Hot-melt silicon pressure sensitive adhesives with phenyl-containing siloxane fluid additive and related methods and articles

• US 5,162,410 A
• Filed: 12/17/1991
• Issued: 11/10/1992
• Est. Priority Date: 04/13/1990
• Status: Expired due to Fees

• Current Assignee: Dow, Inc.
• Original Assignee: Dow, Inc.
• Inventors: Sweet, Randall P.
• Primary Examiner(s): Marquis, Melvyn I.
• Assistant Examiner(s): DEAN, KAREN A
• Application Number:
  US07/809,236
• Time in Patent Office: 329 Days
• Field of Search: 524/266, 524/268, 524/588, 525/477, 427/387
• US Class Current: 524/266
• CPC Class Codes: A61K 9/7069 obtained otherwise than by reactions only involving carbon to carbon unsaturated bonds, e.g. polysiloxane, polyesters, polyurethane, polyethylene oxide
• CPC Class Codes: C08L 83/00 Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
• CPC Class Codes: C09J 183/04 Polysiloxanes

Abstract

Hot-melt silicone pressure sensitive adhesive compositions, methods of using the compositions, articles made using the compositions, and methods of making articles using the compositions. The hot-melt silicone pressure sensitive adhesive compositions include a mixture of (i) a silicone resin, (ii) a polyolimethylsiloxane fluid, and (iii) from about 0.5 to about 20 weight percent, based on the total weight of the silicone resin and the polydimethylsiloxane fluid, of a polyphenylmethylsiloxane fluid having a viscosity at 25° C. of from about 5 to about 60,000 centistokes so that the adhesive will be in a generally flowing state at temperatures above about 100° C., as well as being capable of transdermal drug delivery.

Claims

1. A hot-melt silicone pressure sensitive adhesive composition, comprising a mixture of

(i) a silicone resin and

(ii) a polydimethylsiloxane fluid, said mixture exhibiting tackiness and adhesiveness, said mixture being blended homogeneously with

(iii) from about 0.5 to about 20 weight percent, based on the total weight of said silicone resin and said polydimethylsiloxane fluid, of polyphenylmethylsiloxane copolymer fluid, (CH₃ (₃ SiO[Si(C₆ H₅)(OSi(CH₃)₃)O]_n Si(CH₃)₃, where n is selected so that the viscosity of the homogeneously blended mixture is from about 5 to about 60,000 centistokes so that the adhesive will be in a generally flowing state at temperatures above about 100°

C., as well as being capable of transdermal drug delivery.

2. The hot-melt silicone pressure sensitive adhesive composition as claimed in claim 1, wherein said silicone resin is employed in an amount from about 40 to about 70 parts by weight, and said polydimethylsiloxane fluid is employed in an amount from about 30 to about 60 parts by weight, wherein the total parts of the silicone resin and the polydimethylsiloxane fluid equal 100.

3. The hot-melt silicone pressure sensitive adhesive composition as claimed in claim 1, wherein said silicone resin is employed in an amount from about 50 to about 60 parts by weight, and said polydimethylsiloxane fluid is employed in an amount from about 40 to about 50 parts by weight, wherein the total parts of the silicone resin and the polydimethylsiloxane fluid equal 100.

4. The hot-melt silicone pressure sensitive adhesive composition as claimed in claim 1, wherein the hot-melt silicone pressure sensitive adhesive is fillerless.

5. The hot-melt silicone pressure sensitive adhesive composition as claimed in claim 1, wherein the hot-melt silicone pressure sensitive adhesive composition contains less than about 5 weight % of an inorganic filler.

6. The hot-melt silicone pressure sensitive adhesive composition as claimed in claim 1, wherein said hot-melt silicone pressure sensitive adhesive composition is nonflammable.

15. The hot-melt silicone pressure sensitive adhesive of claim 1, further comprising a bioactive agent having a Hildebrand solubility parameter above 9.76.

7. A method of making a hot-melt silicone pressure sensitive adhesive-coated substrate, comprising:

(a) heating, to a coatable temperature above 100°

C., a hot-melt silicone pressure sensitive adhesive composition which includes a mixture of

(i) a silicone resin and

(ii) a polydimethylsiloxane fluid, said mixture exhibiting tackiness and adhesiveness, said mixture being blended with

(iii) from about 0.5 to about 20 weight percent, based on the total weight of said silicone resin and said polydimethylsiloxane fluid, of a phenyl-containing polysiloxane fluid having a viscosity at 24°

C. of from about 5 to about 60,000 centistokes,

(b) coating said heated hot-melt polydimethylsiloxane pressure sensitive adhesive composition onto a substrate, and

(c) cooling the coated hot-melt silicone pressure sensitive adhesive composition until it is in a generally non-flowing state.

8. The method as claimed in claim 7, wherein said silicone resin is employed in an amount from about 40 to about 70 parts by weight, and said polydimethylsiloxane fluid is employed in an amount from about 30 to about 60 parts by weight, wherein the total parts of the silicone resin and the polydimethylsiloxane fluid equal 100.

9. The method as claimed in claim 7, wherein said silicone resin is employed in an amount from about 50 to about 60 parts by weight, and said polydimethylsiloxane fluid is employed in an amount from about 40 to about 50 parts by weight, wherein the total parts of the silicone resin and the polydimethylsiloxane fluid equal 100.

10. The method as claimed in claim 7, wherein the hot-melt silicone pressure sensitive adhesive composition is fillerless.

11. The method as claimed in claim 7, wherein the hot-melt silicone pressure sensitive adhesive composition contains less than about 5 weight % of an inorganic filler.

12. The method as claimed in claim 7, wherein said hot-melt silicone pressure sensitive adhesive composition is nonflammable.

13. The method as claimed in claim 7, wherein said coatable temperature is above 100°

C.

14. The method as claimed in claim 7, wherein said coatable temperature is above 150°

C.