Via resistors within-multi-layer, 3 dimensional structures substrates
First Claim
1. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:
- a plurality of resistive via fills in vias in respective adjacent insulating layers forming respective via resistors having precisely controlled resistance values;
a plurality of conductive means for electrically contacting predetermined tops and bottoms of the resistive via fills; and
electrical connection means for providing external electrical connection to selected ones of said conductive means at locations on the outside the unitized multilayer circuit structure.
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Accused Products
Abstract
Via resistor structures in a hybrid multilayer circuit having a plurality of insulating layers. One via resistor structure includes a plurality of resistive via fills in vias in respective adjacent insulating layers, a plurality of conductive elements for electrically contacting predetermined tops and bottoms of the resistive via fills, and conductive via fills for providing external electrical connection to selected ones of the conductive elements at locations on the outside the unitized multilayer circuit structure. A further via resistor structure includes a resistive via fill formed in a via in one of the insulating layers, and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. Another via resistor structure comprises ratioed via resistors comprising a plurality of resistive via fills formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined ratios.
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Citations
13 Claims
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1. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:
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a plurality of resistive via fills in vias in respective adjacent insulating layers forming respective via resistors having precisely controlled resistance values; a plurality of conductive means for electrically contacting predetermined tops and bottoms of the resistive via fills; and electrical connection means for providing external electrical connection to selected ones of said conductive means at locations on the outside the unitized multilayer circuit structure. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:
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a resistive via fill formed in a via in one of the insulating layers and forming a via resistor having a precisely controlled resistance value; and one or more thermally conductive via fills for thermally conducting heat from said resistive via fill to the outside of the unitized multilayer circuit structure. - View Dependent Claims (9, 10)
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11. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:
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a plurality of resistive via fills comprising the same via fill material formed in respective vias in one of the insulating layers, said vias having substantially the same thickness and having respective cross-sectional areas selected to provide resistance values having predetermined precisely controlled ratios; and contact means electrically connected to the tops and bottoms of said plurality of resistive via fills. - View Dependent Claims (12, 13)
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Specification