Air manifold for cooling electronic devices

• US 5,166,775 A
• Filed: 03/05/1991
• Issued: 11/24/1992
• Est. Priority Date: 01/16/1990
• Status: Expired due to Term

• Current Assignee: Silicon Graphics International Corporation (Hewlett-Packard Enterprise Company)
• Original Assignee: CRAY Incorporated (Hewlett-Packard Enterprise Company)
• Inventors: Bartilson, Bradley W.
• Primary Examiner(s): Hille, Rolf
• Assistant Examiner(s): OSTROWSKI, DAVID M
• Application Number:
  US07/664,940
• Time in Patent Office: 630 Days
• Field of Search: 357/74, 357/80, 357/81, 357/82, 361/381, 361/382, 361/383, 361/384, 165/80.3
• US Class Current: 361/690
• CPC Class Codes: H01L 23/3677 Wire-like or pin-like cooling fins or heat sinks
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0201 Thermal arrangements, e.g. for cooling, heating or preventing overheating
• CPC Class Codes: H05K 1/182 associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]

Abstract

An air manifold mounted adjacent to a circuit board for directing air jets onto electronic devices mounted on the circuit board. The air manifold has an air inlet and a plurality of outlet nozzles positioned along the channel for directing air onto the electronic devices. A plurality of members are positioned next to the nozzles with the members increasing in length as the distance between the inlet and the outlets increase.

Claims

1. An apparatus to cool electronic devices, comprising:

(a) an air manifold adapted for mounting a printed circuit board adjacent thereto, said circuit board having electronic devices mounted thereon, said air manifold having at least one channel therein, said at least one channel having an inlet at a first end for accepting air therein;

(b) a plurality of nozzles positioned along said channel for expelling air therefrom to cool said electronic devices; and

(c) a plurality of members positioned with respect to said nozzles, said members increasing in length as the distance between the inlet and members increases, said members being positioned adjacent some of said plurality of nozzles, one member per nozzle, said member positioned between said inlet and said nozzle, said some of said plurality of nozzles located at a second end of said channel.