High mix printed circuit assembly technique

• US 5,170,554 A
• Filed: 09/28/1990
• Issued: 12/15/1992
• Est. Priority Date: 09/28/1990
• Status: Expired due to Term

• Current Assignee: Hewlett-Packard Company (HP Inc.)
• Original Assignee: Hewlett-Packard Company (HP Inc.)
• Inventors: Davis, Thomas C., Selep, Eva M.
• Primary Examiner(s): Arbes, Carl J.
• Application Number:
  US07/589,748
• Time in Patent Office: 809 Days
• Field of Search: 414/786, 414/223, 414/224, 29/740, 29/832, 364/468, 364/469, 364/480, 901/6
• US Class Current: 29/832
• CPC Class Codes: H05K 13/085 Production planning, e.g. of allocation of products to machines, of mounting sequences at machine or facility level
• CPC Class Codes: H05K 13/087 Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A technique for efficient use of component placement apparatus used for assembling many different printed circuit boards, wherein all of the printed circuit boards are collectively comprised of more parts than can be handled by a single setup. A portion of the apparatus is dedicated to producing a first family of boards whose identity is determined by their high volume as well as by their parts overlap, while another portion is periodically changed in order to optionally produce different families of boards characterized by their lower volume and lower parts overlap. The changed setups required for the different families of boards are accomplished off-line while the first family of boards is in on-line production.

Claims

1. A method of assembling components on multiple circuit board assemblies which collectively have a greater number of different components than can be accommodated at the same time by production apparatus, including the steps of:

choosing a first family of circuit board assemblies based on the volume for such assemblies and the amount of component overlap between such assemblies;

setting up the production apparatus by loading the components of such first family resulting from said choosing step into a portion of the production apparatus;

running the production apparatus in a first mode to place the components of such first family into installation position;

selecting a second family of circuit board assemblies;

additionally setting up the production apparatus by loading components of such second family into another portion of the production apparatus; and

running the production apparatus in a second mode to place the components of such second family into installation position.

2. The method of claim 1 wherein said choosing step is based on the ratio of parts-to-volume for a particular circuit board assembly.

3. The method of claim 1 wherein said selecting step is based on the ratio of parts-to-volume for a particular circuit board assembly.

4. The method of claim 1 wherein said running steps include running two separate production apparatus apparatus in series.

5. The method of claim 4 wherein each of said two separate production apparatus used in said running steps includes some of the same components.

6. The method of claim 1 which further includes visually coding those components resulting from said choosing step.

7. The method of claim 1 which further includes visually coding those components resulting from said selecting step.

8. The method of claim 1 which further includes selecting and additionally setting up during said running in the first mode.