Via resistors within-multi-layer, 3 dimensional structures substrates

• US 5,164,699 A
• Filed: 12/17/1990
• Issued: 11/17/1992
• Est. Priority Date: 12/17/1990
• Status: Expired due to Fees

• Current Assignee: Hughes Aircraft Company (Rtx Corporation)
• Original Assignee: Hughes Aircraft Company (Rtx Corporation)
• Inventors: McClanahan, Robert F., Brown, Raymond, Shapiro, Andrew A., Smith, Hal D.
• Primary Examiner(s): Lateef, Marvin M.
• Application Number:
  US07/628,813
• Time in Patent Office: 701 Days
• Field of Search: 338/310, 338/308, 338/314, 338/307
• US Class Current: 338/310
• CPC Class Codes: H01L 23/5384 Conductive vias through the substrate with or without pins, e.g. buried coaxial conductors H01L23/5383, H01L23/5385 take precedence; pins attached to insulating substrates H01L23/49811
• CPC Class Codes: H01L 23/647 Resistive arrangements H01L23/66, H01L23/62 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/09701 Low temperature co-fired ceramic [LTCC]
• CPC Class Codes: H05K 1/0306 Inorganic insulating substrates, e.g. ceramic, glass
• CPC Class Codes: H05K 1/092 Dispersed materials, e.g. conductive pastes or inks
• CPC Class Codes: H05K 1/167 incorporating printed resistors
• CPC Class Codes: H05K 2201/09563 Metal filled via
• CPC Class Codes: H05K 3/4053 by thick-film techniques
• CPC Class Codes: H05K 3/4611 by laminating two or more circuit boards H05K3/4652 takes precedence
• CPC Class Codes: H05K 3/4629 laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets

Abstract

Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.

Claims

1. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:

a plurality of resistive via fills in vias in respective adjacent insulating layers forming respective via resistors having precisely controlled resistance values;

a plurality of conductive means for electrically contacting predetermined tops and bottoms of the resistive via fills; and

electrical connection means for providing external electrical connection to selected ones of said conductive means at locations on the outside the unitized multilayer circuit structure.

2. The resistor structure of claim 1 wherein said conductive means comprises a conductive via fill or a conductive trace.

3. The resistor structure of claim 1 wherein said electrical connection means includes a conductive via fill which extends to the outside of the unitized multilayer circuit structure.

4. The resistor structure of claim 1 wherein said plurality of resistive via fills are configured to provide resistance values having predetermined ratios relative to each other.

5. The resistor structure of claim 4 wherein said ratios are controlled by the cross-sectional areas of said resistive via fills.

6. The resistor structure of claim 4 wherein said ratios are controlled by the characteristics of the material utilized for said resistive via fills.

7. The resistor structure of claim 4 wherein said ratios are controlled by the thicknesses of said resistive via fills.

8. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:

a resistive via fill formed in a via in one of the insulating layers and forming a via resistor having a precisely controlled resistance value; and

one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.

9. The resistor structure of claim 8 wherein said one or more thermally conductive via fills comprises one or more electrically conductive via fills.

10. The resistor structure of claim 8 wherein said one or more thermally conductive via fills comprises one or more metal matrix composite via inserts.

11. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:

a plurality of resistive via fills comprising the same via fill material formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined precisely controlled ratios; and

contact means electrically connected to the tops and bottoms of said plurality of resistive via fills.

12. The resistor structure of claim 11 further including for each of said resistive via fills one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure.

13. The resistor structure of claim 11 further including for each of said resistive via fills electrical connection means for allowing electrical connection to selected ones of said contact means from locations on the outside the unitized multilayer circuit structure.