Microprobe provided circuit substrate and method for producing the same

• US 5,160,779 A
• Filed: 11/29/1990
• Issued: 11/03/1992
• Est. Priority Date: 11/30/1989
• Status: Expired due to Term

• Current Assignee: Hoya Corporation
• Original Assignee: Hoya Corporation
• Inventors: Sugihara, Osamu
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): LAM, CATHY FONG FONG
• Application Number:
  US07/620,861
• Time in Patent Office: 705 Days
• Field of Search: 428/209, 428/901, 428/432, 428/426, 428/457
• US Class Current: 428/209
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: Y10S 428/901 Printed circuit
• CPC Class Codes: Y10T 29/49165 by forming conductive walled aperture in base
• CPC Class Codes: Y10T 29/49204 Contact or terminal manufacturing
• CPC Class Codes: Y10T 428/24917 including metal layer
• CPC Class Codes: Y10T 428/31678 Of metal

Abstract

A probe assembly for testing semiconductor wafer chips includes microprobes embedded in a circuit substrate. The microprobes are pillar-shaped conductors formed in through holes in a base of the substrate. One end of the microprobe is flush with the base surface contacts and is electrically connected through a reinforcing substrate to a probe assembly test head which generates various test signals. The other end of the pillar-shaped microprobes projects beyond the base to make contact with and deliver test signals to various electrodes of a chip to be tested.

Claims

1. A microprobe-provided circuit substrate comprising:

a base made of an inorganic electrically-insulating material or a semiconductive material and having a plurality of fine through holes;

microprobes constituted by pillar-shaped conductors correspondingly respectively provided in said fine through holes, each of said microprobes having one end that projects beyond one surface of said base, said one end being brought into contact with a circuit to be tested; and

conductive portions provided on the other surface of said base electrically connected to the other end of corresponding microprobes.

2. A microprobe-provided circuit substrate according to claim 1, in which said one surface of said base has protruding regions that surround said microprobes.

3. A microprobe-provided circuit substrate according to claim 1, in which a reinforcement substrate made of an electrically insulating or semiconductive material is adhered to the base on the other surface where said conductive portions are provided.

4. A microprobe-provided circuit substrate according to claim 1, further comprising connection terminals, respectively corresponding to said conductive portions, for electrically connecting said conductive portions to test apparatus for supplying a signal current to said test circuit.

5. A microprobe-provided circuit substrate according to claim 1, in which said base is made of photosensitive glass.

6. A microprobe-provided circuit substrate according to claim 1, further comprising an opening portion formed at a central portion of said base and extending through the thickness of said base from the upper surface to the lower surface thereof.

7. A microprobe-provided circuit substrate according to claim 3, further comprising an opening portion formed at a central portion of an integral structure of said base and said reinforcement substrate and extending through the thickness of said integral structure from the upper surface to the lower surface thereof.

8. A microprobe-provided circuit substrate according to claim 1, wherein portions of said base surrounding the projected ends of said microprobes protrude beyond the base.

9. A microprobe-provided circuit substrate according to claim 1, wherein the diameter of said projected end of said microprobe is smaller than that of the other end of said microprobe.

10. A microprobe-provided circuit substrate according to claim 1, wherein said projected end of said microprobe is tapered.

11. A microprobe-provided circuit substrate according to claim 1, wherein said one surface is formed by etching.

12. A microprobe-provided circuit substrate according to claim 1, wherein said microprobe is a hollow pillar-shaped conductor.

13. A microprobe-provided circuit substrate according to claim 1, wherein said microprobe is made from electroless Ni-P plating.

14. A microprobe-provided circuit substrate according to claim 5, wherein said photosensitive glass is an Li₂ O--Al₂ O₂ --SiO₂ (Au, Ce) chemically machinable photosenitive glass.

15. A microprobe comprising:

a flat base member made of an inorganic electrically-insulating material or semiconductive material having a plurality of transverse holes through the thickness of the base member;

a plurality of cylindrically-shaped microprobe conductors provided in the transverse holes so that one end of each microprobe is flush to one surface of the base member and the other end of each microprobe projects beyond the opposite surface of the base member; and

conductive members formed on the first surface of the base plate making electrical contact to the flush end of a corresponding microprobe, wherein the projecting ends of the microprobes are adapted for contacting various electrodes contained on an integrated circuit for test purposes.

16. A microprobe according to claim 15 wherein a reinforcement substrate made of an electrically insulating or semiconductive material is adhered to the base member on the one surface aligned with the flush ends of the microprobes.

17. A microprobe according to claim 16 further comprising:

connection terminals, corresponding to said conductive members, for supplying test signals to the integrated circuit electrodes, wherein the connection terminals are connected electrically and physically to the conductive members using a plurality of corresponding wires passing through the reinforcement substrate.

18. A microprobe according to claim 15 wherein the conductive members include a metal oxide conductor contacting the cylindrically shaped microprobes over which is formed a metal plating layer thereby reducing resistance between the microprobe and the conductive member.