Encapsulant compositions for use in signal transmission devices

• US 5,169,716 A
• Filed: 05/11/1989
• Issued: 12/08/1992
• Est. Priority Date: 03/09/1987
• Status: Expired due to Term

• Current Assignee: 3M Company
• Original Assignee: 3M Company
• Inventors: Haugen, Hartwick A., Croft, Thomas S.
• Primary Examiner(s): Ryan, Patrick J.
• Assistant Examiner(s): GRAY, JILL M
• Application Number:
  US07/350,467
• Time in Patent Office: 1,307 Days
• Field of Search: 428/379, 428/375, 523/173, 524/77, 524/322, 525/64, 525/74, 525/285, 174/107, 174/23 C, 350/96.24, 350/96.23
• US Class Current: 428/379
• CPC Class Codes: H01B 3/44 vinyl resins; acrylic resins silicones H01B3/46
• CPC Class Codes: Y10T 428/2933 Coated or with bond, impregnation or core
• CPC Class Codes: Y10T 428/294 including metal or compound thereof [excluding glass, ceramic and asbestos]
• CPC Class Codes: Y10T 428/2947 Synthetic resin or polymer in plural coatings, each of different type
• CPC Class Codes: Y10T 428/2964 Artificial fiber or filament

Abstract

The invention provides an encapsulant composition capable of use with signal transmission devices, such as electrical or optical cable. The composition is the extended reaction product of an admixture of an anhydride functionalized composition and a crosslinking agent.

Claims

1. A signal transmission component comprising:

a) a signal transmission device; and

b) a dielectric encapsulant which encapsulates said device, said encapsulant having a C-H adhesion value of at least 4.0 comprising;

the extended reaction product of an admixture of;

a) an effective amount of an anhydride functionalized compound having reactive anhydride sites; and

b) an effective amount of a crosslinking agent which reacts with the anhydride sites of said compound to form a cured crosslinked material;

said reaction product extended with at least one organic plasticizer present in the range of between 5 and 95 percent by weight of said encapsulant to form a plasticized system which is essentially inert to the reaction product and substantially non-exuding therefrom.

2. The component of claim 1 wherein said anhydride functionalized compound is a maleic anhydride functionalized vegetable oil.

3. The component of claim 1 wherein said anhydride functionalized compound comprises an anhydride functionalized polyolefin.

4. The component of claim 3 wherein said anhydride functionalized compound is a maleic anhydride functionalized polybutadiene.

5. The component of claim 1 wherein said at least one organic plasticizer is present in the range of between about 35 and 85 percent by weight of the encapsulant.

6. The component of claim 1 wherein said at least one organic plasticizer is selected from the group consisting of petroleum based hydrocarbon oils, vegetable oils, polyalphaolefins, cyclic polyolefins, pine oil derivatives, phosphate esters and mixtures thereof.

7. The component of claim 1 wherein said at least one organic plasticizer comprises a mixture of hydrocarbon oil and an ester.

8. The component of claim 7 wherein said at least one organic plasticizer comprises a vegetable oil.

9. The component of claim 1 wherein said encapsulant has a Polycarbonate Compatability Value of at least 80.

10. The component of claim 9 wherein said encapsulant has a Polycarbonate Compatability Value of at least 90.

11. The component of claim 1 further including an effective amount of a catalyst for the reaction between said anhydride functionalized compound and said crosslinking agent.

12. The component of claim 11 wherein said catalyst is a tertiary amine.

13. The component of claim 12 wherein said catalyst is selected from the group consisting of 1,8-diazabicyclo (5.4.0)-undec-7-ene and 1,5-diazabicyclo-(4.3.0)non-5-ene, tetradecyldimethylamine, and salts thereof.

14. The component of claim 1 wherein said crosslinking agent is selected from the group consisting of polyols, polyamines, and polythiols.

15. The component of claim 14 wherein said crosslinking agent is a polyol.

16. The component of claim 15 wherein said polyol is a ricinoleic acid derivative.

17. The component of claim 15 wherein said crosslinking agent is a polyalkadiene polyol.

18. The component of claim 17 wherein said crosslinking agent is a polybutadiene polyol.

19. The component of claim 1 wherein the solubility parameter of said encapsulant is between about 7.0 and 9.5.

20. The component of claim 19 wherein the total solubility parameter of said encapsulant is between about 7.9 and 9.5.

21. The component of claim 20 wherein the total solubility parameter of said encapsulant is between about 7.9 and 8.6.

22. The component of claim 21 wherein the total solubility parameter of said encapsulant is between about 8.0 and 9.3.

23. The component of claim 22 wherein said at least one organic plasticizer is present in the range of between about 50 and 70 percent by weight of the encapsulant.

24. The component of claim 1 wherein said device comprises an electrical or optical cable.

25. The component of claim 24 wherein said encapsulant is a pressure plug for said electrical or optical cable.

26. The component of claim 24 wherein said electrical or optical cable comprises a plurality of electrical or optical conductors.

27. The component of claim 26 wherein said plurality of electrical or optical conductors are surrounded by a grease.

28. The component of claim 27 wherein said encapsulant has a C-H adhesion value of at least 13.0.

29. The component of claim 28 wherein said encapsulant has a Polycarbonate Compatability Value of at least 90.

30. The component of claim 24 further including at least one connecting device.

31. The component of claim 30 wherein said connecting device comprises polycarbonate.

32. The component of claim 31 wherein said encapsulant has a Polycarbonate Compatibility Value of at least 80.

33. The component of claim 32 wherein said encapsulant has a Polycarbonate Compatibility Value of at least 90.

34. The component of claim 1 wherein said device comprises

a) an outer enclosure member;

b) at least one electrical or optical cable, including at least one conductor; and

c) at least one connecting device located inside said outer enclosure member and joining said at least one conductor;

wherein said encapsulant substantially fills said enclosure member, encapsulating said at least one connecting device.