RF amplifier assembly
First Claim
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1. An RF amplifier assembly comprising:
- a substrate having a radio frequency (RF) ground;
a semiconductor die having a surface attached to the RF ground, and also having a control electrode, a first current carrying electrode, and a second current carrying electrode;
a capacitor having a first surface mounted on the RF ground wherein the first surface of the capacitor electrically couples the capacitor to the RF ground;
a common node on the substrate;
a capacitor bonding wire having a first end connected to a second surface of the capacitor, and a second end connected to the common node;
a first bonding wire having a first end attached to the first current carrying electrode of the semiconductor die, and a second end attached to the RF ground wherein the first bonding wire forms an inductor having a predetermined inductance which inductively couples the RF ground to the first current carrying electrode of the semiconductor die; and
a plurality of second bonding wires which form an inductor having a predetermined inductance that inductively couples the second current carrying electrode of the semiconductor die to the common node by having a first end of the plurality of second bonding wires attached to the second current carrying electrode of the semiconductor die and a second end of the plurality of second bonding wires attached to the common node wherein the capacitor, the capacitor bonding wire, the first bonding wire, and the plurality of second bonding wires form a series resonant circuit that has a resonant frequency which is approximately twice a frequency that is applied to the control electrode of the semiconductor die.
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Abstract
A series resonant circuit (17, 16, 22, 21, 19) is employed to minimize the area utilized to form an RF amplifier (10). The series resonant circuit (17, 16, 22, 21, 19) utilizes a capacitor (21) along with inductors (17, 19, 22) that are formed by bonding wires (17, 19, 22) which interconnect the components of the amplifier (10). The series resonant circuit is tuned to the second harmonic of the fundamental frequency applied to the RF amplifier (10). The area consumed by the series resonant circuit (17, 16, 22, 21, 19) is small thereby minimizing the amplifier'"'"'s size.
54 Citations
19 Claims
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1. An RF amplifier assembly comprising:
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a substrate having a radio frequency (RF) ground; a semiconductor die having a surface attached to the RF ground, and also having a control electrode, a first current carrying electrode, and a second current carrying electrode; a capacitor having a first surface mounted on the RF ground wherein the first surface of the capacitor electrically couples the capacitor to the RF ground; a common node on the substrate; a capacitor bonding wire having a first end connected to a second surface of the capacitor, and a second end connected to the common node; a first bonding wire having a first end attached to the first current carrying electrode of the semiconductor die, and a second end attached to the RF ground wherein the first bonding wire forms an inductor having a predetermined inductance which inductively couples the RF ground to the first current carrying electrode of the semiconductor die; and a plurality of second bonding wires which form an inductor having a predetermined inductance that inductively couples the second current carrying electrode of the semiconductor die to the common node by having a first end of the plurality of second bonding wires attached to the second current carrying electrode of the semiconductor die and a second end of the plurality of second bonding wires attached to the common node wherein the capacitor, the capacitor bonding wire, the first bonding wire, and the plurality of second bonding wires form a series resonant circuit that has a resonant frequency which is approximately twice a frequency that is applied to the control electrode of the semiconductor die. - View Dependent Claims (2, 3, 4, 5)
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6. A method of forming a small RF amplifier comprising:
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providing a substrate having a semiconductor die attached to a portion of the substrate which forms a radio frequency (RF) ground, the substrate also having a common node; coupling a first inductor in series between a first current carrying electrode of the semiconductor die and the common node; coupling a second inductor in series with a capacitor wherein the second inductor and the capacitor are in series between the common node and the radio frequency (RF) ground; and coupling a third inductor between a second current carrying electrode of the semiconductor die and the radio frequency (RF) ground wherein the capacitor, the first inductor, the second inductor, and the third inductor form a series resonant circuit having a resonant frequency approximately twice a frequency applied to a control electrode of the semiconductor die. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13)
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14. A method of forming an RF amplifier comprising:
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inductively coupling a first current carrying electrode of a semiconductor die to a common node by using a first predetermined inductance; inductively coupling a first terminal of a capacitor to the common node by using a second predetermined inductance; and inductively coupling a second terminal of the capacitor to a second current carrying electrode of the semiconductor die by using a third predetermined inductance. - View Dependent Claims (15, 16, 17, 18, 19)
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Specification