Capacitor laminate for use in capacitive printed circuit boards and methods of manufacture

• US 5,161,086 A
• Filed: 01/22/1992
• Issued: 11/03/1992
• Est. Priority Date: 08/23/1989
• Status: Expired due to Term

• Current Assignee: Hadco Santa Clara Incorporated (Sanmina-SCI Corporation)
• Original Assignee: Zycon Corp. (Sanmina-SCI Corporation)
• Inventors: Howard, James R., Lucas, Gregory L.
• Primary Examiner(s): GRIFFIN, DONALD
• Application Number:
  US07/823,865
• Time in Patent Office: 286 Days
• Field of Search: 428/209, 361/306, 361/321, 361/397, 361/401, 29/625, 29/628, 357/74, 357/23.5
• US Class Current: 361/321.1
• CPC Class Codes: H01L 23/642 Capacitive arrangements H01L23/49589, H01L23/645, H01L23/647, H01L23/66 take precedence; capacitive effects between wiring layers on the semiconductor body H01L23/5222
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0366 reinforced, e.g. by fibres, fabrics H05K1/036 takes precedence
• CPC Class Codes: H05K 1/162 incorporating printed capacitors
• CPC Class Codes: H05K 2201/0209 Inorganic, non-metallic particles
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/09309 Core having two or more power planes; Capacitive laminate of two power planes
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence

Abstract

A capacitor laminate is described either as an intermediate product for use in a capacitive printed circuit board or as part of the assembled printed circuit board in order to provide a bypass capacitive function for large numbers of devices mounted or formed on the printed circuit board, the capacitor laminate being formed from sheets of conductive material and an intermediate sheet of dielectric material forming the laminated capacitor as a structurally rigid assembly and facilitating its inclusion within the PCB, components of the capacitor laminate having selected characteristics whereby each individual device is provided with capacitance by a proportional portion of the capacitor laminate and by borrowed capacitance from other portions of the capacitor laminate, the capacitive function of the capacitor laminate being dependent upon random firing or operation of the devices. Methods of manufacture for the capacitor laminate as well as the capacitive PCB are also described. The capacitor laminate of the present invention is preferably formed with preferred surface treatment or surface characteristics on the conductive foils employed therein.

Claims

1. A capacitor laminate as an intermediate product for use within a laminated capacitive printed circuit board (PCB), comprising

two conductive foils and one sheet of dielectric material, the conductive foils and dielectric sheet having characteristics for producing desired capacitance in combination for large numbers of PCB devices, the conductive foils and dielectric sheet each being structurally rigid entities permitting their lamination together and having surface dimensions similar to at least a substantial portion of the PCB, the conductive foils and dielectric sheet being thin to form the capacitor laminate with a uniformly thin dimension suitable for inclusion as an internal layer of the PCB, the two conductive foils being laminated onto opposite sides of the dielectric sheet to form the capacitor laminate as a structurally rigid subassembly facilitating its lamination into the PCB.

2. The capacitor laminate of claim 1 wherein conductivity for each conductive foil is at least equivalent to about a 1 mil thickness of copper.

3. The capacitor laminate of claim 2 wherein the dielectric sheet has an initial thickness of no more than about 2 mils.

4. The capacitor laminate of claim 3 wherein the conductive foils form power and ground planes in the PCB.

5. The capacitor laminate of claim 2 wherein the dielectric sheet has a maximum thickness of about 4 mils and the conductive foils each have a thickness of up to about 2.4 mils.

6. The capacitor laminate of claim 5 wherein one or more capacitor laminates are laminated into the PCB.

7. The capacitor laminate of claim 1 wherein one or more capacitor laminates are laminated into the PCB.

8. The capacitor laminate of claim 7 wherein the conductive foils form power and ground planes in the PCB.

9. The capacitor laminate of claim 7 further comprising multiple devices requiring capacitance being mounted on the PCB and coupled with different portions of the conductive foils.

10. The capacitor laminate of claim 7 wherein one or more capacitor laminates are laminated into the PCB.

11. The capacitor laminate of claim 1 wherein the capacitor laminate is adapted for use with multiple devices respectively coupled to different portions of the capacitor laminate and the two conductive foils each having sufficient conductivity for facilitating random operation of the devices by providing each device with total capacitance including a proportional portion of the capacitor laminate and borrowed or shared capacitance from other portions of the capacitor laminate.

12. The capacitor laminate of claim 1 wherein the two conductive foils each have one surface treated side with surface roughness or surface variation just sufficient to promote adhesion of the one sides to the dielectric sheet, the capacitor laminate being formed from the dielectric sheet and the two conductive foils with the surface treated sides of the conductive foils in intimate contact with opposite sides of the dielectric sheet whereby the dielectric sheet has a minimum thickness between all opposing surface portions of the conductive foils for maintaining adhesion and for developing enhanced capacitive integrity of the capacitor laminate.

13. The capacitor laminate of claim 12 wherein one or more capacitor laminates are laminated into the PCB.

14. The capacitor laminate of claim 1 wherein the capacitor laminate is adapted for use with multiple devices respectively coupled to different portions of the conductive foils, the conductive foils having sufficient conductivity for operation of the devices.

15. The capacitor laminate of claim 14 wherein one or more capacitor laminates are laminated into the PCB.

16. The capacitor laminate of claim 15 wherein the conductive foils form power and ground planes in the PCB.

17. The capacitor laminate of claim 16 wherein multiple devices requiring capacitance are mounted on the PCB and coupled with different portions of the conductive foils.

18. The capacitor laminate of claim 15 wherein multiple devices requiring capacitance are mounted on the PCB and coupled with different portions of the conductive foils.