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Via resistors within-multi-layer, 3 dimensional structures substrates

  • US 5,164,699 A
  • Filed: 12/17/1990
  • Issued: 11/17/1992
  • Est. Priority Date: 12/17/1990
  • Status: Expired due to Fees
First Claim
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1. A resistor structure in a cofired unitized multilayer circuit structure having a plurality of insulating layers formed of insulating tape, comprising:

  • a plurality of resistive via fills in vias in respective adjacent insulating layers forming respective via resistors having precisely controlled resistance values;

    a plurality of conductive means for electrically contacting predetermined tops and bottoms of the resistive via fills; and

    electrical connection means for providing external electrical connection to selected ones of said conductive means at locations on the outside the unitized multilayer circuit structure.

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