Electronic control unit with multiple hybrid circuit assemblies integrated on a single common ceramic carrier
First Claim
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1. An electronic control unit comprising:
- a housing including (a) a heat sink which forms a base of said housing and which is provided with mounting holes for mounting said unit on a support structure, (b) a closed frame member directly disposed on and fastened to a surface of said heat sink to define a cavity closed at one end with a surrounded portion of said surface of said heat sink, and (c) a separate cover on said frame member closing the other end of said cavity; and
a single hybrid integrated electronic circuit including switching and power components, arranged in a plurality of separate assemblies with differing power dissipations, disposed on a surface of a single common electrically non-conductive carrier consisting of Al2 O3, with said carrier being mounted directly on said surrounded portion of said surface of said heat sink within said cavity.
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Abstract
The object of the patent application is an electronic control unit with triggering and power components, in particular an ignition control unit, whose electronic circuit comprises various assemblies in hybrid technology. To reduce the assembly expenditure and costs for manufacture, while at the same time reducing the volume, the invention provides for the assemblies of the electronic circuit to be integrated in a hybrid circuit and arranged on a single common carrier element. This carrier element is designed as an electrically non-conductive ceramic carrier of Al2 O3, by which the electronic circuit of the control unit is electrically insulated from a heat sink.
36 Citations
3 Claims
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1. An electronic control unit comprising:
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a housing including (a) a heat sink which forms a base of said housing and which is provided with mounting holes for mounting said unit on a support structure, (b) a closed frame member directly disposed on and fastened to a surface of said heat sink to define a cavity closed at one end with a surrounded portion of said surface of said heat sink, and (c) a separate cover on said frame member closing the other end of said cavity; and a single hybrid integrated electronic circuit including switching and power components, arranged in a plurality of separate assemblies with differing power dissipations, disposed on a surface of a single common electrically non-conductive carrier consisting of Al2 O3, with said carrier being mounted directly on said surrounded portion of said surface of said heat sink within said cavity. - View Dependent Claims (2, 3)
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Specification