×

Enclosure for circuit modules

  • US 5,168,171 A
  • Filed: 03/04/1991
  • Issued: 12/01/1992
  • Est. Priority Date: 03/04/1991
  • Status: Expired due to Term
First Claim
Patent Images

1. An enclosure of a variety operationally retaining generally planar electronic modules, comprising:

  • a housing having front, side and rear portions;

    a back plane mounted rearwardly within said housing, having a plurality of spaced electrical connectors, each configured for receiving a said electronic module in a generally vertical orientation;

    an air intake formed within said housing;

    at least one fan mounted within said housing and energizable to draw air along a path extending from said air intake and in thermal exchange across the surfaces of said electronic modules;

    an air flow sensor mounted in said housing within said path at a location intercepting said air subsequent to its passing across said electronic modules and having a first output condition in the absence of an acceptable air flow thereacross;

    an air flow status indicator mounted at said housing front portion, responsive to input signals to provide a perceptible output representing the output condition of said air flow sensor; and

    control means responsive to said air flow sensor first output condition for deriving a said input signal to provide said perceptible output representing the absence of an acceptable air flow.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×