Method of bump bonding and sealing an accelerometer chip onto an integrated circuit chip

• US 5,164,328 A
• Filed: 05/11/1992
• Issued: 11/17/1992
• Est. Priority Date: 06/25/1990
• Status: Expired due to Term

• Current Assignee: Freescale Semiconductor, Inc. (NXP Semiconductors NV)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Dunn, William C., Scofield, Brooks L. Jr.
• Primary Examiner(s): Chaudhuri, Olik
• Assistant Examiner(s): Graybill, David E.
• Application Number:
  US07/884,314
• Time in Patent Office: 190 Days
• Field of Search: 357/25, 437/7, 437/915
• US Class Current: 438/51
• CPC Class Codes: B81C 1/00238 Joining a substrate with an electronic processing unit and a substrate with a micromechanical structure
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 2015/0828 the mass being of the paddle type being suspended at one of its longitudinal ends
• CPC Class Codes: H01L 25/16 the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of joining an integrated circuit die (10) and a sensor die (11) by the use of solder bumps (12) for the formation of a hybrid circuit assembly. Sensor die (11) and integrated circuit die (10) are manufactured separately from each other. These two components are then joined by at least one solder bump to make a hybrid circuit assembly. A dielectric sealant (21) is deposited around the outside edges of sensor (11) to prevent foreign material such as encapsulating material from interfering in the operation of the sensor. The hybrid circuit assembly is encapsulated in a plastic material (14).

Claims

1. A method of joining an accelerometer on an integrated circuit chip, comprising:

providing the accelerometer having a solid first surface and a second surface;

positioning the accelerometer on the integrated circuit and making an electrical contact between the accelerometer and the integrated circuit by solder bumps located between the second surface and the integrated circuit; and

applying a dielectric sealant along edges of the accelerometer, sealing te accelerometer to the integrated circuit chip, thereby protecting a functional area of the accelerometer from any surrounding environment.

2. The method of claim 1 wherein the sealing is done by using a frit glass and then firing the frit glass.

3. The method of claim 1 wherein teh sealing is done by using an epoxy.

4. The method of claim 1 wherein te sealing is done by using an elastomer.

5. A method of mounting an accelerometer die having an undivided surface on an integrated circuit chip, comprising:

using metal bumps for making electrical contact to the accelerometer and defining a functional area;

aligning the accelerometer in an inverted position such that the metal bumps make electrical contact with the integrated circuit; and

sealing around edges of the accelerometer sothat a functional area of the accelerometer is isolated from any surrounding environment.

6. The method of claim 5 wherein the sealing is done by using a frit glass.

7. A method of joining an accelerometer having an undivided top surface and a bottom surface to an integrated circuit chip, wherein portions of the accelerometer move in response to acceleration, the accelerometer being joined to the integrated circuit by solder bumps which will conduct signals from capacitor plates on the bottom surface of the accelerometer to the integrated circuit, the method comprising:

aligning the accelerometer in such a manner so that the solder bumps come into electrical contact with the integrated circuit; and

sealing around edges of the accelerometer thereby holding the accelerometer in a fixed relationship to the integrated circuit while providing space between the accelerometer and the integrated circuit chip for the portion which moves to have an area in which it can move.

8. The method of claim 7 further including teh step of encapsulating the integrated circuit chip and the accelerometer.

9. A method of packaging an accelerometer in combination with an integrated circuit, comprising:

providing an accelerometer with an undivided first surface and a second surface having at least one solder bump on the second surface for making electrical contact to the accelerometer;

mounting the accelerometer on the integrated circuit chip in a manner so that the solder bump provides electrical contact between the second surface of the accelerometer and the integrated circuit chip;

sealing around the accelerometer; and

encapsulating the accelerometer and the integrated circuit chip.