Air cooled heat exchanger for multi-chip assemblies

• US 5,168,919 A
• Filed: 06/29/1990
• Issued: 12/08/1992
• Est. Priority Date: 06/29/1990
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Development Company, L.P. (HP Inc.)
• Original Assignee: Digital Equipment Corporation (HP Inc.)
• Inventors: Bowman, John K., Berenholz, Jack
• Primary Examiner(s): DAVIS JR, ALBERT
• Application Number:
  US07/546,118
• Time in Patent Office: 893 Days
• Field of Search: 165/80.4, 165/104.33, 165/185, 165/803, 361/385, 361/386, 361/383
• US Class Current: 165/80.4
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 1/32 the means having portions engaging further tubular elements
• CPC Class Codes: F28F 3/048 in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

An air-cooled self-contained evaporator and condenser apparatus with no external power source, the apparatus including a cold plate having a first surface with recesses formed therein in a matrix or array corresponding to the matrix or array of chips on a multi-chip module or unit. The opposite surface of the cold plate includes a finned arrangement which, in conjunction with the cold plate, forms part of an isolated evaporation chamber of the cooling unit, with the chamber housing a boilable fluid which changes phase from liquid to vapor. Positioned above and contiguous with the isolated chamber is a condensing chamber, including a plurality of tubular passageways, the external portions of which are finned for ready removal of heat. For attachment of the cold plate portion of the unit to the chips, suitable heat transfer slugs, such as aluminum nitride slugs, are affixed in the recesses, with opposites surfaces thereof bonded to the exposed faces of the chips. Heat is transferred from the chips through the slugs, through the cold plate to cause boiling of the fluid within the chamber, the vapors of which are condensed in the upper part of the cooling unit to thus return as fluid to the chamber.

Claims

1. Apparatus for removing heat from at least one heat dissipating electronic component comprising:

heat transfer means having first and second opposed surfaces;

pocket means within said first surface, said pocket means having a floor and said walls that extend towards but not as far as said second surface;

at least one thermally conductive member attached to an external surface of said component in heat transfer relation therewith, said at least one thermally conductive member secured in said pocket means to mount said component to said heat transfer means in thermally coupled, electrically isolated therewith, said at least one thermally conductive member substantially filling said pocket means to provide low thermal resistance paths from said component to said floor and sidewalls of said pocket means;

chamber means including, as part thereof, at least a portion of said heat transfer means;

a boilable liquid within said chamber means, said liquid being separated from said at least one component and having the characteristic of boiling to generate vapors in response to transfer of heat from said at least one component to said liquid via said heat transfer means;

said heat transfer means further comprising a plurality of spaced apart heat transfer members protruding from said second surface into said boilable liquid to increase the heat transfer area of said heat transfer means; and

condensing means in fluid flow connection with said chamber means for enabling condensing of said vapor and gravity return of the condensed fluid to said chamber means.

2. The apparatus according to claim 1 wherein said chamber means and said condensing means are formed as a hermetically sealed unit with said boilable liquid therein.

3. The apparatus according to claim 1 wherein said heat transfer members a comprise fins and said second surface is provided by a plate shaped member forming one wall of said chamber means.

4. The apparatus according to claim 1 wherein said condensing means includes auxiliary heat transfer means on the exterior thereof for exposure to air circulation for enabling cooling of vapors within said condensing means.

5. Apparatus according to claim 1, wherein said at least one thermally conductive member comprises a thermally conductive, dielectric material.

6. Apparatus according to claim 5, wherein said thermally conductive, dielectric material comprises aluminum nitride.

7. Apparatus according to claim 1, wherein a surface coating of dielectric is interposed between said at least one thermally conductive member and said heat transfer means.

8. Apparatus for removing heat from a matrix array of heat dissipating semiconductor devices comprising:

a chamber including a heat transfer mounting surface external to said chamber, said heat transfer mounting surface having a like matrix of pockets formed therein, said pockets each having a floor and sidewalls that extend into said mounting surface;

thermally conductive substrate accommodated and secured in respective ones of said pockets, said semiconductor devices attached to said substrate to closely space said semiconductor devices from said heat transfer mounting surface, said thermally conductive substrates providing electrically isolated low thermal resistance paths between said semiconductor devices and said heat transfer mounting surface through said floors sand said side walls of said pockets;

a plurality of spaced apart heat transfer member extending into said chamber from the surface of said container opposite said heat transfer mounting surface;

a boilable coolant disposed in said chamber and completely covering said heat transfer fins; and

condenser means operatively communicating with said container means to receive said boilable coolant in a gaseous phase from said container means and to condense said boilable coolant from its gaseous phase into it liquid phase.

9. The apparatus according to claim 8 further including passage means for returning the liquid coolant by gravity from said condenser means to said chamber.

10. The apparatus according to claim 9 wherein said condenser means includes an interior chamber means, and said chamber means, said chamber and said passage means are formed as a hermetically sealed unit with said coolant therein.

11. The apparatus according to claim 10 wherein said condenser means includes passage means with external fins and wherein the external fins are exposed to air circulation.

12. The apparatus according to claim 8, wherein said heat transfer members comprise spaced apart fins.

13. Apparatus according to claim 8, wherein said thermally conductive members are comprised of dielectric material.

14. Apparatus according to claim 8, where said electronic devices comprise integrated circuit devices.

15. Apparatus according to claim 8, wherein said thermally conductive members comprise aluminum nitride members having flanges overlapping said first surface adjacent said pockets.

16. Apparatus according to claim 8, wherein a surface coating of dielectric is interposed between said at least one thermally conductive member and said heat transfer means.