Multi-channel plasma discharge endpoint detection method

• US 5,160,402 A
• Filed: 05/24/1990
• Issued: 11/03/1992
• Est. Priority Date: 05/24/1990
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Cheng, David
• Primary Examiner(s): Corbin, Arthur L.
• Application Number:
  US07/528,297
• Time in Patent Office: 894 Days
• Field of Search: 156/626, 156/627, 156/345, 156/643, 204/192.33
• US Class Current: 216/59
• CPC Class Codes: H01J 37/32935 Monitoring and controlling tubes by information coming from the object and/or discharge

Abstract

A plasma discharge endpoint detection system and method characterized by a plurality of individual data channels which are combined to create a composite function representative of the conditions within a plasma etch chamber. Preferably, a number of the channels are representative of spectral components within the optical spectrum caused by the plasma discharge within the etch chamber. A multi-channel sensor assembly is provided for this purpose including a number of light-guides for guiding light from the plasma discharge to filters and photosensors associated with the multiple channels. Other channels can detect various conditions such as the D.C. bias on a cathode within the plasma etch chamber. The various channels are digitized, weighted and summed within a digital computer to create the composite function from which endpoint and other conditions within the chamber can be determined. The method is characterized by the weighting and summing of a plurality of data channels carrying information about the conditions within a plasma etch chamber to develop a composite function and then analyzing the composite function to determine endpoint and other conditions. The endpoint detection method compares the slope of the composite function to a predetermined maximum slope value and identifies endpoint when the maximum slope value is exceeded a predetermined number of times.

Claims

1. A method of monitoring a plasma process which comprises

(a) optically monitoring a plurality of preselected emission spectra developed by a plasma in a plasma chamber,

(b) amplifying and digitizing a plurality of spectra signals of said spectra,

(c) weighting and summing said signals to form a composite function, and

(d) comparing the slope of the composite function to a predetermined value to determine preselected conditions within said plasma.

2. A method according to claim 1 wherein a D.C. bias channel of a cathode within said plasma chamber is also monitored.

3. A method according to claim 1 wherein the step of forming a composite includes forming a weighted sum of said plurality of spectral components.

4. A method according to claim 1 wherein said composite of said plurality of parameters includes a weighted sum of at least four spectral components.

5. A method according to claim 1 wherein said step of comparing is repeated a plurality of times and wherein endpoint is determined after a number of consecutive comparisons indicate endpoint conditions in said plasma.

6. A method of monitoring the endpoint of a plasma etch process in a plasma etch system which comprises

(a) collecting a plurality of digital emission signals from said plasma,

(b) calculating a composite emission curve from said signals by weighting and summing said signals, and

(c) determining when the slope of said composite curve exceeds a predetermined slope.

7. A method according to claim 6 wherein said signals are obtained from a plurality of portions of an optical spectrum of said plasma.

8. A method according to claim 6 further comprising

monitoring the D.C. bias of a cathode within said plasma etch system;

and

forming said composite using both said plurality of spectral components and said D.C. bias.

9. A method according to claim 6 wherein said step of calculating the composite further includes removing the background level from said weighted sum.

10. A method according to claim 9 wherein said step of calculating the composite further includes filtering undesired components from said composite.

11. A method according to claim 9 wherein said step of calculating the composite includes;

summing said time related sum function over time to develop a time related background function; and

subtracting said time related background function from said time related sum function to develop a time related offset function.

12. A method according to claim 11 wherein said step of calculating the composite includes;

performing a notch filter function on said time related offset function to remove undesired components from said time related offset function.