13 wherein said second heat transfer plate includes a projection extending from said flow channel side toward said coolant management means.